Renesas R5F56514BGFB#30

Overview

R5F56514BGFB#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 1 MB on-chip code flash memory, 640 KB SRAM (256 KB main + 384 KB expansion), and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC/DRW2D graphics subsystems - deployed in industrial HMIs, networked gateways, and secure IoT edge controllers.

For engineers reviewing the R5F56514BGFB#30 datasheet, R5F56514BGFB#30 pinout, R5F56514BGFB#30 application, or R5F56514BGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe firmware updates, TSIP-based AES-128/192/256 encryption, IEC60730 safety support, and real-time clock with battery backup - all operating across –40°C to +105°C.

Technical Context

The R5F56514BGFB#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-kHz IWDT oscillator, MPU with eight protection areas (min. 16-byte granularity), and Trusted Memory (TM) for code read protection in flash.

Its peripheral clocking supports independent domain scaling: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for ETHERC/EDMAC/GLCDC/DRW2D/AES, PCLKB up to 60 MHz for most timers and communication interfaces, and PCLKC/PCLKD up to 60 MHz for dual 12-bit A/D units - enabling deterministic real-time scheduling across mixed-criticality subsystems.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5-mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56514BGFB#30, R5F5651EDFBL#30 offers expanded flash headroom with full pin and peripheral compatibility, while R5F566TEBDFP#30 trades graphics/storage capability for higher CPU speed and motor-control-specific peripherals - making it unsuitable for HMI or gateway roles without significant hardware and software rework.

Availability

R5F56514BGFB#30 is available at Aetrix Electronics and suitable for industrial HMIs, smart gateways, and secure IoT edge nodes requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature stress.

Supply support for R5F56514BGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX65N Group - including R5F56514BGFB#30 - was designed for high-integration, safety-certifiable industrial applications demanding rich connectivity, graphics capability, and hardware security in a single chip.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F56514BGFB#30?

The R5F56514BGFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit, two MAC units, and 32-bit multiplier with one-cycle execution - all confirmed in the R01DS0276EJ0240 datasheet Rev.2.40.

Does the R5F56514BGFB#30 include on-chip Ethernet PHY functionality?

No, the R5F56514BGFB#30 integrates only the Ethernet MAC layer (ETHERC) compliant with IEEE 802.3, supporting 10/100 Mbps in MII or RMII mode. An external PHY IC (e.g., LAN8720A) is required for physical layer signaling. This is explicitly stated in Section 1.1 and Table 1.1 of the R01DS0276EJ0240 datasheet.

What flash and RAM capacities are implemented in the R5F56514BGFB#30?

The R5F56514BGFB#30 contains 1 MB of on-chip code flash memory with dual-bank structure and 640 KB of SRAM (256 KB main + 384 KB expansion RAM), both accessible at zero wait states up to 120 MHz. It also includes 32 KB of reprogrammable data flash (100,000 erase/write cycles) and 8 KB of battery-backed standby RAM - per Table 1.1 and Section 1.1 of R01DS0276EJ0240.

Which security features are hardware-accelerated in the R5F56514BGFB#30?

The R5F56514BGFB#30 includes hardware-accelerated AES-128/192/256 encryption via Trusted Secure IP (TSIP), CRC calculation for 8- and 32-bit data, memory protection unit (MPU) with eight configurable regions, register write protection, and oscillation-stop detection - all documented in Sections 1.1 and "Safety" of R01DS0276EJ0240 for IEC60730 Class B compliance.

What is the package type and pin count of the R5F56514BGFB#30?

The R5F56514BGFB#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5-mm ball pitch. It provides 136 general-purpose I/O pins, 19 of which are 5-V tolerant - as specified in the "Package Information" section of R01DS0276EJ0240 Rev.2.40.

Does the R5F56514BGFB#30 support SD card interfaces for both host and slave operation?

Yes, the R5F56514BGFB#30 integrates both SD host interface (SDHI) and SD slave interface (SDSI) modules. SDHI supports 1-/4-bit SD/SDIO buses at up to 25 MB/s (high-speed mode), while SDSI complies with SDIO Card Specification Ver.2.00 in 1-/4-bit SD or SPI mode - confirmed in Table 1.1 and Section "Communication Function" of R01DS0276EJ0240.