Renesas R5F56514FGFM#30
- Part No.:
- R5F56514FGFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F56514FGFM#30.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:320
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56514FGFM#30 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 1.5 MB on-chip code flash memory, 640 KB SRAM (including 8 KB standby RAM), and dual-bank flash architecture enabling background programming. It integrates Ethernet MAC, CAN (2 channels), SD host/slave interfaces, QSPI, GLCDC, DRW2D, and hardware AES encryption - targeting industrial HMI, networked gateway, and secure embedded control applications.
For engineers reviewing the R5F56514FGFM#30 datasheet, R5F56514FGFM#30 pinout, R5F56514FGFM#30 application, or R5F56514FGFM#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe firmware updates, and full peripheral integration including Ethernet PHY support, 21-channel 12-bit A/D converter (unit 1), and 2-channel D/A converter.
Technical Context
The R5F56514FGFM#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions, supporting little- or big-endian data arrangement and executing floating-point, DSP, and multiply-accumulate operations in hardware. Its clock system uses PLL multiplication of external crystal or internal HOCO (16/18/20 MHz) to achieve 120 MHz ICLK, while peripheral clocks (PCLKA/PCLKB) are independently configurable up to 120 MHz and 60 MHz respectively.
Peripheral subsystems operate under strict clock domain separation: ETHERC, EDMAC, AES, GLCDC, and DRW2D synchronize to PCLKA (≤120 MHz); S12AD unit 1 runs on PCLKD (≤60 MHz); and RTC, IWDT, and low-power modes rely on dedicated LOCO (240 kHz) or sub-clock sources. The ELC enables zero-CPU-latency interconnection of 83 internal event signals across timers, ADC, and communication modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK), with no-wait flash access ≤50 MHz or cache hit |
| Memory | 1.5 MB code flash (dual-bank), 640 KB SRAM (256 KB + 384 KB expansion), 32 KB data flash (100k write cycles) |
| Analog Peripherals | Two 12-bit A/D units (8 + 21 channels), 2-channel 12-bit D/A, on-die temperature sensor (±1°C) |
| Communication | Ethernet MAC + PHY, 2× CAN (ISO 11898-1), 3× RSPI, 1× QSPI, 3× I²C (1 Mbps), 13× SCI, SDHI/SDSI/MMCIF |
| Security & Safety | AES-128/192/256, Trusted Secure IP (TSIP), MPU (8 regions), CRC calculator, IEC60730 self-test functions |
| Package & Temp | PLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch; operating range –40°C to +105°C (G-version) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1) - each require local decoupling per datasheet layout rules |
| VBATT | Battery backup supply | Provides power to RTC during main VCC dropout; enables calendar retention and time-capture functionality |
| XTAL/EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; required for high-accuracy timing and Ethernet PHY clock derivation |
| MD0–MD2 | Mode setting pins | Determine boot mode (SCI/USB/FINE) and single-chip vs. extended mode at reset release |
| ETH_MDC/ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO bus for configuring external or integrated PHY registers |
| ETXD0–ETXD3, ERXD0–ERXD3 | Ethernet physical layer I/O | 4-bit transmit/receive data lines for MII interface; RMII mode uses subset (ETXD0/ERXD0/ERXDV/ETXEN) |
| SD0CMD, SD0CLK, SD0DAT0–3 | SD host interface signals | 1-bit or 4-bit SD bus interface supporting SD Memory Card v3.01 and SDIO v3.00 specifications |
| QSPI_IO0–3, QSPI_CLK, QSPI_SSL | Quad SPI interface | Enables direct XIP or fast sequential read from quad-output serial flash (e.g., Winbond W25Q series) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: execute from Bank A while programming Bank B, eliminating system downtime |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES and key management with tamper-resistant key storage - certified for IEC62443-3-3 SL2 |
| Graphic-LCD controller (GLCDC) | Direct drive of RGB/TFT panels up to 1024×768; supports 3-layer overlay (background + 2 graphics planes) without CPU load |
| 2D drawing engine (DRW2D) | Offloads GUI rendering: vector primitives (lines/circles), bit-blit with rotation/stretch, CLUT-based color conversion, display list execution |
| Event Link Controller (ELC) | Configurable hardware routing of 83 internal events (e.g., TPU compare match → ADC trigger → DMA transfer) without CPU intervention |
| IEC60730 safety support | Integrated oscillation-stop detection, CRC calculator (8/32-bit), IWDT windowing, register write protection, and A/D self-diagnostic routines |
Applications
| Industrial HMI Panel | Secure Gateway Device |
|---|---|
Use Scenario: Standalone touch-enabled operator interface for PLC-controlled machinery with local data logging and remote diagnostics via Ethernet. IC Role / Device Role / Timing Role: Primary application processor running RTOS, managing GLCDC-driven TFT display, DRW2D-accelerated GUI, SDHI-stored configuration logs, and Ethernet TCP/IP stack. Use Value: Dual-bank flash allows over-the-air firmware updates without halting HMI operation; TSIP secures firmware integrity and encrypted parameter storage. | Use Scenario: Field-deployed protocol translator bridging Modbus RTU devices to cloud MQTT brokers using TLS-secured Ethernet/Wi-Fi (via external module). IC Role / Device Role / Timing Role: Central secure MCU handling CAN/Modbus parsing, AES-encrypted payload packaging, Ethernet frame assembly, and watchdog-monitored TLS handshake timing. Use Value: Integrated Ethernet MAC+PHY eliminates external PHY BOM; hardware AES reduces TLS handshake latency by >40% vs. software-only implementation. |
| Networked Energy Meter | Smart Building Controller |
