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Renesas R5F56514BGBP#20
- Part No.:
- R5F56514BGBP#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-TFBGA
- Datasheet:
-
R5F56514BGBP#20.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:490
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Product details
Overview
R5F56514BGBP#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 640 KB SRAM (256 KB main + 384 KB expansion), single-precision IEEE-754 FPU, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC with DRW2D graphics engine. It targets industrial HMI, networked gateways, and secure edge controllers requiring real-time connectivity and local display rendering.
For engineers reviewing the R5F56514BGBP#20 datasheet, R5F56514BGBP#20 pinout, R5F56514BGBP#20 application, or R5F56514BGBP#20 equivalent, this MCU delivers deterministic 120-MHz execution, dual-bank flash for safe firmware updates, hardware AES-128/192/256 encryption, IEC60730 safety support, and 136 GPIOs with 5-V tolerance - critical for robust industrial control and secure connected device design.
Technical Context
The R5F56514BGBP#20 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, enabling independent domain clocks: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for ETHERC/EDMAC/GLCDC/DRW2D, and PCLKB up to 60 MHz for most peripherals including S12AD units.
It supports four low-power modes (sleep, all-module clock stop, software standby, deep software standby) with 8 KB battery-backed standby RAM and RTC operation from VBATT. Safety features include oscillation-stop detection, CRC calculator (CRCA), register write protection, and A/D self-diagnostic - all aligned with IEC60730 Class B compliance requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz - enables high-throughput deterministic real-time control without external co-processors. |
| Flash Memory | 1 MB code flash with dual-bank structure - allows background programming and seamless bank switching for zero-downtime firmware updates. |
| SRAM | 640 KB total (256 KB main + 384 KB expansion), no wait states @ 120 MHz - supports large frame buffers for GLCDC/DRW2D and real-time data processing. |
| Peripherals | Ethernet MAC (10/100 Mbps), 2× CAN (ISO11898-1), SDHI/SDSI, QSPI, 3× RSPI, 13× SCI, 3× RIIC, GLCDC + DRW2D - integrates full connectivity and embedded graphics in one chip. |
| Analog | Two 12-bit A/D units (8 + 21 channels), 2× 12-bit D/A, on-chip temperature sensor (±1°C) - provides comprehensive mixed-signal capability for sensor fusion and closed-loop control. |
| Security | AES-128/192/256, Trusted Secure IP (TSIP), MPU (8 regions), CRCA, register write protection - meets baseline requirements for secure boot and runtime integrity in industrial IoT. |
| Package & Temp | LFBGA-176 (13 × 13 mm, 0.8-mm pitch), G-grade (–40°C to +105°C) - suitable for extended-temperature industrial environments with high I/O density. |
Pinout & Package
LFBGA-176 package (PLBG0176GA-A), 13 × 13 mm, 0.8-mm pitch, 136 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails enable noise isolation for precision A/D and D/A conversion. |
| VBATT | Battery backup supply | Provides power to RTC and 8 KB standby RAM during main power loss - ensures timekeeping and state retention. |
| RES# | Active-low reset input | Hardware reset assertion; combined with internal POR/LVD for robust power-on and brown-out recovery. |
| CLKIN / CLKOUT | External crystal interface | Supports 8–24 MHz crystal for main clock; optional output buffer for system clock distribution. |
| ETXD0–ETXD3 / ETXEN / ETXER / ERXD0–ERXD3 / ERXDV / ERXER | Ethernet PHY interface | MII-compliant 8-bit parallel interface - eliminates need for external PHY when using integrated MAC+PHY configuration. |
| MDIO / MDC | PHY management interface | Enables software configuration of external PHY registers via IEEE 802.3 clause 22/45 compliant bus. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables concurrent read-while-write and atomic bank swap - essential for fail-safe OTA updates in field-deployed equipment. |
| Integrated GLCDC + DRW2D | Hardware-accelerated 2D graphics (bit blit, vector draw, rotation) with 3-plane overlay - reduces CPU load for industrial HMI with animated UIs. |
| IEC60730 safety suite | Oscillation-stop detection, CRCA, IWDT, A/D self-test, register lock - pre-validated building blocks for Class B functional safety certification. |
| Flexible clock domain control | Independent ICLK, PCLKA, PCLKB, PCLKC, PCLKD, FCLK, BCLK - allows precise power/performance tuning per peripheral subsystem. |
| Event Link Controller (ELC) | 83 internal event signals routed without CPU intervention - enables deterministic timer-triggered A/D sampling, PWM synchronization, and interrupt-free peripheral chaining. |
Applications
| Industrial HMI Controller | Secure Network Gateway |
|---|---|
Use Scenario: Embedded panel controller for factory-floor HMIs with touch interface, real-time diagnostics, and local data logging. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving GLCDC/DRW2D for dynamic UI rendering, managing SDHI for log storage, and handling CAN/Ethernet for PLC communication. Use Value: Integrated graphics engine eliminates external GPU; 640 KB SRAM accommodates multi-layer frame buffers; dual-bank flash enables silent firmware patching during operation. |
Use Scenario: Edge gateway aggregating Modbus TCP, CANopen, and BACnet MS/TP traffic into unified MQTT/HTTP uplinks. IC Role / Device Role / Timing Role: Protocol translation hub with Ethernet MAC for upstream cloud connectivity, dual CAN for fieldbus bridging, and hardware AES for TLS offload. Use Value: On-chip crypto accelerates TLS handshake and payload encryption; 120-MHz RXv2 core handles multiple concurrent protocol stacks; IEC60730 features support safety-critical infrastructure monitoring. |
| Smart Energy Meter | Medical Device Controller |
