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Renesas R5F56517AGFB#30
- Part No.:
- R5F56517AGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517AGFB#30.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:240
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Product details
Overview
R5F56517AGFB#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI applications.
For engineers reviewing the R5F56517AGFB#30 datasheet, R5F56517AGFB#30 pinout, R5F56517AGFB#30 application, or R5F56517AGFB#30 equivalent, key selection criteria include dual-bank flash for safe firmware updates, 136 GPIO with 5-V tolerance, RTC with battery backup, AES-128/192/256 encryption, and IEC60730 safety support including CRC, IWDT, and self-diagnostic A/D.
Technical Context
The R5F56517AGFB#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates a memory protection unit (MPU) with eight configurable regions and Trusted Memory (TM) for secure code execution in the flash target area.
Clock management includes PLL-based system clock up to 120 MHz (ICLK), independent peripheral clocks (PCLKA/B/C/D up to 120/60/60/60 MHz), and dedicated IWDT oscillator at 120 kHz. Power management supports four low-power modes, deep software standby with 8 KB backup RAM, and RTC operation from VBATT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Flash Memory | 1.5 MB code flash with dual-bank structure enabling background programming and safe bank switching |
| RAM | 640 KB SRAM (256 KB main + 384 KB expansion), zero-wait access at 120 MHz |
| Peripherals | Ethernet MAC (10/100 Mbps), CAN (2 channels, 32 mailboxes each), SDHI/SDSI/MMCIF, QSPI, GLCDC, DRW2D, PDC |
| Analog | Two 12-bit A/D units (8 + 21 channels), 2-channel 12-bit D/A, on-chip temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256, TSIP, MPU, TM, CRCA, IWDT with window function, A/D self-diagnostic, register write protection |
| Package | LFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, –40°C to +105°C (G-version) |
Pinout & Package
LFBGA-176 package (PLQP0176KB-A), 24 × 24 mm body, 0.5-mm ball pitch, 136 general-purpose I/O pins with 5-V tolerance, open-drain capability, and programmable pull-up resistors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core (2.7–3.6 V), analog unit 0, and analog unit 1 supplies; separate domains enable noise isolation |
| VBATT | Battery backup input | Supplies RTC during main power loss; enables calendar/timekeeping in deep software standby |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation and RTC reference |
| RES# | Active-low reset input | Hardware reset assertion; synchronous release ensures deterministic startup sequence |
| MD0 / MD1 | Mode setting pins | Select boot mode (SCI/USB/FINE) or single-chip operation at power-on reset |
| ETH_MDC / ETH_MDIO | IEEE 802.3 MII/RMII management interface | Configure PHY registers via SMI; essential for Ethernet link initialization and status monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates without halting real-time operation; one bank executes while the other is reprogrammed |
| Integrated GLCDC + DRW2D | Hardware-accelerated 2D graphics rendering and multi-plane LCD composition eliminate CPU load for HMI frame generation |
| IEC60730 Class B compliance support | Includes oscillation-stop detection, CRC calculator (CRCA), IWDT with windowing, A/D self-test, and register lock mechanisms |
| Flexible clock domain partitioning | Independent PCLKA (120 MHz for ETHERC/EDMAC/GLCDC), PCLKB (60 MHz for timers/A/D), and ADCLK domains optimize performance vs. power |
| Event Link Controller (ELC) | 83 internal event signals routed without CPU intervention-e.g., TPU trigger → A/D start → DMA transfer → interrupt |
Applications
| Industrial HMI Panel | Building Automation Gateway |
|---|---|
Use Scenario: Standalone touch-enabled display with local logic, Ethernet connectivity, and SD card logging. IC Role / Device Role / Timing Role: Main application processor managing GLCDC, DRW2D, touchscreen interface, Ethernet MAC, and SDHI. Use Value: Integrated graphics engine and 640 KB SRAM eliminate external frame buffer; dual-bank flash enables remote OTA updates without downtime. |
Use Scenario: Protocol translator bridging BACnet/IP, Modbus TCP, and CAN bus subsystems in HVAC controllers. IC Role / Device Role / Timing Role: Central protocol stack executor with dual CAN channels, Ethernet MAC, and multiple SCI/RSPI interfaces. Use Value: Hardware CRC, IWDT, and MPU meet functional safety requirements for building control; 136 GPIO support diverse sensor/actuator I/O. |
| Medical Device Controller | Smart Energy Meter Hub |
Use Scenario: Portable diagnostic device requiring secure data handling, real-time waveform capture, and USB host for peripheral attachment. IC Role / Device Role / Timing Role: Secure application controller with AES encryption, 12-bit A/D (21-channel), USB 2.0 FS host, and PDC for camera input. Use Value: TSIP and Trusted Memory protect firmware integrity; A/D self-diagnostic satisfies IEC62304 safety classification. |
Use Scenario: Two-way AMI meter hub aggregating data from PLC, RF, and optical interfaces with tamper detection and secure firmware updates. IC Role / Device Role / Timing Role: Secure data concentrator with AES crypto, RTC with battery backup, SDHI for local storage, and multiple communication peripherals. Use Value: Dual-bank flash and background programming ensure fail-safe field upgrades; temperature sensor monitors environmental derating conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#30 | LQFP-176 package (20 × 20 mm), same 1.5 MB flash, 640 KB SRAM, identical peripheral set but different thermal and mechanical footprint | Suitable where board-level rework, manual soldering, or legacy LQFP tooling is required instead of BGA assembly | Select when PCB assembly process lacks BGA reflow capability or thermal management favors larger exposed pad |
| R5F56519ADFE#30 | 2 MB flash, same 640 KB SRAM, identical peripherals, but rated only for –40°C to +85°C (D-version) and uses LFBGA-176 | Preferred for cost-sensitive industrial applications needing larger firmware space but not extended temperature operation | Choose when firmware size exceeds 1.5 MB and ambient temperature stays ≤85°C; no change to layout or drivers required |
Compared with R5F56517AGFB#30, the R5F5651EDFBL#30 offers identical functionality in LQFP-176 for easier prototyping, while R5F56519ADFE#30 provides 512 KB more flash at standard temperature grade-both require no firmware modification but differ in thermal rating and package assembly requirements.
