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Renesas R5F56517AGFB#10
- Part No.:
- R5F56517AGFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517AGFB#10.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,089
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Product details
Overview
R5F56517AGFB#10 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and connected gateway applications.
For engineers reviewing the R5F56517AGFB#10 datasheet, R5F56517AGFB#10 pinout, R5F56517AGFB#10 application, or R5F56517AGFB#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C operating range (G-version), dual-bank flash for safe firmware updates, and hardware-accelerated AES/TSIP security functions.
Technical Context
The R5F56517AGFB#10 implements the RXv2 CPU core with 5-stage CISC Harvard pipeline, variable-length instructions, and memory protection unit (MPU) supporting eight configurable regions. It integrates dedicated clocks for subsystems: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for Ethernet/DRW2D/GLCDC, and PCLKB up to 60 MHz for timers and ADC.
Its peripheral architecture features event linking (ELC) enabling direct hardware interconnection of 83 internal signals-e.g., MTU3 timer output triggering S12AD conversion without CPU intervention-and supports simultaneous operation of multiple high-bandwidth interfaces including 100-Mbps Ethernet (MII/RMII), dual CAN channels (32 mailboxes each), and SDHI/SDSI with 25 MB/s high-speed mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU |
| Memory | 2 MB dual-bank code flash (0-wait ≤50 MHz), 640 KB SRAM (no wait states), 32 KB data flash (100k erase cycles) |
| Package | 176-pin LFBGA (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, G-version (–40°C to +105°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1), SDHI/SDSI, QSPI, 3× RSPI, 13× SCI, 3× I2C, USB 2.0 FS host/function |
| Analog | Two 12-bit ADC units (8 + 21 ch), 2× 12-bit DAC, on-chip temperature sensor (±1°C) |
| Security | AES-128/192/256, Trusted Secure IP (TSIP), MPU, register write protection, CRC calculator (8/32-bit) |
| Graphics | GLCDC (3-plane overlay), DRW2D engine (vector/bit-blit), PDC for CMOS camera interface |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails; AVCC1 powers ADC/DAC reference; all require 2.7–3.6 V |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; connects to coin cell or backup source |
| EXTAL / XTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation |
| MD0 / MD1 | Mode setting pins | Determine boot mode (single-chip, SCI/USB/FINE boot) at reset release |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO/MDC for PHY configuration and status monitoring |
| ETXD0–ETXD3 / ETX_EN / ETX_CLK | Ethernet transmit signals | MII interface outputs; support 10/100 Mbps full/half-duplex with flow control (IEEE 802.3x) |
| ERXD0–ERXD3 / ERX_DV / ERX_ER | Ethernet receive signals | MII interface inputs; support Magic Packet™ detection and wake-on-LAN signaling |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting SD Memory Card v3.01 and SDIO v3.00; 25 MB/s high-speed mode |
| CAN0_TX / CAN0_RX | Channel 0 CAN transceiver I/O | Differential bus interface compliant with ISO 11898-1; 32 mailbox buffers with FIFO and filtering |
| QSPI_IO0–3 / QSPI_SCK / QSPI_SSL | Quad SPI interface | Supports single/dual/quad I/O modes for serial flash memory; programmable clock phase/polarity |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables background programming and seamless bank switching for zero-downtime firmware updates in field-deployed systems |
| Event Link Controller (ELC) | Hardware routing of 83 internal signals eliminates CPU overhead for time-critical peripheral coordination (e.g., timer-triggered ADC sampling) |
| Trusted Secure IP (TSIP) | On-die cryptographic accelerator supporting AES encryption/decryption and secure key storage, certified per IEC 60730 Class B |
| GLCDC + DRW2D graphics pipeline | Integrated LCD controller with 3-layer overlay and hardware-accelerated 2D drawing enables responsive GUI rendering without external GPU |
| SDHI/SDSI dual-mode interface | Single controller supports both SD host (for memory cards) and SD slave (for SDIO peripherals), reducing BOM count in embedded gateway designs |
Applications
| Industrial HMI Panel | Smart Gateway Device |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time diagnostics and alarm logging. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving 480×272 RGB LCD via GLCDC, capturing sensor data via 12-bit ADC, and communicating over CAN/Ethernet. Use Value: Dual-bank flash allows secure OTA firmware updates without halting HMI operation; DRW2D accelerates button animations and graph rendering at 60 fps. | Use Scenario: Edge node aggregating data from Modbus RTU sensors, translating to MQTT over TLS, and forwarding to cloud via Ethernet/WiFi bridge. IC Role / Device Role / Timing Role: Protocol translation hub with Ethernet MAC, dual CAN, SDHI for local logging, and TSIP for TLS handshake acceleration. Use Value: Hardware AES/TSIP reduces TLS handshake latency by >70% vs. software-only; SDHI+SDSI enables dual-role storage (host) and peripheral (slave) in compact footprint. |
| Connected Energy Meter | Medical Data Logger |
