Renesas R5F563NYHGFB#V0

Overview

R5F563NYHGFB#V0 from Renesas is a 100 MHz 32-bit RX63N Group microcontroller with integrated Ethernet MAC, single-precision FPU, 165 DMIPS performance, 1 MB on-chip flash, 256 KB SRAM, and 32 KB data flash. It supports IEEE 802.3 10/100 Mbps Ethernet, full-speed USB 2.0 host/function/OTG, three CAN channels, and 12-bit/10-bit A/D converters - deployed in industrial gateways requiring real-time protocol bridging and secure local network edge control.

For engineers reviewing the R5F563NYHGFB#V0 datasheet, R5F563NYHGFB#V0 pinout, R5F563NYHGFB#V0 application, or R5F563NYHGFB#V0 equivalent, key selection criteria include Ethernet MAC + USB OTG coexistence, 256 KB SRAM for protocol stack buffering, 1 MB flash for dual-bank firmware updates, -40°C to +85°C operation, and LQFP-176 package compatibility with industrial PCB layout constraints.

Technical Context

The R5F563NYHGFB#V0 implements the 32-bit RX CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions - enabling ultra-compact code density and deterministic interrupt latency. It integrates dedicated hardware accelerators including a DMA controller (4 channels), EXDMA (2 channels), DTC, and EDMAC for Ethernet offload.

Its clock system combines external crystal oscillator support (4–16 MHz), internal PLL, 50-MHz HOCO, and 125-kHz LOCO - with independent frequency division for ICLK (up to 100 MHz), PCLK (up to 50 MHz), FCLK (up to 50 MHz), and BCLK (up to 50 MHz). The MCU includes MPU, CRC calculator, AES-128/192/256 DEU, and IEC60730 safety functions.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin LQFP, 24 × 24 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F563NYHGFB#V0, R5F563NJHDFC offers greater firmware headroom while maintaining identical real-time performance and security features; R5F563NYHDFB trades I/O and bus flexibility for smaller board area - making it suitable for volume HMI deployments where Ethernet+USB functionality remains central.

Availability

R5F563NYHGFB#V0 is available at Aetrix Electronics and suitable for industrial gateways, secure PLC modules, HMI controllers, and building automation edge nodes requiring stable component supply across multi-year production cycles.

Supply support for R5F563NYHGFB#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX63N Group, including R5F563NYHGFB#V0, was designed for real-time industrial networking applications demanding integrated Ethernet, USB, CAN, and functional safety - targeting gateway, control, and edge intelligence roles in harsh environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F563NYHGFB#V0?

The R5F563NYHGFB#V0 operates at a maximum frequency of 100 MHz using the 32-bit RX CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 165 DMIPS performance and includes single-precision IEEE-754 floating-point unit, two multiply-accumulate units, and 32-bit multiplier with one-cycle execution. This architecture enables deterministic real-time response in industrial control and networking applications where R5F563NYHGFB#V0 serves as the primary processing engine.

Does the R5F563NYHGFB#V0 support Ethernet and USB simultaneously, and what interfaces are provided?

Yes, the R5F563NYHGFB#V0 integrates both Ethernet MAC (IEEE 802.3 10/100 Mbps) and full-speed USB 2.0 host/function/OTG in a single chip. It supports MII or RMII for Ethernet and includes dedicated USB_VBUS, USB_ID, USB_DP, and USB_DM pins. The R5F563NYHGFB#V0 also provides separate DMA channels (EDMAC for Ethernet, DTC/DMAC for USB) to prevent bus contention - enabling concurrent protocol stack operation without CPU bottleneck, a key capability for industrial gateway use cases involving R5F563NYHGFB#V0.

What memory resources are available on the R5F563NYHGFB#V0, and how are they utilized in firmware design?

The R5F563NYHGFB#V0 includes 1 MB on-chip flash (no wait states at 100 MHz), 256 KB SRAM, and 32 KB reprogrammable data flash. The flash supports background programming and dual-bank operation for safe firmware updates; SRAM is used for real-time stack, protocol buffers, and heap allocation; data flash stores calibration data and configuration parameters. In practice, this memory configuration allows R5F563NYHGFB#V0-based designs to run FreeRTOS with lwIP TCP/IP stack, USB device descriptors, and CANopen object dictionary entirely from on-chip resources - eliminating external memory dependencies.

How does the R5F563NYHGFB#V0 support functional safety standards like IEC60730?

The R5F563NYHGFB#V0 includes hardware features required for Class B compliance under IEC60730: oscillation-stop detection for main/subclocks, built-in CRC calculator for memory/data integrity, independent watchdog timer (IWDT) with dedicated LOCO clock, self-diagnostic routines for the 10-bit A/D converter, and memory protection unit (MPU) for runtime privilege enforcement. These capabilities are documented in Renesas' IEC60730 compliance guide for the RX63N Group and directly implemented in R5F563NYHGFB#V0 silicon - reducing software certification effort for safety-critical industrial control applications.

What is the package type and thermal specification of the R5F563NYHGFB#V0?

The R5F563NYHGFB#V0 is packaged in a 176-pin LQFP (PLQP0176KB-A) with 24 × 24 mm body size, 0.5 mm pitch, and exposed thermal pad. It is rated for industrial temperature range of -40°C to +85°C (D version), with power supply voltage of 2.7–3.6 V. The package supports standard reflow soldering profiles and provides 133 general-purpose I/O pins - 18 of which are 5-V tolerant - making R5F563NYHGFB#V0 suitable for mixed-voltage industrial PCB designs requiring robust thermal performance and long-term reliability.