Renesas R5F564MJDDLC#21

Overview

R5F564MJDDLC#21 from Renesas is a 120-MHz 32-bit RXv2 microcontroller with integrated FPU, 4 MB code flash, 512 KB SRAM, IEEE 1588-compliant dual Ethernet MAC, full-speed USB 2.0 with battery charging, CAN (3 channels), and 12-bit A/D (29 total channels). It targets industrial automation controllers requiring deterministic real-time I/O, secure firmware updates, and multi-protocol connectivity.

For engineers reviewing the R5F564MJDDLC#21 datasheet, R5F564MJDDLC#21 pinout, R5F564MJDDLC#21 application, or R5F564MJDDLC#21 equivalent, key selection criteria include its 177-pin TFLGA package, dual Ethernet + PTP timing accuracy, on-chip AES/SHA encryption, and support for IEC60730 Class B functional safety compliance via built-in self-test features.

Technical Context

The R5F564MJDDLC#21 implements the RXv2 CPU core with 240 DMIPS at 120 MHz, single-precision IEEE-754 FPU, and dual multiply-accumulate units. Its memory subsystem includes 4 MB zero-wait-state flash, 512 KB SRAM, 64 KB data flash rated for 100,000 erase/write cycles, and 32 KB ECC-protected RAM.

Peripheral architecture integrates dual ETHERC modules with EPTPC (IEEE 1588 v2) and EDMAC (3-channel DMA), USBA with 8.5 KB buffer supporting battery charging, three CAN controllers (32 mailboxes each), and two independent 12-bit A/D converters - one with 8 channels and self-diagnostic capability, the other with 21 channels and analog input disconnection detection.

Key Specifications

Pinout & Package

Package: TFLGA-177 (8 mm × 8 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F564MJDDLC#21, the R5F565NEBDFP#30 reduces footprint and cost by removing Ethernet and increasing QSPI/SDHI focus, while the R5F572MHDDFC#30 trades dual Ethernet for higher clock speed and graphics capability-making R5F564MJDDLC#21 uniquely balanced for dual-network industrial edge nodes requiring both precision timing and secure USB peripheral support.

Availability

R5F564MJDDLC#21 is available at Aetrix Electronics and suitable for industrial automation controllers, energy gateways, building management systems, and medical infusion pumps requiring stable component supply across long production lifecycles.

Supply support for R5F564MJDDLC#21 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX64M Group-including R5F564MJDDLC#21-is designed for high-performance industrial applications demanding real-time determinism, functional safety, multi-protocol connectivity, and secure firmware execution in harsh environments.

FAQ

What is the maximum operating frequency and performance rating of the R5F564MJDDLC#21?

The R5F564MJDDLC#21 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance. Its RXv2 CPU core includes a single-precision IEEE-754 floating-point unit and dual multiply-accumulate units, enabling efficient execution of control algorithms and signal processing tasks in real-time industrial applications. The R5F564MJDDLC#21 achieves this performance with zero-wait-state access to its 4 MB on-chip flash and 512 KB SRAM.

Does the R5F564MJDDLC#21 support IEEE 1588 Precision Time Protocol, and how is it implemented?

Yes, the R5F564MJDDLC#21 supports IEEE 1588-2008 (v2) through its dedicated EPTPC (Precision Time Protocol Controller) block, tightly coupled to both Ethernet MACs. Hardware timestamping occurs at the PHY interface with sub-microsecond resolution, and the EPTPC handles frame parsing, correction field calculation, and clock synchronization without CPU intervention. This implementation enables the R5F564MJDDLC#21 to serve as a transparent clock or boundary clock in industrial Ethernet networks requiring deterministic timing.

What security features does the R5F564MJDDLC#21 provide for firmware protection and secure communication?

The R5F564MJDDLC#21 integrates AES-128/192/256, DES/TDES, and SHA-1/224/256 cryptographic accelerators, plus a Trusted Memory (TM) function that prevents read-out of flash blocks 8 and 9. These features enable secure boot verification, encrypted firmware updates, and TLS offloading. Additionally, the R5F564MJDDLC#21 supports register write protection, oscillation-stop detection, and CRC calculation-collectively satisfying IEC60730 Class B requirements for functional safety without external components.

How many analog-to-digital converter channels does the R5F564MJDDLC#21 have, and what diagnostic capabilities are included?

The R5F564MJDDLC#21 includes two independent 12-bit A/D converters: S12AD0 with 8 channels and S12AD1 with 21 channels. Both support 8-/10-/12-bit resolution modes and feature self-diagnostic functions that internally generate reference voltages (VREFL0/VREFH0 or AVSS1/AVCC1) to verify ADC linearity and offset. S12AD1 additionally provides analog input disconnection detection, ensuring sensor fault awareness critical for industrial and medical applications using the R5F564MJDDLC#21.

What is the package type and pin count of the R5F564MJDDLC#21, and which peripherals are accessible in this variant?

The R5F564MJDDLC#21 uses a 177-pin TFLGA package (8 mm × 8 mm, 0.5 mm pitch) with 127 general-purpose I/O pins-19 of which are 5-V tolerant. This package enables full access to all RX64M Group features: dual IEEE 1588 Ethernet MACs, USBA with battery charging, three CAN controllers, nine SCI channels, four SCIFA interfaces, two RIIC buses, QSPI, SDHI, and both 12-bit A/D units. The R5F564MJDDLC#21's pinout is optimized for compact industrial PCB layouts requiring high peripheral density and thermal efficiency.