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Renesas R5F56514EGFB#10

Part No.:
R5F56514EGFB#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F56514EGFB#10.pdf
Description:
IC MCU 32BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,294

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Product details

Overview

R5F56514EGFB#10 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 256 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, and hardware AES-128/192/256 encryption - deployed in industrial HMIs with real-time graphics and secure firmware updates.

For engineers reviewing the R5F56514EGFB#10 datasheet, R5F56514EGFB#10 pinout, R5F56514EGFB#10 application, or R5F56514EGFB#10 equivalent, key selection criteria include its 176-pin LFBGA package, 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe OTA updates, and integrated GLCDC + DRW2D for embedded display control without external graphics ICs.

Technical Context

The R5F56514EGFB#10 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and support for little/big-endian data. It integrates a memory protection unit (MPU) with eight configurable regions and Trusted Secure IP (TSIP) for cryptographic key management and secure boot.

Clock subsystem includes PLL-based 120-MHz ICLK, independent PCLKA/PCLKB domains (up to 120 MHz/60 MHz), and dedicated IWDT oscillator. Peripheral clocking enables concurrent high-speed operation of Ethernet MAC, MTU3 timers, and GLCDC while maintaining deterministic latency for safety-critical functions per IEC60730.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz
Flash Memory1 MB code flash with dual-bank structure enabling background programming and safe firmware swap
SRAM256 KB on-chip SRAM (no wait states @ 120 MHz), 8 KB standby RAM with VBATT backup
Analog PeripheralsTwo 12-bit A/D converters (8 + 21 channels), two 12-bit D/A channels, on-die temperature sensor (±1°C)
Communication InterfacesEthernet MAC (10/100 Mbps MII/RMII), 2× CAN 2.0B (32 mailboxes/channel), 3× RSPI, 3× I²C (1 Mbps), QSPI, SDHI/SDSI, USB 2.0 FS host/function
Graphics & DisplayGraphic-LCD controller (GLCDC) supporting 3-plane overlay, 2D drawing engine (DRW2D) with vector/bit-blit acceleration
SecurityAES-128/192/256, Trusted Secure IP (TSIP), MPU, register write protection, CRC calculator (8/32-bit)

Pinout & Package

Package: PLQP0176KB-A, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, –40°C to +85°C operating range.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsSeparate analog/digital domains enable noise isolation for ADC/DAC and stable core operation
XTAL / EXTALMain crystal oscillator terminalsSupports 8–24 MHz external crystal for precise system timing and Ethernet PHY synchronization
ETH_MDC / ETH_MDIOMDIO management interfaceEnables configuration and status polling of external Ethernet PHY without CPU intervention
ETH_TXD0–3 / ETH_RXD0–3Ethernet data busDirect MII interface pins; RMII mode uses subset (TXD0/1, RXD0/1, TX_EN, CRS_DV, REF_CLK)
CAN0_TX / CAN0_RXChannel 0 differential CAN transceiver I/OCompatible with ISO 11898-2 physical layer; requires external CAN transceiver for bus connection
GLCD_D0–2324-bit RGB parallel LCD data busDrives TFT panels up to WXGA resolution; supports 16-/32-bpp pixel formats with CLUT
DRW2D_CLK / DRW2D_RSTDrawing engine clock/resetIndependent clock domain allows asynchronous rendering while CPU executes application logic

Key Features

FeatureDesign Value
Trusted Secure IP (TSIP)Hardware-accelerated AES and secure key storage enabling certified secure boot and firmware authentication
Dual-bank flash memoryEnables atomic firmware update: new image written to inactive bank while active bank continues execution
GLCDC + DRW2D co-processingOffloads UI rendering from CPU - supports smooth animation, alpha blending, and 2D geometry without external GPU
IEC60730-compliant peripheralsIncludes oscillation-stop detection, CRC calculator, self-diagnostic ADC, and register write protection for Class B safety certification
Event Link Controller (ELC)83 internal event signals routed without CPU involvement - e.g., TPU timer trigger → ADC conversion → DMA transfer

Applications

Industrial HMISecure Gateway

Use Scenario: Touch-enabled operator panel in factory automation with real-time process visualization and alarm logging.

IC Role / Device Role / Timing Role: Primary application processor running RTOS, driving 800×480 TFT via GLCDC, executing EtherNet/IP stack on integrated MAC.

Use Value: Eliminates external graphics controller and PHY; dual-bank flash ensures zero-downtime firmware updates during production shifts.

Use Scenario: Field-deployed edge gateway aggregating Modbus RTU/ASCII data and forwarding via encrypted TLS over Ethernet.

IC Role / Device Role / Timing Role: Secure protocol translator with hardware AES encryption, CAN-to-Ethernet bridging, and watchdog-monitored fail-safe reset.

Use Value: TSIP accelerates TLS handshake; dual CAN interfaces connect to multiple PLCs; MPU isolates communication stacks from application code.

Medical Display TerminalBuilding Automation Controller

Use Scenario: Portable diagnostic device display showing real-time waveforms (ECG, SpO₂) with touch navigation and local data storage.

