Renesas R5F56517AGLJ#20

Overview

R5F56517AGLJ#20 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and connected gateway applications.

For engineers reviewing the R5F56517AGLJ#20 datasheet, R5F56517AGLJ#20 pinout, R5F56517AGLJ#20 application, or R5F56517AGLJ#20 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +105°C G-grade operation, dual-bank flash for safe firmware updates, hardware-accelerated AES/TSIP security, and real-time clock with battery backup support.

Technical Context

The R5F56517AGLJ#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates a memory protection unit (MPU) and Trusted Memory (TM) for IEC60730-compliant safety-critical firmware execution.

Its clock system combines external crystal oscillators (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO/HOCO/IWDT-dedicated), with independent clock domains for ICLK (up to 120 MHz), PCLKA (up to 120 MHz), and PCLKB (up to 60 MHz) to optimize peripheral timing and power efficiency.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, 136 configurable I/O pins with 5-V tolerance on 19 pins, open-drain capability, and programmable pull-up resistors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517AGLJ#20, the R5F5651EDFP#30 reduces integration (no Ethernet/GLCDC) but offers LQFP ease-of-use, while the R5F566TEADFP#30 trades connectivity for superior motor-control peripherals-making R5F56517AGLJ#20 optimal for display-enabled, networked industrial edge devices.

Availability

R5F56517AGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, secure IoT endpoint, and automotive body control applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R5F56517AGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX65N Group-including R5F56517AGLJ#20-is designed for high-integration industrial edge devices requiring rich connectivity, graphics, security, and functional safety certification support.

FAQ

What is the maximum operating frequency and core architecture of the R5F56517AGLJ#20?

The R5F56517AGLJ#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit. This architecture enables deterministic real-time execution and ultra-compact code density essential for resource-constrained industrial applications.

Does the R5F56517AGLJ#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56517AGLJ#20 integrates hardware-accelerated AES-128/192/256 encryption and the Trusted Secure IP (TSIP) module for secure key storage, secure boot verification, and encrypted OTA firmware updates. Its dual-bank flash memory allows background programming and atomic bank switching-ensuring zero-downtime updates without compromising system integrity or security posture.

What display and graphics capabilities does the R5F56517AGLJ#20 provide?

The R5F56517AGLJ#20 includes a dedicated Graphic-LCD Controller (GLCDC) supporting up to WVGA resolution and a 2D Drawing Engine (DRW2D) with vector drawing, bit blitting, rotation, and scaling. It supports 32-/16-bpp graphics and CLUT formats, eliminating the need for external graphics RAM or controllers-enabling cost-effective, high-performance human-machine interfaces directly driven by the MCU.

Which communication interfaces are integrated into the R5F56517AGLJ#20 for industrial networking?

The R5F56517AGLJ#20 integrates Ethernet MAC (10/100 Mbps MII/RMII), dual-channel CAN (ISO 11898-1), USB 2.0 FS host/function, SD host/slave, QSPI, three I²C channels, eleven SCI channels, and three RSPI channels. This comprehensive suite enables simultaneous protocol bridging-such as CAN-to-Ethernet translation in smart gateways-without external interface ICs or FPGA logic.

What is the operating temperature range and package type of the R5F56517AGLJ#20?

The R5F56517AGLJ#20 is rated for industrial operation from –40°C to +105°C (G-version) and housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5-mm pitch. This package provides 136 general-purpose I/O pins, 19 of which are 5-V tolerant, supporting robust interfacing in harsh environments.