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Renesas R5F563NYDGFP#H0
- Part No.:
- R5F563NYDGFP#H0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F563NYDGFP#H0.pdf
- Description:
- 32BIT MCU RX63N
- Quantity:
- Payment:
- Shipping:
Inventory:1,801
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Product details
Overview
R5F563NYDGFP#H0 from Renesas is a 100 MHz 32-bit RXv1 CPU-based microcontroller in the RX63N Group, featuring integrated Ethernet MAC (10/100 Mbps), full-speed USB 2.0 host/function/OTG, three CAN channels, 12-bit and 10-bit A/D converters (21 + 8 channels), dual 10-bit D/A outputs, hardware AES encryption (DEU), and 1 MB on-chip flash with 256 KB SRAM - designed for industrial networking gateways requiring deterministic real-time control and secure connectivity.
For engineers reviewing the R5F563NYDGFP#H0 datasheet, R5F563NYDGFP#H0 pinout, R5F563NYDGFP#H0 application, or R5F563NYDGFP#H0 equivalent, this MCU delivers verified IEEE 802.3-compliant Ethernet, IEC60730 safety support (CRC, self-diagnostic A/D, oscillation detection), and dual-voltage operation (2.7–3.6 V core, 2.3 V RTC backup) - critical for embedded gateway, PLC, and HMI designs where mixed-signal integration, security, and protocol stack offload matter.
Technical Context
The R5F563NYDGFP#H0 implements the RXv1 32-bit CISC Harvard architecture with 5-stage pipeline, supporting 165 DMIPS at 100 MHz and single-precision IEEE-754 floating-point arithmetic. Its memory subsystem includes zero-wait-state 100 MHz flash (1 MB), 256 KB SRAM, and 32 KB reprogrammable data flash (100k cycles).
It integrates dedicated peripherals for industrial communication: Ethernet MAC with MII/RMII interface and EDMAC DMA engine, triple CAN modules (ISO 11898-1, 32 mailboxes each), and 13 SCI channels configurable as UART, SPI, I²C, or LIN - all synchronized to independent clock domains (ICLK up to 100 MHz, PCLK up to 50 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv1 32-bit CISC Harvard, 100 MHz max, 165 DMIPS, IEEE-754 FPU, MPU support |
| Memory | 1 MB flash (no wait states @100 MHz), 256 KB SRAM, 32 KB data flash (100k erase cycles) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), USB 2.0 full-speed host/function/OTG, 3× CAN, 13× SCI, 4× I²C (1× FM+), 3× RSPI |
| Analog Peripherals | 21-channel 12-bit A/D (1 µs conversion), 8-channel 10-bit A/D, 2× 10-bit D/A, on-die temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256 (ECB/CBC), CRC calculator, IWDT, oscillation-stop detection, A/D self-diagnostic |
| Package & Environment | LQFP-100 (PLQP0100KB-A, 14 × 14 mm, 0.5 mm pitch), -40 to +85°C operating range (D version) |
Pinout & Package
Package: PLQP0100KB-A, 100-pin LQFP (14 × 14 mm, 0.5 mm pitch), lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power pins; supports separate AVCC0 and VREFH routing for precision ADC/DAC |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 4–16 MHz external crystal; enables PLL-based 100 MHz system clock generation |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register access and configuration |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet data lanes | MII interface signals; RMII mode uses subset (TXD0/1, RXD0/1, TX_EN, CRS_DV, REF_CLK) |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 physical interface | Full-speed (12 Mbps) transceiver with internal pull-up; supports host/device/OTG via software configuration |
| CAN0_TX / CAN0_RX | Channel 0 CAN transceiver I/O | Differential signaling pair compliant with ISO 11898-1; supports standard/extended frames and 32-mailbox FIFO |
Key Features
| Feature | Design Value |
|---|---|
| Ethernet MAC + EDMAC | Offloads frame processing via descriptor-based DMA; 2 KB TX/RX FIFO reduces CPU interrupt load in high-throughput gateway applications |
| IEC60730 Safety Support | Integrated hardware features - CRC calculator, oscillation-stop detection, A/D self-test, IWDT - enable Class B compliance without external components |
| Flexible Clock System | Independent programmable dividers for ICLK (CPU), PCLK (peripherals), FCLK (flash), and BCLK (external bus) enable precise power/performance tuning |
| Multi-Protocol Serial Engine | 13 SCI modules support UART, SPI, I²C, smart-card, and LIN protocols on shared pins - simplifies board layout for multi-interface HMI designs |
| Hardware AES Encryption | Accelerates secure firmware updates and TLS handshake operations; supports ECB/CBC modes with 128/192/256-bit keys - no software crypto overhead |
Applications
| Industrial Ethernet Gateway | Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, EtherNet/IP, and PROFINET fieldbus data into a unified cloud-connected edge node. IC Role / Device Role / Timing Role: Central real-time controller executing protocol stacks, managing Ethernet/USB/CAN coexistence, and performing deterministic I/O scanning. Use Value: Integrated Ethernet MAC + triple CAN eliminates external PHY and bus controllers; 100 MHz RX core ensures sub-millisecond cycle times for motion control loops. |
Use Scenario: Compact DIN-rail mounted PLC handling analog sensor inputs, PWM motor outputs, and HMI communication over USB or Ethernet. IC Role / Device Role / Timing Role: Main system-on-chip providing A/D acquisition, D/A actuation, real-time task scheduling, and secure firmware update via USB/OTA. Use Value: On-chip 21-channel 12-bit A/D and dual 10-bit D/A eliminate external signal conditioning ICs; AES DEU enables encrypted firmware validation. |
| HMI Controller with Secure Boot | Building Automation Controller |
|
Use Scenario: Touchscreen HMI running Linux or RTOS with secure boot, local storage, and remote diagnostics via Ethernet/Wi-Fi bridge. IC Role / Device Role / Timing Role: Trusted execution environment anchor with hardware root-of-trust (AES, CRC, IWDT), USB OTG for field service, and RTC for time-stamped logs. Use Value: Unique ID + AES key management enables device identity binding; 256 KB SRAM supports dual-bank OTA update without external RAM. |
