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Renesas R5F56517AGFP#30

Part No.:
R5F56517AGFP#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F56517AGFP#30.pdf
Description:
IC MCU 32BIT 768KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:270

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Product details

Overview

R5F56517AGFP#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 1.5-Mbyte on-chip code flash memory, 640-Kbyte SRAM (256-Kbyte main + 384-Kbyte expansion), and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC. It serves as a high-integration application processor for industrial HMI, networked gateways, and secure IoT edge nodes requiring real-time control, graphics rendering, and connectivity.

For engineers reviewing the R5F56517AGFP#30 datasheet, R5F56517AGFP#30 pinout, R5F56517AGFP#30 application, or R5F56517AGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package, dual-bank flash architecture enabling background programming, TSIP-based AES-128/192/256 encryption, 12-bit dual A/D converters (29 total channels), and support for IEC60730 safety compliance via CRC, self-diagnostic A/D, and register write protection.

Technical Context

The R5F56517AGFP#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions-enabling ultra-compact code density and deterministic interrupt latency. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, with independent domain clocks (ICLK up to 120 MHz, PCLKA up to 120 MHz for ETHERC/GLCDC/DRW2D, PCLKB up to 60 MHz for most peripherals).

It features a modular peripheral set including Ethernet MAC with RMII/MII, two CAN 2.0B channels (32 mailboxes each), 13 SCI channels (asynchronous/smart-card/SPI/I²C modes), three RSPI, one QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera input, GLCDC with 3-plane overlay, and DRW2D hardware-accelerated 2D graphics engine-all coordinated via Event Link Controller (ELC) for CPU-offload event chaining.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz
Flash Memory1.5 Mbytes code flash with dual-bank structure; supports background programming/erasing and bank swap at runtime
SRAM640 Kbytes total: 256 Kbytes main RAM + 384 Kbytes expansion RAM; zero-wait-state access @ 120 MHz
Analog PeripheralsTwo 12-bit A/D units (8 + 21 channels), two 12-bit D/A channels, on-chip temperature sensor (±1°C)
ConnectivityEthernet MAC (10/100 Mbps, MII/RMII), 2× CAN 2.0B, 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF, USB 2.0 FS host/function/OTG
Graphics & ImagingGLCDC supporting 3-plane overlay and multiple LCD data formats; DRW2D engine for vector drawing, bit blitting, rotation, and texture mapping
SecurityTrusted Secure IP (TSIP) with AES-128/192/256, CRC calculator (8/32-bit), MPU (8 regions), register write protection, and IEC60730 diagnostic functions

Pinout & Package

R5F56517AGFP#30 is housed in a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5-mm pitch) with 136 general-purpose I/O pins-19 of which are 5-V tolerant, all supporting pull-up, open-drain, and switchable drive strength.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsSeparate digital (VCC) and analog (AVCC0/AVCC1) supplies; enables noise isolation for ADC/DAC operation
XTAL / EXTALMain crystal oscillator terminalsSupports 8–24 MHz external crystal for precise system clock generation and RTC reference
ETH_MDC / ETH_MDIOEthernet management interfaceIEEE 802.3-compliant MDIO bus for PHY configuration and status monitoring
ETH_TXD0–3 / ETH_RXD0–3Ethernet data lanes4-bit transmit/receive data paths for MII mode; reduced to 2-bit for RMII operation
USB_DP / USB_DMUSB 2.0 differential data pairFull-speed (12 Mbps) transceiver interface with integrated termination; no external resistors required
SD0_CMD / SD0_CLK / SD0_DAT0–3SD host interface signals4-bit SD bus supporting high-speed mode (25 MB/s); includes card detection and write-protect sensing
QSPI_IO0–3 / QSPI_CLK / QSPI_SSLQuad SPI interfaceEnables direct XIP and fast read/write to serial NOR flash with quad I/O and configurable clock phase/polarity
GLCD_D0–23 / GLCD_HSYNC / VSYNC / DEGraphic LCD controller outputs24-bit RGB parallel interface with timing control signals for direct connection to TFT panels up to WXGA resolution

Key Features

FeatureDesign Value
Floating-point unit (FPU)Single-precision IEEE-754 compliant; accelerates motor control algorithms, sensor fusion, and real-time signal processing without software emulation overhead
Dual-bank flash architectureEnables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating system downtime during field upgrades
Trusted Secure IP (TSIP)Hardware-accelerated AES encryption/decryption with key wrapping and secure key storage-meets requirements for secure boot and OTA update integrity
Event Link Controller (ELC)Allows 83 internal peripheral events (e.g., timer overflow, A/D conversion complete) to trigger actions in other modules without CPU intervention, reducing latency and ISR load
IEC60730 safety supportIncludes oscillation-stop detection, CRC calculation, self-diagnostic A/D, and register write protection-reducing effort needed for Class B certification in industrial appliances

Applications

Industrial HMI PanelSmart Energy Gateway

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with local data logging and remote diagnostics via Ethernet.

IC Role / Device Role / Timing Role: Primary application processor executing GUI framework (via GLCDC+DRW2D), managing Ethernet/USB/SDI communication, and performing real-time motion control loops using FPU and TPU/MTU3 timers.

Use Value: Integrated graphics engine eliminates need for external GPU; dual-bank flash enables safe over-the-air UI updates; TSIP secures firmware integrity against tampering.

Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU data from field sensors and forwarding to cloud via Ethernet or cellular modem.

IC Role / Device Role / Timing Role: Central protocol translator and data concentrator-running embedded Linux or bare-metal stack, handling CAN/SCI/RSPI fieldbus interfaces, SDHI for local logging, and Ethernet for upstream transport.