Use Scenario: DIN-rail mounted meter with pulse counting, tariff scheduling, and remote firmware update via Ethernet. IC Role / Device Role / Timing Role: Real-time data acquisition engine with RTC calendar, 12-bit ADC for voltage/current sensing, and Ethernet MAC for utility network integration. Use Value: RTC with battery backup maintains accurate time stamping during mains failure; dual CAN supports legacy building automation protocols alongside new Ethernet infrastructure. | Use Scenario: Portable patient monitor recording ECG, SpO₂, and temperature, storing encrypted logs to microSD, and syncing via USB host. IC Role / Device Role / Timing Role: Safety-certified data concentrator with IEC 60730-compliant self-test, temperature sensor, 12-bit ADC for analog biosignals, and SDHI for HIPAA-compliant storage. Use Value: On-chip CRC calculator and register write protection satisfy Class B functional safety requirements; buffered DAC outputs calibrated analog test signals for sensor validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#10 | Same RX65N Group, identical 176-pin LFBGA package, but 1 MB code flash and 256 KB SRAM (vs. 2 MB/640 KB) | Suitable for cost-sensitive designs where full memory capacity is not required; lacks dual-bank flash for atomic updates | Select when firmware size < 1 MB and background programming is not mandatory |
| R5F566TEADFP#30 | RX66T Group part; 160 MHz CPU, 1.5 MB flash, 384 KB RAM, enhanced PWM (3-phase inverter control), no Ethernet or GLCDC | Optimized for motor control with advanced MTU3 timers and POE3; lacks connectivity peripherals needed for gateway/HMI roles | Select for servo drive or inverter applications requiring high-resolution PWM and encoder interfaces |
Compared with R5F56517AGFB#10, R5F5651EDFBL#10 offers reduced memory at lower cost but sacrifices dual-bank update capability, while R5F566TEADFP#30 delivers higher CPU performance and motor control features but omits Ethernet, SD, and graphics engines essential for connected HMI systems.
Availability
R5F56517AGFB#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, connected medical loggers, and factory automation controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F56517AGFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX65N Group-including R5F56517AGFB#10-is designed for high-integration industrial edge devices requiring real-time processing, rich connectivity (Ethernet/CAN/SD), graphics capability, and functional safety compliance (IEC 60730).
FAQ
What is the maximum operating frequency and CPU architecture of the R5F56517AGFB#10?
The R5F56517AGFB#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with 5-stage pipeline, variable-length instructions, and Harvard architecture. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit (FPU) for deterministic math-intensive tasks in industrial control algorithms.
Does the R5F56517AGFB#10 support dual-bank flash for safe firmware updates?
Yes, the R5F56517AGFB#10 includes a dual-bank code flash memory structure enabling background programming and atomic bank switching. This allows one bank to execute active firmware while the other is being reprogrammed-critical for zero-downtime over-the-air (OTA) updates in deployed R5F56517AGFB#10-based systems.
What graphics and display capabilities does the R5F56517AGFB#10 provide?
The R5F56517AGFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing and bit-blitting. It supports RGB, CLUT, and YUV formats up to 16 bpp and drives common parallel LCD panels without external frame buffer memory.
Which communication interfaces are integrated into the R5F56517AGFB#10?
The R5F56517AGFB#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), two CAN 2.0B channels (32 mailboxes each), SD host/slave interfaces (25 MB/s), quad SPI, three RSPI, 13 SCI channels, three I2C buses (1 Mbps), USB 2.0 FS host/function, and a parallel data capture unit (PDC) for CMOS camera input.
Is the R5F56517AGFB#10 qualified for industrial temperature operation?
Yes, the R5F56517AGFB#10 is the G-version part rated for –40°C to +105°C operation, packaged in a 176-pin LFBGA (PLQP0176KB-A). Its design includes low-power modes, RTC battery backup (VBATT), and voltage monitoring circuits (LVDA) meeting industrial environmental and reliability requirements.
R5F56517AGFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517AGFB#10 FAQ
1.How can I place an order for R5F56517AGFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517AGFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517AGFB#10 reliable?
The price and inventory of R5F56517AGFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517AGFB#10 is usually 5 days.
3.What payment methods are accepted for R5F56517AGFB#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517AGFB#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517AGFB#10?
R5F56517AGFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517AGFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517AGFB#10?
For technical support, including R5F56517AGFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517AGFB#10 requirements.
6.How does Aetrix verify that R5F56517AGFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F56517AGFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517AGFB#10 meets industry standards.
7.What is the process for return or replacement of R5F56517AGFB#10?
All R5F56517AGFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517AGFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517AGFB#10 part is unused and in its original packaging.
Return procedure for R5F56517AGFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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