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Renesas R5F56517BDFB#10
- Part No.:
- R5F56517BDFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517BDFB#10.pdf
- Description:
- IC MCU 32BIT 768KB FLSH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,510
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Product details
Overview
R5F56517BDFB#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz (240 DMIPS), featuring on-chip FPU, 2 MB flash, 640 KB SRAM, Ethernet MAC, dual CAN, SD host/slave, QSPI, and hardware AES-128/192/256 encryption - deployed in industrial HMI, networked gateway, and secure IoT edge controllers.
For engineers reviewing the R5F56517BDFB#10 datasheet, R5F56517BDFB#10 pinout, R5F56517BDFB#10 application, or R5F56517BDFB#10 equivalent, key selection criteria include its 176-pin LFBGA package, dual-bank flash for safe firmware updates, 12-bit dual A/D with self-diagnostic, integrated GLCDC + DRW2D for graphics acceleration, and IEC60730 safety support including CRC, IWDT, and register write protection.
Technical Context
The R5F56517BDFB#10 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, single-precision IEEE-754 FPU, and two multiply-accumulate units. It supports little- or big-endian data arrangement and executes instructions in one CPU clock cycle for 32×32→64-bit multiplication.
Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator. Peripheral clocks are independently configurable: PCLKA (up to 120 MHz) for ETHERC/EDMAC/AES/GLCDC/DRW2D, PCLKB (up to 60 MHz) for most timers and interfaces, and dedicated ADCLKs (PCLKC/PCLKD) for dual 12-bit A/D units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Flash Memory | 2 MB code flash with dual-bank structure enabling background programming and safe bank-swapping during runtime |
| SRAM | 640 KB on-chip SRAM (256 KB main + 384 KB expansion), zero-wait-state access at 120 MHz |
| A/D Converter | Dual 12-bit S12AD: Unit 0 (8 ch), Unit 1 (21 ch); 0.48 µs conversion time; self-diagnostic and disconnection detection |
| Connectivity | Ethernet MAC (10/100 Mbps MII/RMII), 2× CAN (ISO11898-1, 32 mailboxes/channel), SDHI/SDSI/MMCIF, QSPI, 3× RSPI, 13× SCI, 3× RIIC |
| Security | Hardware AES engine (128/192/256-bit keys), Trusted Secure IP (TSIP), MPU (8 regions), TM function, CRC calculator (8/32-bit) |
| Package | LFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5 mm pitch, –40°C to +85°C (D-version) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 × 24 mm, 0.5 mm pitch, lead-free, RoHS compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-performance operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails ensure noise isolation for ADC/DAC and precision timing circuits |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise system clock generation and Ethernet timing compliance |
| ETH_MDC / ETH_MDIO | MDIO management interface | Enables configuration and status monitoring of external PHY via IEEE 802.3 clause 22/45 registers |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet data lanes | Supports MII (4-bit TX/RX) or RMII (2-bit TX/RX + REF_CLK) physical layer interfacing |
| CAN0_TX / CAN0_RX | Channel 0 CAN transceiver I/O | Differential signaling pins compliant with ISO11898-1; internal termination and filtering reduce external component count |
| QSPI_IO0–3 / QSPI_CLK / QSPI_CS | Quad SPI interface | Direct connection to quad-output serial flash (e.g., Winbond W25QxxQV) for XIP or fast boot image loading |
| SD0_CMD / SD0_CLK / SD0_DAT0–3 | SD host interface signals | Full 4-bit SD bus supporting SD memory cards and SDIO peripherals (e.g., Wi-Fi modules) at up to 25 MB/s |
| GLCD_D0–23 / GLCD_HSYNC / VSYNC | Graphic LCD controller outputs | 24-bit RGB parallel interface with programmable timing for TFT panels up to VGA resolution |
Key Features
| Feature | Design Value |
|---|---|
| Trusted Memory (TM) Function | Protects designated flash regions from read-out; only CPU instruction fetch is permitted - critical for secure bootloader and key storage |
| Event Link Controller (ELC) | 83 internal event signals routed without CPU intervention (e.g., TPU trigger → A/D start → DMA transfer → interrupt), reducing latency and CPU load |
| Graphics Acceleration | Integrated GLCDC + DRW2D enables hardware-accelerated 2D rendering (bit blit, rotation, vector draw) and triple-plane overlay for rich HMI without external GPU |
| IEC60730 Class B Support | Includes oscillation-stop detection, CRC calculator, IWDT with window function, A/D self-test, and register write protection - simplifies functional safety certification |
| Dual-Bank Flash Architecture | Enables seamless firmware updates: new image programmed into inactive bank while active bank continues execution; atomic bank swap on reset |
Applications
| Industrial HMI Controller | Secure Edge Gateway |
|---|---|
Use Scenario: Touch-enabled panel PC controlling PLCs, sensors, and actuators in factory automation. IC Role / Device Role / Timing Role: Main application processor running RTOS, driving 480×272 TFT via GLCDC, managing CANopen/EtherCAT fieldbus gateways, and executing AES-encrypted OTA updates. Use Value: On-chip DRW2D accelerates UI rendering; dual CAN + Ethernet enables concurrent industrial protocol bridging; 640 KB SRAM hosts full protocol stacks and local database. | Use Scenario: Cellular-connected edge node aggregating data from Modbus RTU, BACnet MS/TP, and BLE sensors in smart building infrastructure. IC Role / Device Role / Timing Role: Central secure host managing TLS 1.2 handshakes (via TSIP), validating firmware signatures, buffering sensor logs in data flash, and scheduling low-power wake cycles using RTC + deep software standby. Use Value: Hardware AES + TSIP offloads crypto processing; 32 KB data flash (100k erase cycles) stores calibrated sensor offsets and audit logs; 8 KB standby RAM retains context across power loss. |
| Networked Energy Meter | Medical Data Logger |
