Renesas R5F563NYDGFB#V0

Overview

R5F563NYDGFB#V0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller with integrated Ethernet MAC, full-speed USB 2.0 host/function/OTG, CAN, 12-bit and 10-bit A/D converters, 10-bit D/A converters, RTC, and AES encryption. It features 1 MB on-chip flash, 256 KB SRAM, and 32 KB data flash, operating from 2.7–3.6 V at –40 to +85°C in a 144-pin LQFP package. It targets industrial networking gateways requiring deterministic real-time control and secure connectivity.

For engineers reviewing the R5F563NYDGFB#V0 datasheet, R5F563NYDGFB#V0 pinout, R5F563NYDGFB#V0 application, or R5F563NYDGFB#V0 equivalent, key selection criteria include Ethernet MAC support (vs. RX631), 144-pin LQFP footprint compatibility, 1 MB flash / 256 KB RAM allocation, IEEE 802.3 10/100 Mbps MII/RMII interface, and IEC60730 safety feature set including CRC, IWDT, and self-diagnostic A/D.

Technical Context

The R5F563NYDGFB#V0 implements the RXv1 core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling 165 DMIPS at 100 MHz. It integrates a dedicated Ethernet DMA controller (EDMAC) with 2 KB TX/RX FIFOs and supports MII/RMII physical layer interfaces per IEEE 802.3u.

Its peripheral set includes three CAN modules (ISO 11898-1 compliant, 32 mailboxes each), four RIIC interfaces (up to 1 Mbps), thirteen SCIs with flexible mode selection (asynchronous, SPI/I²C emulation), and dual A/D subsystems: one 12-bit unit (21 channels, 1 µs conversion @ 50 MHz PCLK) and one 10-bit unit (8 channels).

Key Specifications

Pinout & Package

Package: PLQP0144KA-A - 144-pin LQFP, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad (non-electrical), RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NYDGFB#V0, R5F563NWHDFB removes Ethernet functionality to reduce cost and power, while R5F563NYDDFB maintains identical performance and peripherals but alters debug interface support-neither offers pin-to-pin replacement without verifying emulator compatibility and Ethernet dependency.

Availability

R5F563NYDGFB#V0 is available at Aetrix Electronics and suitable for industrial networking gateways, secure PLC communication modules, HMI controllers, and building automation gateways requiring stable component supply and long-term lifecycle assurance.

Supply support for R5F563NYDGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group, including R5F563NYDGFB#V0, was designed for industrial automation and networked embedded systems requiring real-time determinism, functional safety, and multi-protocol connectivity-including Ethernet, USB, CAN, and IEC60730 compliance.

FAQ

What is the maximum operating frequency and core architecture of the R5F563NYDGFB#V0?

The R5F563NYDGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RXv1 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution critical for industrial control loops and protocol stack timing in the R5F563NYDGFB#V0.

Does the R5F563NYDGFB#V0 support Ethernet, and what physical layer interfaces does it implement?

Yes, the R5F563NYDGFB#V0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 Mbps and 100 Mbps operation. It implements MII (Media Independent Interface) and RMII (Reduced MII) physical layer interfaces, allowing direct connection to external PHYs. The dedicated EDMAC with 2 KB TX/RX FIFOs handles frame transfers with minimal CPU intervention-core to the R5F563NYDGFB#V0's role in industrial gateways.

How much on-chip memory does the R5F563NYDGFB#V0 provide, and what are its access characteristics?

The R5F563NYDGFB#V0 includes 1 MB of on-chip flash memory (accessible at 100 MHz with zero wait states), 256 KB of SRAM (also zero-wait at 100 MHz), and 32 KB of data flash rated for 100,000 erase/write cycles. Flash supports on-board programming and background operations, enabling live firmware updates without halting execution-a key reliability feature of the R5F563NYDGFB#V0 in mission-critical deployments.

What safety and security features are integrated into the R5F563NYDGFB#V0?

The R5F563NYDGFB#V0 integrates hardware-based IEC60730 compliance features including CRC calculation (with three selectable polynomials), independent watchdog timer (IWDT) with dedicated oscillator, oscillation-stop detection, and self-diagnostic A/D converter functions. It also includes a Data Encryption Unit (DEU) supporting AES-128/192/256 in ECB and CBC modes-making the R5F563NYDGFB#V0 suitable for secure industrial edge nodes requiring certified functional safety and data confidentiality.

Which package type and pin count does the R5F563NYDGFB#V0 use, and what are its thermal characteristics?

The R5F563NYDGFB#V0 uses the PLQP0144KA-A package: a 144-pin LQFP with 20 × 20 mm body size and 0.5 mm pitch. It features an exposed thermal pad (non-electrical) for enhanced heat dissipation. Rated for –40 to +85°C operation and powered from a single 2.7–3.6 V supply, this package balances board space efficiency, manufacturability, and thermal performance in the R5F563NYDGFB#V0's target industrial applications.