Use Value: 136 GPIOs accommodate diverse fieldbus connectors; 29-channel A/D supports analog sensor inputs; IEC60730 features simplify functional safety validation for energy metering applications.

Secure IoT Edge NodeNetworked Medical Device

Use Scenario: Connected patient monitor collecting ECG, SpO₂, and temperature data, encrypting payloads locally before transmission to hospital network.

IC Role / Device Role / Timing Role: Safety-certified data acquisition and security co-processor-using TSIP for AES encryption, self-diagnostic A/D for sensor health monitoring, and RTC with battery backup for time-stamped logs.

Use Value: On-chip AES-256 and secure key storage prevent plaintext exposure; temperature sensor and A/D disconnection detection ensure sensor reliability; standby RAM preserves context during low-power sleep.

Use Scenario: Portable ultrasound device requiring real-time image capture from CMOS sensor, hardware-accelerated display rendering, and USB host for probe firmware updates.

IC Role / Device Role / Timing Role: Imaging subsystem controller-driving PDC for raw sensor capture, GLCDC for panel output, DRW2D for ROI highlighting and annotation, and USB host for peripheral management.

Use Value: Parallel data capture unit supports 8-bit YUV/RGB video streams; 24-bit RGB interface drives high-resolution displays; USB host capability enables plug-and-play probe calibration and firmware loading.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EDFP#30Same RX65N Group, identical 176-pin LFBGA package, but with 2-Mbyte flash and 640-Kbyte SRAM; otherwise functionally identical peripheral setPreferred where larger firmware footprint or dual-application partitioning is required; same pinout and thermal profileSelect R5F5651EDFP#30 when >1.5 Mbytes flash is needed for bootloader + application separation or future feature expansion
R5F566TEADFP#30RX66T Group part; higher 160-MHz CPU, enhanced MTU3-Timer for motor control (3-phase PWM with dead-time compensation), no GLCDC/DRW2D, different pinout (144-pin LQFP)Targeted at servo drives and inverters; lacks graphics and SD interfaces but adds advanced motion control peripheralsChoose R5F566TEADFP#30 only for high-performance motor control applications requiring <100-ns PWM dead-time accuracy and no display requirements

Compared with R5F56517AGFP#30, R5F5651EDFP#30 offers increased flash capacity without layout change, while R5F566TEADFP#30 trades graphics and storage interfaces for superior motor control timing precision and higher CPU throughput-making them non-interchangeable without hardware and firmware redesign.

Availability

R5F56517AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart energy gateways, and secure IoT edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp-up.

Supply support for R5F56517AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group-including R5F56517AGFP#30-is designed for high-integrity industrial and IoT edge applications demanding integrated connectivity (Ethernet/CAN/USB), graphics capability, functional safety support, and hardware security acceleration.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F56517AGFP#30?

The R5F56517AGFP#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit, 32-bit multiplier, and divider-enabling deterministic real-time execution for industrial control and signal processing tasks within the R5F56517AGFP#30.

Does the R5F56517AGFP#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56517AGFP#30 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption/decryption with secure key storage, plus CRC calculation (8/32-bit), memory protection unit (MPU), and register write protection. These features enable secure boot, authenticated OTA updates, and IEC60730 Class B compliance-making the R5F56517AGFP#30 suitable for safety-critical and regulated deployments.

What graphics and display capabilities does the R5F56517AGFP#30 provide?

The R5F56517AGFP#30 includes a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output, 3-plane overlay (background, graphic 1, graphic 2), and multiple pixel formats (32/16/8/4/1 bpp). It also integrates a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, rotation, and texture mapping-enabling responsive GUIs on TFT panels up to WXGA resolution without external graphics ICs in the R5F56517AGFP#30.

How many analog-to-digital converter channels does the R5F56517AGFP#30 have, and what are their key specifications?

The R5F56517AGFP#30 integrates two 12-bit A/D converter units: S12AD0 with 8 channels and S12AD1 with 21 channels, totaling 29 configurable analog inputs. Conversion time is 0.48 µs per channel at 12-bit resolution, with selectable 8/10/12-bit modes, sample-and-hold circuitry, digital comparison, self-diagnostic function, and disconnection detection-providing robust sensor interfacing across industrial and medical applications using the R5F56517AGFP#30.

What package type and pin count does the R5F56517AGFP#30 use, and what I/O features are supported?

The R5F56517AGFP#30 uses a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5-mm pitch) with 136 general-purpose I/O pins. All pins support pull-up resistors and open-drain output; 19 pins are 5-V tolerant. Drive strength is switchable, and ports B/E support event linking for hardware-triggered state changes-ensuring flexible, noise-resilient interfacing in harsh industrial environments for the R5F56517AGFP#30.

R5F56517AGFP#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56517AGFP#30 FAQ

1.How can I place an order for R5F56517AGFP#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56517AGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56517AGFP#30 reliable?

The price and inventory of R5F56517AGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517AGFP#30 is usually 5 days.

3.What payment methods are accepted for R5F56517AGFP#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517AGFP#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56517AGFP#30?

R5F56517AGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56517AGFP#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56517AGFP#30?

For technical support, including R5F56517AGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517AGFP#30 requirements.

6.How does Aetrix verify that R5F56517AGFP#30 is sourced from the original manufacturer or authorized distributors?

All R5F56517AGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517AGFP#30 meets industry standards.

7.What is the process for return or replacement of R5F56517AGFP#30?

All R5F56517AGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517AGFP#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56517AGFP#30 part is unused and in its original packaging.

Return procedure for R5F56517AGFP#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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