Renesas R5F56514AGFP#30

Overview

R5F56514AGFP#30 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 1.5 MB on-chip code flash memory, 640 KB SRAM (including 384 KB expansion RAM), and dual-bank flash for background programming. It integrates Ethernet MAC, CAN 2.0B (2 channels), SD host/slave interfaces, QSPI, GLCDC, DRW2D, and hardware AES-128/192/256 for industrial HMI and networked edge devices.

For engineers reviewing the R5F56514AGFP#30 datasheet, R5F56514AGFP#30 pinout, R5F56514AGFP#30 application, or R5F56514AGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +85°C temperature grade, 2.7–3.6 V supply range, 0.19 mA/MHz active power consumption, and IEC60730-compliant safety features including MPU, TSIP, CRC, and self-diagnostic A/D.

Technical Context

The R5F56514AGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It supports little-endian or big-endian data arrangement and includes two multiply-and-accumulate units, a 32-bit multiplier (1-cycle), and divider (2-cycle).

Clock subsystem includes main crystal oscillator (8–24 MHz), internal HOCO (16/18/20 MHz), LOCO (240 kHz), and PLL for 120 MHz ICLK; peripheral clocks are independently configurable-PCLKA up to 120 MHz (for ETHERC, AES, GLCDC), PCLKB up to 60 MHz (for TMR, CMT, S12AD unit 0), and PCLKD up to 60 MHz (for S12AD unit 1).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56514AGFP#30, R5F5651EDFP#30 offers expanded flash capacity without altering footprint or peripheral availability, while R5F566TEBDFP#30 trades graphics and networking capability for superior motor-control timing precision and higher CPU throughput-making them complementary rather than drop-in replacements.

Availability

R5F56514AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart gateways, networked energy meters, and factory automation controllers requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for R5F56514AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group-including R5F56514AGFP#30-is designed for high-integration industrial applications demanding rich connectivity (Ethernet/CAN/SD), graphics capability (GLCDC/DRW2D), and functional safety compliance (IEC60730) in a single chip.

FAQ

What is the maximum operating frequency and core type of the R5F56514AGFP#30?

The R5F56514AGFP#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, achieving 240 DMIPS performance. Its Harvard architecture includes a 5-stage pipeline and variable-length instruction set. The core supports single-precision IEEE-754 floating-point operations, two multiply-and-accumulate units, and a 32-bit hardware multiplier with one-cycle execution. This specification is confirmed in Renesas datasheet R01DS0276EJ0240 Rev.2.40.

Does the R5F56514AGFP#30 include hardware encryption and safety features for industrial certification?

Yes, the R5F56514AGFP#30 integrates AES-128/192/256 encryption engines, Trusted Secure IP (TSIP), Memory Protection Unit (MPU) with eight configurable regions, CRC calculator supporting multiple polynomials, and register write protection. These features directly support IEC60730 Class B compliance, enabling self-test, fault detection, and secure boot without external components. All are documented in Section 1.1 and Chapter 27 of the official R01DS0276EJ0240 datasheet.

What package type and pin count does the R5F56514AGFP#30 use?

The R5F56514AGFP#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It supports 136 general-purpose I/O pins, 19 of which are 5-V tolerant. This package variant is explicitly listed in Table 1.2 of the RX65N Group datasheet R01DS0276EJ0240 and matches the "GFP" suffix designation in the part number.

Which communication interfaces are integrated into the R5F56514AGFP#30?

The R5F56514AGFP#30 integrates Ethernet MAC (10/100 Mbps MII/RMII), dual CAN 2.0B channels (32 mailboxes each), 13 SCI channels (asynchronous/clock-sync/smart-card/I²C/SPI modes), 3 I²C interfaces (up to 1 Mbps), 3 RSPI ports, 1 QSPI port, SD host/slave interfaces, MMCIF, and USB 2.0 FS host/function with OTG. These are fully detailed in Sections 1.1 and 2.3 of Renesas datasheet R01DS0276EJ0240.

How much on-chip memory does the R5F56514AGFP#30 provide, and what are its access characteristics?

The R5F56514AGFP#30 provides 1.5 MB of on-chip code flash memory with dual-bank structure, 32 KB of reprogrammable data flash (100,000 write cycles), 640 KB of SRAM (256 KB base + 384 KB expansion RAM), and 8 KB of standby RAM. Flash access requires zero wait states up to 50 MHz or on cache hit at 120 MHz; one wait state applies up to 100 MHz. SRAM operates at 120 MHz with no wait states, as specified in Table 1.1 and Section 2.1 of R01DS0276EJ0240.