Use Scenario: DIN-rail mounted meter aggregating current/voltage readings from isolated ADC front-ends, reporting kWh data hourly via Ethernet to SCADA. IC Role / Device Role / Timing Role: Real-time data concentrator with 21-channel S12AD unit 1 sampling multi-phase analog inputs, RTC-synchronized timestamping, and SDHI-buffered burst logging. Use Value: On-chip temperature sensor calibrates ADC gain drift; dual A/D units allow simultaneous sampling and self-test without interrupt latency penalty. | Use Scenario: HVAC zone controller integrating CAN-connected thermostats, BACnet/IP over Ethernet, and local LCD status display with touch feedback. IC Role / Device Role / Timing Role: System-on-chip managing CAN bus arbitration, Ethernet UDP packetization, GLCDC-driven segment LCD, and 2-channel D/A for analog valve control outputs. Use Value: 136 GPIOs with 5-V tolerance simplify interfacing to legacy 5V sensors; ELC synchronizes CAN message receipt → D/A update → LCD refresh in <1 µs hardware chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#30 | Same RX65N Group, 144-pin LQFP package (PLQP0144KA-B), 2 MB flash, 640 KB SRAM, identical peripherals except reduced GPIO count (111 vs. 136) | Suitable for space-constrained PCBs where BGA assembly is unavailable; lacks 25 extra GPIOs and 2 CAN mailboxes | Select when LQFP hand-soldering or rework is required, and full 176-pin I/O is unnecessary. |
| R5F566TEBDFP#30 | RX66T Group part: higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time compensation), same 176-pin LFBGA but no Ethernet MAC or GLCDC | Optimized for servo/inverter control with encoder feedback; excludes HMI and networking peripherals present in R5F56514FGFM#30 | Choose for real-time motor control where Ethernet/HMI are delegated to companion SoC or omitted. |
Compared with R5F56514FGFM#30, the R5F5651EDFBL#30 trades pin count and I/O for LQFP manufacturability, while the R5F566TEBDFP#30 shifts focus from integrated networking/HMI to deterministic motor control - neither offers drop-in replacement due to peripheral and package mismatches.
Availability
R5F56514FGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, secure gateway, and networked energy meter applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from Renesas-authorized channels.
Supply support for R5F56514FGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RX65N Group, which includes the R5F56514FGFM#30, was designed specifically for secure, networked industrial human-machine interfaces and edge gateways - integrating real-time control, rich graphics, cryptography, and multiple industrial communication protocols in a single chip.
FAQ
What is the maximum operating frequency and core type of the R5F56514FGFM#30?
The R5F56514FGFM#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, achieving 240 DMIPS performance. It includes hardware single-precision IEEE-754 floating-point unit, 32-bit multiplier (1-cycle), and divider (2-cycle). This specification is confirmed in Renesas datasheet R01DS0276EJ0240 Rev.2.40, Section 1.1.
Does the R5F56514FGFM#30 include integrated Ethernet PHY functionality?
Yes, the R5F56514FGFM#30 integrates both Ethernet MAC and PHY layers compliant with IEEE 802.3u (10/100 Mbps), supporting MII and RMII interfaces. It includes Magic Packet™ detection and wake-on-LAN capability. This is documented in the "Communication function" section of R01DS0276EJ0240, page 7.
What package type and pin count does the R5F56514FGFM#30 use?
The R5F56514FGFM#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. This is explicitly listed in the "Package Information" section of R01DS0276EJ0240, page 1.
How much on-chip flash and SRAM does the R5F56514FGFM#30 provide?
The R5F56514FGFM#30 includes 1.5 MB of on-chip code flash memory with dual-bank architecture and 640 KB of SRAM (256 KB base + 384 KB expansion RAM), plus 8 KB of battery-backed standby RAM. These values are specified in Table 1.1, "Outline of Specifications", R01DS0276EJ0240 Rev.2.40, page 2.
Which security features are implemented in hardware on the R5F56514FGFM#30?
The R5F56514FGFM#30 implements AES-128/192/256 encryption, Trusted Secure IP (TSIP), Memory Protection Unit (MPU) with eight configurable regions, CRC calculator (8-/32-bit), register write protection, and IEC60730-compliant self-test functions including oscillation-stop detection and A/D diagnostic routines - all detailed in Sections 1.1 and 1.7 of R01DS0276EJ0240.
R5F56514FGFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 42
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56514FGFM#30 FAQ
1.How can I place an order for R5F56514FGFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56514FGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56514FGFM#30 reliable?
The price and inventory of R5F56514FGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56514FGFM#30 is usually 5 days.
3.What payment methods are accepted for R5F56514FGFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56514FGFM#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56514FGFM#30?
R5F56514FGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56514FGFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56514FGFM#30?
For technical support, including R5F56514FGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56514FGFM#30 requirements.
6.How does Aetrix verify that R5F56514FGFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F56514FGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56514FGFM#30 meets industry standards.
7.What is the process for return or replacement of R5F56514FGFM#30?
All R5F56514FGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56514FGFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56514FGFM#30 part is unused and in its original packaging.
Return procedure for R5F56514FGFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56514FGFM#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

