Renesas R5F56517AGFP#30
- Part No.:
- R5F56517AGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56517AGFP#30.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:270
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56517AGFP#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 1.5-Mbyte on-chip code flash memory, 640-Kbyte SRAM (256-Kbyte main + 384-Kbyte expansion), and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC. It serves as a high-integration application processor for industrial HMI, networked gateways, and secure IoT edge nodes requiring real-time control, graphics rendering, and connectivity.
For engineers reviewing the R5F56517AGFP#30 datasheet, R5F56517AGFP#30 pinout, R5F56517AGFP#30 application, or R5F56517AGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package, dual-bank flash architecture enabling background programming, TSIP-based AES-128/192/256 encryption, 12-bit dual A/D converters (29 total channels), and support for IEC60730 safety compliance via CRC, self-diagnostic A/D, and register write protection.
Technical Context
The R5F56517AGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code density and deterministic interrupt latency. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, with independent domain clocks (ICLK up to 120 MHz, PCLKA up to 120 MHz for ETHERC/GLCDC/DRW2D, PCLKB up to 60 MHz for most peripherals).
It features a modular peripheral set including Ethernet MAC with RMII/MII, two CAN 2.0B channels (32 mailboxes each), 13 SCI channels (asynchronous/smart-card/SPI/I²C modes), three RSPI, one QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera input, GLCDC with 3-plane overlay, and DRW2D hardware-accelerated 2D graphics engine-all coordinated via Event Link Controller (ELC) for CPU-offload event chaining.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Flash Memory | 1.5 Mbytes code flash with dual-bank structure; supports background programming/erasing and bank swap at runtime |
| SRAM | 640 Kbytes total: 256 Kbytes main RAM + 384 Kbytes expansion RAM; zero-wait-state access @ 120 MHz |
| Analog Peripherals | Two 12-bit A/D units (8 + 21 channels), two 12-bit D/A channels, on-chip temperature sensor (±1°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN 2.0B, 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF, USB 2.0 FS host/function/OTG |
| Graphics & Imaging | GLCDC supporting 3-plane overlay and multiple LCD data formats; DRW2D engine for vector drawing, bit blitting, rotation, and texture mapping |
| Security | Trusted Secure IP (TSIP) with AES-128/192/256, CRC calculator (8/32-bit), MPU (8 regions), register write protection, and IEC60730 diagnostic functions |
Pinout & Package
R5F56517AGFP#30 is housed in a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5-mm pitch) with 136 general-purpose I/O pins-19 of which are 5-V tolerant, all supporting pull-up, open-drain, and switchable drive strength.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) supplies; enables noise isolation for ADC/DAC operation |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation and RTC reference |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status monitoring |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet data lanes | 4-bit transmit/receive data paths for MII mode; reduced to 2-bit for RMII operation |
| USB_DP / USB_DM | USB 2.0 differential data pair | Full-speed (12 Mbps) transceiver interface with integrated termination; no external resistors required |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); includes card detection and write-protect sensing |
| QSPI_IO0–3 / QSPI_CLK / QSPI_SSL | Quad SPI interface | Enables direct XIP and fast read/write to serial NOR flash with quad I/O and configurable clock phase/polarity |
| GLCD_D0–23 / GLCD_HSYNC / VSYNC / DE | Graphic LCD controller outputs | 24-bit RGB parallel interface with timing control signals for direct connection to TFT panels up to WXGA resolution |
Key Features
| Feature | Design Value |
|---|---|
| Floating-point unit (FPU) | Single-precision IEEE-754 compliant; accelerates motor control algorithms, sensor fusion, and real-time signal processing without software emulation overhead |
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating system downtime during field upgrades |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES encryption/decryption with key wrapping and secure key storage-meets requirements for secure boot and OTA update integrity |
| Event Link Controller (ELC) | Allows 83 internal peripheral events (e.g., timer overflow, A/D conversion complete) to trigger actions in other modules without CPU intervention, reducing latency and ISR load |
| IEC60730 safety support | Includes oscillation-stop detection, CRC calculation, self-diagnostic A/D, and register write protection-reducing effort needed for Class B certification in industrial appliances |
Applications
| Industrial HMI Panel | Smart Energy Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with local data logging and remote diagnostics via Ethernet. IC Role / Device Role / Timing Role: Primary application processor executing GUI framework (via GLCDC+DRW2D), managing Ethernet/USB/SDI communication, and performing real-time motion control loops using FPU and TPU/MTU3 timers. Use Value: Integrated graphics engine eliminates need for external GPU; dual-bank flash enables safe over-the-air UI updates; TSIP secures firmware integrity against tampering. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU data from field sensors and forwarding to cloud via Ethernet or cellular modem. IC Role / Device Role / Timing Role: Central protocol translator and data concentrator-running embedded Linux or bare-metal stack, handling CAN/SCI/RSPI fieldbus interfaces, SDHI for local logging, and Ethernet for upstream transport. Use Value: 136 GPIOs accommodate diverse fieldbus connectors; 29-channel A/D supports analog sensor inputs; IEC60730 features simplify functional safety validation for energy metering applications. |
| Secure IoT Edge Node | Networked Medical Device |
