Renesas R5F56517BDFM#10

Overview

R5F56517BDFM#10 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.

For engineers reviewing the R5F56517BDFM#10 datasheet, R5F56517BDFM#10 pinout, R5F56517BDFM#10 application, or R5F56517BDFM#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for 2D UI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.

Technical Context

The R5F56517BDFM#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA-synchronized peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for timers, ADC, and communication interfaces.

Its memory subsystem includes 1.5 MB dual-bank code flash (enabling background programming and bank-swapping), 32 KB data flash (100,000 erase/write cycles), 640 KB SRAM (256 KB main + 384 KB expansion), and 8 KB standby RAM backed by VBATT. Peripheral timing is managed via independent clock dividers for ICLK, PCLKA–PCLKD, FCLK, and BCLK - critical for deterministic real-time execution across mixed-speed subsystems.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, RoHS compliant, rated for –40°C to +85°C (D-version).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517BDFM#10, R5F5651EDFM#30 provides additional flash headroom without changing layout or firmware compatibility, while R5F566TEADFP#30 trades graphics and storage interfaces for higher PWM timing fidelity - making the former a drop-in upgrade and the latter a functionally divergent alternative for motion control.

Availability

R5F56517BDFM#10 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F56517BDFM#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX65N Group - including R5F56517BDFM#10 - was designed for industrial human-machine interfaces and secure IoT edge devices requiring integrated graphics, real-time connectivity, functional safety compliance, and cryptographic acceleration.

FAQ

What is the maximum operating frequency and performance rating of the R5F56517BDFM#10?

The R5F56517BDFM#10 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) performance. Its RXv2 CPU core supports single-cycle 32×32-bit multiplication and two-cycle 32/32-bit division, with IEEE-754 single-precision FPU enabling efficient floating-point computation for control algorithms and signal processing tasks within the R5F56517BDFM#10.

Does the R5F56517BDFM#10 support secure firmware updates and IEC60730 compliance?

Yes, the R5F56517BDFM#10 includes hardware features essential for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (CRCA) with configurable polynomials, independent watchdog timer (IWDT) with window function, self-diagnostic A/D converter, and register write protection. Its dual-bank flash architecture allows background programming and atomic bank switching - enabling secure, fail-safe over-the-air (OTA) firmware updates without interrupting application execution in the R5F56517BDFM#10.

What graphics and display capabilities does the R5F56517BDFM#10 provide?

The R5F56517BDFM#10 integrates a Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + 2 graphics planes) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing and bit blitting. It supports 32/16/8/4/1 bpp pixel formats and CLUT-based color lookup, enabling rich GUI rendering on TFT panels up to WXGA resolution without external graphics memory - a core capability distinguishing the R5F56517BDFM#10 from general-purpose MCUs.

Which communication interfaces are integrated into the R5F56517BDFM#10 for industrial networking?

The R5F56517BDFM#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), two CAN 2.0B channels (32 mailboxes each), SD host/slave interfaces, quad SPI, three RSPI channels, 13 serial channels (SCIg/h/i), and three I2C interfaces. This comprehensive suite enables direct connection to industrial fieldbuses, memory cards, displays, and sensors - eliminating need for external protocol bridges in systems built around the R5F56517BDFM#10.

What is the package type and temperature grade of the R5F56517BDFM#10?

The R5F56517BDFM#10 is supplied in a PLQP0176KB-A package: a 176-pin LFBGA with 24 × 24 mm body size and 0.5 mm pitch, RoHS compliant and qualified for the industrial temperature range of –40°C to +85°C (D-version). This package supports high I/O count (136 GPIOs, 19 with 5-V tolerance) and thermal reliability in dense PCB layouts - confirming the physical implementation of the R5F56517BDFM#10.