Renesas R5F56517ADFP#10

Overview

R5F56517ADFP#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash memory, 640 KB SRAM, and hardware AES-128/192/256 encryption. It integrates Ethernet MAC, dual CAN channels, SD host/slave interfaces, QSPI, GLCDC, DRW2D, and RTC - targeting industrial HMI, gateway, and secure connected device applications.

For engineers reviewing the R5F56517ADFP#10 datasheet, R5F56517ADFP#10 pinout, R5F56517ADFP#10 application, or R5F56517ADFP#10 equivalent, key selection criteria include its 176-pin LFBGA (PLQP0176KB-A) package, dual-bank flash for safe firmware updates, 12-bit A/D (21-channel unit), 2-channel D/A, and IEC60730-compliant safety features including TSIP, CRCA, and register write protection.

Technical Context

The R5F56517ADFP#10 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports both little- and big-endian data arrangement and includes two multiply-and-accumulate units plus a 32-bit multiplier executing in one cycle and divider in two cycles.

Its clock system combines external crystal/resonator support (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO, HOCO, IWDT-dedicated), with independent clock domains: ICLK (up to 120 MHz for CPU), PCLKA (120 MHz for ETHERC/DRW2D), PCLKB (60 MHz for most peripherals), and dedicated ADCLKs (60 MHz). The MPU enforces eight configurable memory protection regions down to 16-byte granularity.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517ADFP#10, R5F5651EDFP#10 offers reduced memory and no dual-bank flash but identical footprint and peripheral count, while R7FA6M2AF3CFP#AA0 delivers significantly higher CPU performance and EtherCAT readiness at the cost of software requalification and higher power consumption.

Availability

R5F56517ADFP#10 is available at Aetrix Electronics and suitable for industrial HMI, secure IoT gateways, medical data loggers, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56517ADFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power management, and SoC solutions for automotive, industrial, and enterprise markets.

The RX65N Group - including R5F56517ADFP#10 - was designed for high-integrity, connectivity-rich industrial applications demanding integrated security, graphics, real-time control, and functional safety certification support.

FAQ

What is the maximum operating frequency and core type of the R5F56517ADFP#10?

The R5F56517ADFP#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core delivers 240 DMIPS and includes a single-precision IEEE-754 floating-point unit, two multiply-and-accumulate units, and a 5-stage pipeline with variable-length instructions for high code density. Its architecture supports both little- and big-endian data formats and includes memory protection unit (MPU) support.

Does the R5F56517ADFP#10 support dual-bank flash memory operation?

Yes, the R5F56517ADFP#10 supports dual-bank flash memory operation, enabling background programming and safe firmware updates without interrupting program execution. This feature allows one bank to be read while the other is being programmed or erased, facilitating robust over-the-air (OTA) update mechanisms essential for industrial and medical applications requiring high system availability.

What peripheral interfaces does the R5F56517ADFP#10 include for industrial connectivity?

The R5F56517ADFP#10 includes Ethernet MAC (10/100 Mbps MII/RMII), two ISO11898-1 CAN channels (32 mailboxes each), three RSPI interfaces, one QSPI, three I²C buses (up to 1 Mbps), 13 SCI channels (with UART, SPI, I²C, and smart-card modes), USB 2.0 Full-Speed host/function/OTG, SD host/slave, and MMCIF. These interfaces collectively support complex industrial networking, fieldbus bridging, and multimedia peripheral integration.

How does the R5F56517ADFP#10 meet IEC60730 Class B safety requirements?

The R5F56517ADFP#10 meets IEC60730 Class B requirements through integrated hardware safety features: oscillation-stop detection, CRCA (CRC calculator), self-diagnostic A/D converter, independent watchdog timer (IWDT) with windowing, register write protection, and Trusted Secure IP (TSIP) for cryptographic integrity. These features enable certified runtime diagnostics and fault detection without external components, reducing system-level certification effort.

What is the package type and thermal specification of the R5F56517ADFP#10?

The R5F56517ADFP#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C), features an exposed thermal pad for enhanced heat dissipation, and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).