Use Scenario: Connected patient monitor collecting ECG, SpO₂, and temperature data, encrypting payloads locally before transmission to hospital network. IC Role / Device Role / Timing Role: Safety-certified data acquisition and security co-processor-using TSIP for AES encryption, self-diagnostic A/D for sensor health monitoring, and RTC with battery backup for time-stamped logs. Use Value: On-chip AES-256 and secure key storage prevent plaintext exposure; temperature sensor and A/D disconnection detection ensure sensor reliability; standby RAM preserves context during low-power sleep. | Use Scenario: Portable ultrasound device requiring real-time image capture from CMOS sensor, hardware-accelerated display rendering, and USB host for probe firmware updates. IC Role / Device Role / Timing Role: Imaging subsystem controller-driving PDC for raw sensor capture, GLCDC for panel output, DRW2D for ROI highlighting and annotation, and USB host for peripheral management. Use Value: Parallel data capture unit supports 8-bit YUV/RGB video streams; 24-bit RGB interface drives high-resolution displays; USB host capability enables plug-and-play probe calibration and firmware loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group, identical 176-pin LFBGA package, but with 2-Mbyte flash and 640-Kbyte SRAM; otherwise functionally identical peripheral set | Preferred where larger firmware footprint or dual-application partitioning is required; same pinout and thermal profile | Select R5F5651EDFP#30 when >1.5 Mbytes flash is needed for bootloader + application separation or future feature expansion |
| R5F566TEADFP#30 | RX66T Group part; higher 160-MHz CPU, enhanced MTU3-Timer for motor control (3-phase PWM with dead-time compensation), no GLCDC/DRW2D, different pinout (144-pin LQFP) | Targeted at servo drives and inverters; lacks graphics and SD interfaces but adds advanced motion control peripherals | Choose R5F566TEADFP#30 only for high-performance motor control applications requiring <100-ns PWM dead-time accuracy and no display requirements |
Compared with R5F56517AGFP#30, R5F5651EDFP#30 offers increased flash capacity without layout change, while R5F566TEADFP#30 trades graphics and storage interfaces for superior motor control timing precision and higher CPU throughput-making them non-interchangeable without hardware and firmware redesign.
Availability
R5F56517AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart energy gateways, and secure IoT edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp-up.
Supply support for R5F56517AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX65N Group-including R5F56517AGFP#30-is designed for high-integrity industrial and IoT edge applications demanding integrated connectivity (Ethernet/CAN/USB), graphics capability, functional safety support, and hardware security acceleration.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F56517AGFP#30?
The R5F56517AGFP#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit, 32-bit multiplier, and divider-enabling deterministic real-time execution for industrial control and signal processing tasks within the R5F56517AGFP#30.
Does the R5F56517AGFP#30 support secure firmware updates and cryptographic operations?
Yes, the R5F56517AGFP#30 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption/decryption with secure key storage, plus CRC calculation (8/32-bit), memory protection unit (MPU), and register write protection. These features enable secure boot, authenticated OTA updates, and IEC60730 Class B compliance-making the R5F56517AGFP#30 suitable for safety-critical and regulated deployments.
What graphics and display capabilities does the R5F56517AGFP#30 provide?
The R5F56517AGFP#30 includes a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output, 3-plane overlay (background, graphic 1, graphic 2), and multiple pixel formats (32/16/8/4/1 bpp). It also integrates a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, rotation, and texture mapping-enabling responsive GUIs on TFT panels up to WXGA resolution without external graphics ICs in the R5F56517AGFP#30.
How many analog-to-digital converter channels does the R5F56517AGFP#30 have, and what are their key specifications?
The R5F56517AGFP#30 integrates two 12-bit A/D converter units: S12AD0 with 8 channels and S12AD1 with 21 channels, totaling 29 configurable analog inputs. Conversion time is 0.48 µs per channel at 12-bit resolution, with selectable 8/10/12-bit modes, sample-and-hold circuitry, digital comparison, self-diagnostic function, and disconnection detection-providing robust sensor interfacing across industrial and medical applications using the R5F56517AGFP#30.
What package type and pin count does the R5F56517AGFP#30 use, and what I/O features are supported?
The R5F56517AGFP#30 uses a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5-mm pitch) with 136 general-purpose I/O pins. All pins support pull-up resistors and open-drain output; 19 pins are 5-V tolerant. Drive strength is switchable, and ports B/E support event linking for hardware-triggered state changes-ensuring flexible, noise-resilient interfacing in harsh industrial environments for the R5F56517AGFP#30.
R5F56517AGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517AGFP#30 FAQ
1.How can I place an order for R5F56517AGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517AGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517AGFP#30 reliable?
The price and inventory of R5F56517AGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517AGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F56517AGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517AGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517AGFP#30?
R5F56517AGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517AGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517AGFP#30?
For technical support, including R5F56517AGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517AGFP#30 requirements.
6.How does Aetrix verify that R5F56517AGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56517AGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517AGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56517AGFP#30?
All R5F56517AGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517AGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517AGFP#30 part is unused and in its original packaging.
Return procedure for R5F56517AGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56517AGFP#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