Use Scenario: DIN-rail mounted energy meter with harmonic analysis, tamper detection, and remote firmware update over Ethernet. IC Role / Device Role / Timing Role: Real-time data acquisition controller interfacing with metrology ADCs via parallel capture unit, running secure bootloader, and managing dual-bank flash updates. Use Value: 12-bit A/D with self-diagnostic validates analog front-end integrity; TSIP and MPU enforce secure boot chain; RTC with battery backup maintains time stamping during outages. |
Use Scenario: Portable diagnostic device with LCD display, USB host for peripheral attachment (e.g., thermal printer), and SD card for patient data export. IC Role / Device Role / Timing Role: System-on-chip managing display rendering (GLCDC), USB 2.0 FS host for printer control, SDHI for DICOM export, and AES for HIPAA-compliant data encryption. Use Value: Integrated USB host eliminates external transceiver; DRW2D accelerates medical image overlays; 1 MB flash stores certified firmware and regulatory documentation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDDFP#30 | LQFP-144 package (20 × 20 mm), 2 MB flash, 640 KB SRAM, same RXv2 core and peripheral set - differs only in package size and flash capacity. | Suitable for space-constrained PCBs where BGA assembly is not feasible; identical peripheral functionality but lower I/O count (111 vs. 136). | Select when LQFP packaging, reduced pin count, or higher flash density is prioritized over maximum I/O and thermal performance. |
| R5F566TEBDFP#30 | RX66T Group, 160 MHz max, 1 MB flash, 384 KB SRAM, enhanced MTU3 timers optimized for motor control - lacks GLCDC/DRW2D and SDHI/SDSI. | Better suited for servo drives and inverters requiring high-resolution PWM and encoder interfaces; no embedded graphics or SD support. | Choose for motor control-centric designs needing higher PWM resolution and faster timing, not for HMI or storage-integrated applications. |
Compared with R5F56514BGBP#20, the R5F5651EDDFP#30 offers identical architecture in a leaded package with fewer pins and larger flash, while the R5F566TEBDFP#30 trades graphics/storage peripherals for superior motor-control timing - making R5F56514BGBP#20 optimal for display-enabled, networked industrial edge nodes.
Availability
R5F56514BGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, secure network gateways, and smart energy metering requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56514BGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX65N Group - including R5F56514BGBP#20 - was designed for industrial edge devices requiring integrated connectivity (Ethernet/CAN/USB), embedded graphics (GLCDC/DRW2D), security (TSIP/AES), and functional safety (IEC60730).
FAQ
What is the maximum operating frequency and core type of the R5F56514BGBP#20?
The R5F56514BGBP#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit, two multiply-and-accumulate units, and a 5-stage pipeline with variable-length instruction encoding - all confirmed in the official R01DS0276EJ0240 datasheet Rev.2.40.
Does the R5F56514BGBP#20 support dual-bank flash for safe firmware updates?
Yes, the R5F56514BGBP#20 includes a dual-bank flash architecture that enables background programming and atomic bank swapping. This allows firmware updates to occur while the application runs from the active bank - a key feature verified in Section 1.1 of the R01DS0276EJ0240 datasheet and essential for zero-downtime field upgrades in industrial systems.
What graphics capabilities does the R5F56514BGBP#20 provide?
The R5F56514BGBP#20 integrates both a Graphic-LCD Controller (GLCDC) and a 2D Drawing Engine (DRW2D). The GLCDC supports 3-plane overlay (background, graphic 1, graphic 2) and multiple pixel formats (32/16/8/4/1 bpp), while DRW2D accelerates bit blitting, vector drawing, and rotation - all documented in the "Graphics Functions" section of the R01DS0276EJ0240 datasheet.
Which communication interfaces are integrated into the R5F56514BGBP#20?
The R5F56514BGBP#20 integrates Ethernet MAC (10/100 Mbps), 2-channel CAN (ISO11898-1), SD host/slave interfaces, quad SPI, 3-channel RSPI, 13-channel SCI, 3-channel I2C, USB 2.0 FS host/function, and MMCIF - all listed in Table 1.1 of the R01DS0276EJ0240 datasheet and validated across functional block diagrams and peripheral descriptions.
What safety and security features does the R5F56514BGBP#20 include for industrial use?
The R5F56514BGBP#20 includes IEC60730-compliant features such as oscillation-stop detection, CRC calculator (CRCA), independent watchdog timer (IWDT), A/D self-diagnostic, and register write protection. It also provides AES-128/192/256 encryption, Trusted Secure IP (TSIP), and an 8-region Memory Protection Unit (MPU) - all specified in the "Safety" and "Encryption Functions" sections of the R01DS0276EJ0240 datasheet.
R5F56514BGBP#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-TFBGA
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56514BGBP#20 FAQ
1.How can I place an order for R5F56514BGBP#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56514BGBP#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56514BGBP#20 reliable?
The price and inventory of R5F56514BGBP#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56514BGBP#20 is usually 5 days.
3.What payment methods are accepted for R5F56514BGBP#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56514BGBP#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56514BGBP#20?
R5F56514BGBP#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56514BGBP#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56514BGBP#20?
For technical support, including R5F56514BGBP#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56514BGBP#20 requirements.
6.How does Aetrix verify that R5F56514BGBP#20 is sourced from the original manufacturer or authorized distributors?
All R5F56514BGBP#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56514BGBP#20 meets industry standards.
7.What is the process for return or replacement of R5F56514BGBP#20?
All R5F56514BGBP#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56514BGBP#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56514BGBP#20 part is unused and in its original packaging.
Return procedure for R5F56514BGBP#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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