IC Role / Device Role / Timing Role: Real-time signal acquisition controller using 12-bit ADC with digital filtering, DRW2D-rendered UI, and SDHI-hosted patient records.

Use Value: On-chip 256 KB SRAM buffers waveform data at 1 kHz; GLCDC overlays annotations without frame tearing; AES encrypts stored PHI.

Use Scenario: HVAC controller managing zone sensors, VFDs, and BACnet/IP communication in commercial buildings.

IC Role / Device Role / Timing Role: Deterministic real-time controller with 120-MHz RXv2 core, 21-channel ADC for thermistor arrays, and Ethernet/BACnet stack.

Use Value: MTU3 timers generate precise PWM for fan speed control; ELC links temperature readings to DAC outputs without CPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EDFBL#10Same RX65N Group, 2 MB flash, 640 KB SRAM, identical 176-pin LFBGA package and peripheral setHigher memory capacity suits complex GUIs or dual-application firmware imagesSelect when >1 MB flash required for feature-rich HMI or safety partitioning
R5F566TEADFP#30RX66T Group, 160 MHz, 1 MB flash, 256 KB SRAM, 144-pin LQFP, no GLCDC/DRW2D, enhanced motor control timersOptimized for servo/inverter control; lacks display subsystem but adds MTU3-advanced PWM and encoder interfacesChoose for motor-driven systems needing field-oriented control, not display-centric designs

Compared with R5F56514EGFB#10, the R5F5651EDFBL#10 offers double flash/SRAM for larger firmware and UI assets without changing PCB layout, while the R5F566TEADFP#30 trades graphics capability for higher PWM resolution and motor-specific peripherals - making it unsuitable for display applications but superior for real-time motion control.

Availability

R5F56514EGFB#10 is available at Aetrix Electronics and suitable for industrial HMIs, secure gateways, medical display terminals, and building automation controllers requiring stable component supply across multi-year production cycles.

Supply support for R5F56514EGFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including the R5F56514EGFB#10 - was designed for high-integrity human-machine interfaces with integrated graphics, real-time networking, and hardware security for industrial and medical edge devices.

FAQ

What is the maximum operating frequency and core type of the R5F56514EGFB#10?

The R5F56514EGFB#10 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its Harvard architecture includes a 5-stage pipeline, variable-length instructions, and support for both little-endian and big-endian data formats. The R5F56514EGFB#10 achieves this performance with zero wait states on SRAM and optimized flash access via ROM cache hit detection.

Does the R5F56514EGFB#10 support secure firmware updates and cryptographic operations?

Yes, the R5F56514EGFB#10 integrates Trusted Secure IP (TSIP) for hardware-accelerated AES-128/192/256 encryption, secure key storage, and secure boot verification. Its dual-bank flash architecture allows background programming of the inactive bank while the active bank runs production firmware - enabling atomic, zero-downtime firmware updates. The R5F56514EGFB#10 also includes CRC calculation and register write protection to meet IEC60730 Class B requirements.

What display interfaces and graphics capabilities does the R5F56514EGFB#10 provide?

The R5F56514EGFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output, 3-plane overlay (background, graphic 1, graphic 2), and multiple pixel formats (1/4/8/16/32 bpp). It also includes a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, rotation, and alpha blending. These features allow the R5F56514EGFB#10 to drive WXGA displays and render complex UIs without external graphics ICs.

Which communication interfaces are integrated into the R5F56514EGFB#10 for industrial connectivity?

The R5F56514EGFB#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), two CAN 2.0B channels (32 mailboxes each), three RSPI, three I²C (up to 1 Mbps), QSPI, SD host/slave, USB 2.0 FS host/function, and 13 SCI channels. This combination enables robust industrial networking - for example, EtherNet/IP over Ethernet, CANopen over CAN, and SD card logging - all managed concurrently via DMACAa, EXDMACa, and DTCb DMA controllers to minimize CPU load.

What is the package type and pin count of the R5F56514EGFB#10?

The R5F56514EGFB#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 × 24 mm with 0.5-mm ball pitch. It supports –40°C to +85°C operation and provides 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain capability, and programmable pull-up resistors - matching the mechanical and thermal requirements of space-constrained industrial control panels.

R5F56514EGFB#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56514EGFB#10 FAQ

1.How can I place an order for R5F56514EGFB#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56514EGFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56514EGFB#10 reliable?

The price and inventory of R5F56514EGFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56514EGFB#10 is usually 5 days.

3.What payment methods are accepted for R5F56514EGFB#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56514EGFB#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56514EGFB#10?

R5F56514EGFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56514EGFB#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56514EGFB#10?

For technical support, including R5F56514EGFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56514EGFB#10 requirements.

6.How does Aetrix verify that R5F56514EGFB#10 is sourced from the original manufacturer or authorized distributors?

All R5F56514EGFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56514EGFB#10 meets industry standards.

7.What is the process for return or replacement of R5F56514EGFB#10?

All R5F56514EGFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56514EGFB#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56514EGFB#10 part is unused and in its original packaging.

Return procedure for R5F56514EGFB#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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