Renesas R5F56514BGFP#10
- Part No.:
- R5F56514BGFP#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56514BGFP#10.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,602
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56514BGFP#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 1.5 MB on-chip code flash memory, 640 KB SRAM (including 8 KB standby RAM), and dual-bank flash architecture enabling background programming. It integrates Ethernet MAC, CAN (2 channels), SD host/slave, QSPI, GLCDC, DRW2D, and hardware AES encryption - targeting industrial HMI, networked gateway, and secure embedded control applications.
For engineers reviewing the R5F56514BGFP#10 datasheet, R5F56514BGFP#10 pinout, R5F56514BGFP#10 application, or R5F56514BGFP#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe firmware updates, and full peripheral integration including Ethernet PHY support and 21-channel 12-bit A/D converter.
Technical Context
The R5F56514BGFP#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, supporting little- or big-endian data arrangement. Its clock system combines external crystal oscillation (8–24 MHz), internal PLL, and multiple on-chip oscillators (HOCO/LOCO/IWDT-dedicated), with independent clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz) enabling precise peripheral timing control.
Peripheral subsystems are tightly coupled via the Event Link Controller (ELC), allowing direct inter-module triggering without CPU intervention - e.g., MTU3 timers can initiate A/D conversions or PDC frame captures, while SCIi FIFO interrupts can trigger DMACA transfers. Security is enforced through MPU (8 regions, 16-byte granularity), Trusted Memory (TM) for code protection, register write protection, and hardware-accelerated AES-128/192/256 with TSIP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); enables real-time deterministic execution in industrial control loops |
| Code Flash Memory | 1.5 MB dual-bank flash with background programming (BGO), enabling seamless firmware updates without halting operation |
| SRAM | 640 KB total: 256 KB main + 384 KB expansion RAM, all zero-wait-state at 120 MHz for high-speed buffer handling |
| A/D Converter | Two 12-bit units: S12AD0 (8 ch) and S12AD1 (21 ch), with 0.48 µs conversion time and self-diagnostic capability |
| Connectivity | Ethernet MAC + PHY, 2× CAN (ISO 11898-1), SDHI/SDSI, QSPI, 3× RSPI, 13× SCI, 3× I2C, USB 2.0 FS host/function/OTG |
| Security | Hardware AES engine (128/192/256-bit keys), Trusted Secure IP (TSIP), MPU, TM code protection, CRC calculator (CRCA) |
| Package | PLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, rated for –40°C to +105°C (G-version) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails enable noise isolation for ADC/DAC and precision timing circuits |
| VBATT | Battery backup supply | Provides power to RTC during main supply failure, preserving calendar/time and 8 KB standby RAM contents |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for high-accuracy system clock; paired with on-chip PLL for 120 MHz ICLK generation |
| MD0 / MD1 | Mode setting pins | Determine boot mode (SCI/USB/FINE) and chip configuration at reset release; critical for production programming and debug access |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring integrated Ethernet PHY registers without external components |
| ETXD0–ETXD3 / ETXEN / ERXD0–ERXD3 / ERXDV | Ethernet physical layer signals | Direct MII interface supports 10/100 Mbps full/half-duplex; eliminates need for external PHY in cost-sensitive designs |
| SD0CMD / SD0CLK / SD0DAT0–3 | SD host interface signals | 1-bit or 4-bit SD bus interface compliant with SD Physical Layer Spec v3.01, enabling direct connection to SD memory or SDIO peripherals |
| QSPI_IO0–3 / QSPI_CLK / QSPI_CS | Quad SPI interface | Supports single/dual/quad I/O modes for high-speed serial flash memory access up to 80 MB/s effective bandwidth |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables live firmware update: one bank executes while the other is reprogrammed, eliminating system downtime |
| Event Link Controller (ELC) | Eliminates CPU overhead by directly linking 83 internal event sources (e.g., timer overflow → A/D start → DMA transfer) |
| Trusted Secure IP (TSIP) | Hardware-accelerated cryptographic services including key wrapping, secure boot verification, and RNG - certified per IEC 60730 Class B |
| Graphic-LCD controller (GLCDC) | Supports 3-layer overlay (background + 2 graphics planes), 32/16 bpp formats, and direct RGB/TFT panel drive - reduces external display controller BOM |
| 2D drawing engine (DRW2D) | Offloads GUI rendering: vector primitives (lines/circles), bit blitting with rotation/stretching, and CLUT-based color conversion - improves UI responsiveness |
| Integrated Ethernet PHY | Reduces component count and PCB area: no external PHY IC required; supports MII/RMII and Wake-on-LAN via Magic Packet detection |
Applications
| Industrial HMI Panel | Secure Gateway Device |
|---|---|
Use Scenario: Touch-enabled factory floor display with real-time process visualization, alarm logging, and local PLC communication. IC Role / Device Role / Timing Role: Primary application processor running RTOS, managing GLCDC/DRW2D for UI rendering, Ethernet for SCADA connectivity, and CAN for fieldbus integration. Use Value: Integrated graphics acceleration and 640 KB SRAM eliminate external frame buffer memory; dual-bank flash enables remote OTA updates without interrupting HMI operation. | Use Scenario: Edge node aggregating sensor data from Modbus/CAN networks and forwarding to cloud via TLS-secured Ethernet or cellular backhaul. IC Role / Device Role / Timing Role: Secure protocol translator with hardware AES and TSIP enforcing encrypted data path; Ethernet MAC + SDHI handles local storage and network handoff. Use Value: On-chip TSIP accelerates TLS handshake and certificate validation; 21-channel A/D supports multi-sensor analog input without external muxing. |
| Networked Energy Meter | Medical Diagnostic Interface |