Use Scenario: BACnet MS/TP or KNX-over-IP controller managing HVAC, lighting, and access systems in commercial buildings. IC Role / Device Role / Timing Role: Protocol gateway bridging legacy BACnet MSTP (via SCI) and modern IP networks (Ethernet/USB), with temperature-compensated sensor fusion. Use Value: Integrated temperature sensor ±1°C accuracy enables on-chip thermal derating; 4× I²C interfaces simplify connection to environmental sensors and display drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F563NEDDFP | Same package (LQFP-100), 2 MB flash, 256 KB SRAM, identical peripheral set | Higher flash capacity supports larger protocol stacks (e.g., full TCP/IP + TLS) and dual-application images | Select when firmware size exceeds 1 MB or field-upgrade redundancy is required |
| R5F563NBCDFP | Same package, 1 MB flash, 128 KB SRAM, otherwise identical feature set | Reduced SRAM limits concurrent Ethernet + USB + CAN buffer allocation; suitable for cost-sensitive single-protocol nodes | Choose for budget-constrained building controllers where only one major interface is active at a time |
Compared with R5F563NYDGFP#H0, R5F563NEDDFP offers headroom for complex networking stacks, while R5F563NBCDFP trades SRAM for lower BOM cost - making the R5F563NYDGFP#H0 the optimal balance of memory, security, and industrial interface density for mid-tier gateways.
Availability
R5F563NYDGFP#H0 is available at Aetrix Electronics and suitable for industrial networking gateways, PLCs, HMIs, and building automation controllers requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for R5F563NYDGFP#H0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX63N Group - including R5F563NYDGFP#H0 - was engineered for industrial connectivity applications demanding real-time determinism, functional safety (IEC60730), and integrated Ethernet/USB/CAN without external glue logic.
FAQ
What is the maximum operating frequency and CPU performance of the R5F563NYDGFP#H0?
The R5F563NYDGFP#H0 operates at a maximum frequency of 100 MHz and delivers 165 DMIPS using the RXv1 32-bit CPU core. It includes a single-precision IEEE-754 floating-point unit and hardware multiplier/divider, enabling efficient real-time math for motion control and sensor fusion algorithms within the R5F563NYDGFP#H0.
Does the R5F563NYDGFP#H0 support Ethernet connectivity, and what interface standards does it implement?
Yes, the R5F563NYDGFP#H0 integrates a full IEEE 802.3-compliant Ethernet MAC supporting both 10 and 100 Mbps speeds in full- and half-duplex modes. It implements MII and RMII physical layer interfaces and includes a dedicated EDMAC controller with 2 KB TX/RX FIFOs - all confirmed in the R5F563NYDGFP#H0 datasheet Rev.1.80.
What analog peripherals are included in the R5F563NYDGFP#H0, and what are their resolution and channel counts?
The R5F563NYDGFP#H0 includes a 21-channel 12-bit A/D converter (S12ADa) with 1.0 µs conversion time, an 8-channel 10-bit A/D converter (ADb), two 10-bit D/A channels (DAa), and an on-die temperature sensor accurate to ±1°C. These are fully documented in the R5F563NYDGFP#H0 specification tables and used for precision sensor interfacing and actuator control.
Is the R5F563NYDGFP#H0 suitable for IEC60730 Class B safety-critical applications?
Yes, the R5F563NYDGFP#H0 includes hardware features required for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator, independent watchdog timer (IWDT), self-diagnostic A/D functionality, and clock frequency monitoring - all explicitly listed in the R5F563NYDGFP#H0 datasheet as part of its safety support suite.
What package type and pin count does the R5F563NYDGFP#H0 use, and is it RoHS compliant?
The R5F563NYDGFP#H0 uses the PLQP0100KB-A package: a 100-pin LQFP measuring 14 × 14 mm with 0.5 mm pitch. It is lead-free and RoHS compliant, as specified in Renesas documentation and confirmed by the part number suffix "#H0", which denotes halogen-free and green packaging per R5F563NYDGFP#H0 product marking standards.
R5F563NYDGFP#H0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX63N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RX
- Core Size:
- 32-Bit
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b, 14x12b; D/A 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F563NYDGFP#H0 FAQ
1.How can I place an order for R5F563NYDGFP#H0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F563NYDGFP#H0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F563NYDGFP#H0 reliable?
The price and inventory of R5F563NYDGFP#H0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F563NYDGFP#H0 is usually 5 days.
3.What payment methods are accepted for R5F563NYDGFP#H0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F563NYDGFP#H0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F563NYDGFP#H0?
R5F563NYDGFP#H0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F563NYDGFP#H0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F563NYDGFP#H0?
For technical support, including R5F563NYDGFP#H0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F563NYDGFP#H0 requirements.
6.How does Aetrix verify that R5F563NYDGFP#H0 is sourced from the original manufacturer or authorized distributors?
All R5F563NYDGFP#H0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F563NYDGFP#H0 meets industry standards.
7.What is the process for return or replacement of R5F563NYDGFP#H0?
All R5F563NYDGFP#H0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F563NYDGFP#H0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F563NYDGFP#H0 part is unused and in its original packaging.
Return procedure for R5F563NYDGFP#H0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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