Availability
R5F56517AGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, building automation gateways, medical device controllers, and smart energy meter hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature conditions.
Supply support for R5F56517AGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX65N Group-including R5F56517AGFB#30-is designed for high-integration industrial applications demanding rich connectivity (Ethernet, CAN, SD), advanced graphics (GLCDC/DRW2D), security (AES/TSIP), and functional safety (IEC60730).
FAQ
What is the maximum operating frequency and core type of the R5F56517AGFB#30?
The R5F56517AGFB#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its CISC Harvard architecture includes a 5-stage pipeline and variable-length instructions for compact code density. The core supports single-precision IEEE-754 floating-point operations and includes two multiply-and-accumulate units, making the R5F56517AGFB#30 suitable for real-time control and signal processing tasks in industrial applications.
Does the R5F56517AGFB#30 support secure firmware updates and cryptographic functions?
Yes, the R5F56517AGFB#30 integrates AES-128/192/256 encryption engines, Trusted Secure IP (TSIP), and Trusted Memory (TM) to protect code in flash against unauthorized readout. Its dual-bank flash architecture allows background programming-enabling one bank to execute while the other is updated-ensuring zero-downtime firmware updates. These capabilities make the R5F56517AGFB#30 compliant with IEC60730 Class B safety requirements for secure field deployments.
What display and graphics capabilities does the R5F56517AGFB#30 provide?
The R5F56517AGFB#30 includes a Graphic-LCD Controller (GLCDC) supporting up to three overlay planes (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, rotation, and scaling. It supports 32-/16-/8-bit pixel formats and CLUT-based color lookup tables. These features allow the R5F56517AGFB#30 to drive high-resolution TFT displays without external graphics memory, reducing BOM cost and simplifying HMI design for industrial panels.
How many communication interfaces does the R5F56517AGFB#30 integrate, and which are supported?
The R5F56517AGFB#30 integrates Ethernet MAC (10/100 Mbps), two CAN 2.0B channels (32 mailboxes each), three RSPI channels, one QSPI channel, three I²C interfaces (up to 1 Mbps), 13 SCI channels (asynchronous/synchronous/Smart Card/I²C/SPI modes), SD host/slave interfaces, and USB 2.0 FS host/function with OTG. This comprehensive peripheral set enables the R5F56517AGFB#30 to serve as a central protocol gateway in complex industrial systems without external bridge ICs.
What is the operating temperature range and package type of the R5F56517AGFB#30?
The R5F56517AGFB#30 is offered in the G-version with an operating temperature range of –40°C to +105°C and packaged in a 176-ball LFBGA (PLQP0176KB-A) with 24 × 24 mm body and 0.5-mm pitch. This package supports 136 GPIO with 5-V tolerance, open-drain outputs, and programmable pull-up resistors-making the R5F56517AGFB#30 ideal for harsh industrial environments requiring thermal robustness and high I/O flexibility.
R5F56517AGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517AGFB#30 FAQ
1.How can I place an order for R5F56517AGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517AGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517AGFB#30 reliable?
The price and inventory of R5F56517AGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517AGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56517AGFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517AGFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517AGFB#30?
R5F56517AGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517AGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517AGFB#30?
For technical support, including R5F56517AGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517AGFB#30 requirements.
6.How does Aetrix verify that R5F56517AGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56517AGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517AGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56517AGFB#30?
All R5F56517AGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517AGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517AGFB#30 part is unused and in its original packaging.
Return procedure for R5F56517AGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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