Use Scenario: DIN-rail mounted smart meter with pulse counting, harmonic analysis, and remote firmware upgrade over Ethernet. IC Role / Device Role / Timing Role: Real-time measurement engine using MTU3 timers for precise pulse capture and S12AD1 for voltage/current sampling at synchronized intervals. Use Value: 120 MHz CPU and zero-wait SRAM ensure sub-microsecond response to metering interrupts; dual-bank flash guarantees fail-safe firmware rollback. | Use Scenario: Portable ultrasound or ECG device requiring low-power operation, high-resolution display, and HIPAA-compliant data encryption before storage or transmission. IC Role / Device Role / Timing Role: System-on-chip controller managing CMOS camera interface (PDC), DRW2D for waveform rendering, AES for DICOM file encryption, and USB for clinical PC sync. Use Value: Integrated temperature sensor and self-diagnostic A/D validate signal chain integrity; 8 KB standby RAM preserves session state during battery swaps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFPL#30 | Same RX65N Group, 176-pin LFBGA, but with 2 MB flash and 640 KB SRAM; identical peripheral set and pinout | Requires larger code footprint (e.g., full TCP/IP stack + GUI framework); same thermal and layout constraints | Select when firmware size exceeds 1.5 MB or future-proofing for feature expansion is required |
| R5F566TEADFP#30 | RX66T Group part: higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time compensation), no Ethernet PHY | Optimized for servo drives/inverters; lacks integrated Ethernet and SD interfaces; different peripheral emphasis | Choose for real-time motor control where Ethernet connectivity is handled externally or via companion chip |
Compared with R5F56514BGFP#10, R5F5651EDFPL#30 offers increased flash capacity without changing footprint or peripherals, while R5F566TEADFP#30 trades Ethernet/SD integration for superior motor-control timing precision - making R5F56514BGFP#10 optimal for connected, graphics-rich industrial edge nodes requiring balanced compute, I/O, and security.
Availability
R5F56514BGFP#10 is available at Aetrix Electronics and suitable for industrial HMI, secure gateways, and networked energy metering applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.
Supply support for R5F56514BGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RX65N Group - to which R5F56514BGFP#10 belongs - was designed for secure, connected industrial edge devices requiring integrated graphics, Ethernet, safety certification (IEC 60730), and robust flash update capabilities in extended temperature environments.
FAQ
What is the maximum operating frequency and CPU performance of the R5F56514BGFP#10?
The R5F56514BGFP#10 operates at a maximum system clock frequency of 120 MHz using its RXv2 CPU core, achieving 240 DMIPS of processing performance. Its single-precision IEEE-754 floating-point unit (FPU), dual multiply-accumulate units, and 5-stage pipeline enable deterministic real-time execution - essential for motion control, protocol stacks, and graphical user interface rendering in the R5F56514BGFP#10.
Does the R5F56514BGFP#10 include an integrated Ethernet PHY?
Yes, the R5F56514BGFP#10 integrates a full IEEE 802.3-compliant Ethernet PHY alongside its MAC layer, supporting both MII and RMII interfaces at 10/100 Mbps. This eliminates the need for an external PHY IC, reducing bill-of-materials cost and PCB area - a key differentiator of the R5F56514BGFP#10 within the RX65N family for compact, cost-sensitive networked devices.
What security features are implemented in hardware on the R5F56514BGFP#10?
The R5F56514BGFP#10 includes hardware-accelerated AES-128/192/256 encryption, Trusted Secure IP (TSIP) for key management and secure boot, Memory Protection Unit (MPU) with eight configurable regions, Trusted Memory (TM) for code read protection, register write protection, and CRC calculator (CRCA). These features collectively satisfy IEC 60730 Class B functional safety requirements - a core design objective of the R5F56514BGFP#10.
How much on-chip memory does the R5F56514BGFP#10 provide, and what are its access characteristics?
The R5F56514BGFP#10 provides 1.5 MB of on-chip code flash memory with dual-bank architecture, 640 KB of zero-wait-state SRAM (256 KB main + 384 KB expansion), and 8 KB of battery-backed standby RAM. Flash access incurs zero wait states up to 50 MHz or on cache hit at 120 MHz; SRAM delivers full 120 MHz bandwidth with no wait states - critical for real-time buffering in the R5F56514BGFP#10's Ethernet and SD interfaces.
What is the package type and thermal rating of the R5F56514BGFP#10?
The R5F56514BGFP#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for operation from –40°C to +105°C (G-version), with an exposed thermal pad for efficient heat dissipation - meeting industrial and extended-temperature requirements specified for the R5F56514BGFP#10.
R5F56514BGFP#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56514BGFP#10 FAQ
1.How can I place an order for R5F56514BGFP#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56514BGFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56514BGFP#10 reliable?
The price and inventory of R5F56514BGFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56514BGFP#10 is usually 5 days.
3.What payment methods are accepted for R5F56514BGFP#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56514BGFP#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56514BGFP#10?
R5F56514BGFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56514BGFP#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56514BGFP#10?
For technical support, including R5F56514BGFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56514BGFP#10 requirements.
6.How does Aetrix verify that R5F56514BGFP#10 is sourced from the original manufacturer or authorized distributors?
All R5F56514BGFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56514BGFP#10 meets industry standards.
7.What is the process for return or replacement of R5F56514BGFP#10?
All R5F56514BGFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56514BGFP#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56514BGFP#10 part is unused and in its original packaging.
Return procedure for R5F56514BGFP#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56514BGFP#10 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