Use Scenario: DIN-rail mounted electricity meter with pulse input, RS485, and Ethernet backhaul for AMI (Advanced Metering Infrastructure). IC Role / Device Role / Timing Role: Precision timing controller synchronizing sampling to grid frequency via PLL lock to 50/60 Hz; performs harmonic analysis using FPU; signs metering data with ECDSA via TSIP. Use Value: 12-bit dual A/D with sample-and-hold captures simultaneous voltage/current waveforms; RTC with leap-year correction ensures accurate billing intervals; dual-bank flash allows certified firmware patches without service interruption. | Use Scenario: Portable patient monitor logging ECG, SpO₂, and temperature with USB host for flash drive export and SD card backup. IC Role / Device Role / Timing Role: Safety-certified data acquisition hub: acquires analog biosignals via S12AD with self-diagnostic, timestamps samples using RTC with capture-on-event, encrypts data before SD write using AES-256. Use Value: A/D disconnection detection prevents false readings; temperature sensor (±1°C) calibrates analog front-end drift; IEC60730 features satisfy IEC 62304 Class C software requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDDFB#10 | Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB flash and 256 KB SRAM (no expansion RAM) | Suitable for cost-sensitive designs where graphics acceleration or large protocol stacks are unnecessary | Select when firmware size < 1 MB and no DRW2D/GLCDC usage is required - reduces BOM cost without changing PCB layout |
| R5F566TEBDFB#10 | RX66T Group part: higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time compensation), no Ethernet or SD interfaces | Targeted at real-time motor drives and inverters requiring deterministic PWM timing, not networked HMI | Choose for servo/BLDC control where Ethernet/SD are irrelevant and sub-µs PWM jitter matters more than graphics or connectivity |
Compared with R5F56517BDFB#10, the R5F5651EDDFB#10 offers reduced memory and peripheral set at lower cost in the same footprint, while the R5F566TEBDFB#10 trades connectivity for superior real-time motor control capability - neither is pin-compatible nor drop-in, but both share toolchain and ecosystem alignment within Renesas' RX family.
Availability
R5F56517BDFB#10 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and networked energy metering requiring stable component supply, long-term lifecycle assurance, and full traceability.
Supply support for R5F56517BDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The RX65N Group - to which R5F56517BDFB#10 belongs - was designed specifically for secure, graphics-rich, networked industrial devices requiring functional safety, cryptographic acceleration, and real-time responsiveness in extended temperature environments.
FAQ
What is the maximum operating frequency and performance rating of the R5F56517BDFB#10?
The R5F56517BDFB#10 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) performance. Its RXv2 core includes a single-precision IEEE-754 floating-point unit and dual multiply-accumulate units, enabling efficient signal processing and control algorithm execution. The R5F56517BDFB#10 achieves this performance with zero-wait-state access to 640 KB SRAM and optimized flash cache behavior up to 100 MHz.
Does the R5F56517BDFB#10 support hardware-based cryptographic acceleration?
Yes, the R5F56517BDFB#10 integrates a dedicated AES engine supporting 128-, 192-, and 256-bit key lengths, plus the Trusted Secure IP (TSIP) module for secure key storage, ECDSA signature generation, and encrypted firmware boot. These hardware blocks accelerate TLS handshake, OTA update verification, and data-at-rest encryption without burdening the CPU - a core requirement for the R5F56517BDFB#10's target applications in secure IoT and industrial gateways.
What graphics capabilities does the R5F56517BDFB#10 provide for HMI development?
The R5F56517BDFB#10 integrates a full Graphic-LCD Controller (GLCDC) supporting 24-bit RGB output and triple-plane overlay (background, graphic 1, graphic 2), plus a 2D Drawing Engine (DRW2D) for hardware-accelerated bit blitting, rotation, scaling, and vector drawing. These features enable responsive, visually rich HMIs on TFT displays up to VGA resolution - eliminating the need for external graphics ICs and reducing system cost and power in applications like industrial panels and medical displays using the R5F56517BDFB#10.
How does the R5F56517BDFB#10 support functional safety standards such as IEC60730?
The R5F56517BDFB#10 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (8-/32-bit), independent watchdog timer (IWDT) with window function, A/D converter self-diagnostic mode, and register write protection. These are documented in Renesas' RX65N Functional Safety Manual and enable systematic fault detection - a foundational capability for the R5F56517BDFB#10 in white goods, HVAC, and industrial controls requiring safety certification.
What is the flash memory architecture of the R5F56517BDFB#10, and how does it benefit firmware updates?
The R5F56517BDFB#10 features 2 MB of on-chip code flash organized in a dual-bank structure, allowing background programming and atomic bank swapping. This enables safe over-the-air (OTA) updates: the new firmware image is written to the inactive bank while the system runs from the active bank, then switched on reset - preventing bricking during power loss. This architecture is central to the R5F56517BDFB#10's role in field-deployed, unattended industrial devices requiring high update reliability.
R5F56517BDFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517BDFB#10 FAQ
1.How can I place an order for R5F56517BDFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517BDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517BDFB#10 reliable?
The price and inventory of R5F56517BDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517BDFB#10 is usually 5 days.
3.What payment methods are accepted for R5F56517BDFB#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517BDFB#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517BDFB#10?
R5F56517BDFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517BDFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517BDFB#10?
For technical support, including R5F56517BDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517BDFB#10 requirements.
6.How does Aetrix verify that R5F56517BDFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F56517BDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517BDFB#10 meets industry standards.
7.What is the process for return or replacement of R5F56517BDFB#10?
All R5F56517BDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517BDFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517BDFB#10 part is unused and in its original packaging.
Return procedure for R5F56517BDFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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