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Renesas R5F56517BDFP#10

Part No.:
R5F56517BDFP#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F56517BDFP#10.pdf
Description:
IC MCU 32BIT 768KB FLSH 100LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,721

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Product details

Overview

R5F56517BDFP#10 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, on-chip FPU compliant with IEEE-754 single-precision, 2 MB code flash memory (dual-bank), and 640 KB SRAM - designed for industrial HMI, networked gateway, and secure embedded control applications requiring Ethernet MAC, CAN, SD host/slave, and GLCDC support.

For engineers reviewing the R5F56517BDFP#10 datasheet, R5F56517BDFP#10 pinout, R5F56517BDFP#10 application, or R5F56517BDFP#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120 MHz real-time execution capability, integrated TSIP encryption engine, dual-bank flash for safe firmware updates, and hardware-accelerated 2D graphics rendering via DRW2D.

Technical Context

The R5F56517BDFP#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers and analog modules.

Its peripheral subsystem includes an Ethernet MAC with MII/RMII support, two CAN channels (ISO 11898-1), 13 SCI channels (including FIFO-equipped SCIi), three RSPI, one QSPI, SDHI/SDSI/MMCIF interfaces, and a full-featured 12-bit A/D converter (21-channel unit 1 + 8-channel unit 0) with self-diagnostic and disconnection detection - all coordinated via the Event Link Controller (ELC) for CPU-offload event chaining.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz
Max Operating Frequency120 MHz system clock (ICLK); supports no-wait flash access up to 50 MHz or cache-hit at 120 MHz
Memory2 MB dual-bank code flash (background programming), 32 KB data flash (100k erase cycles), 640 KB SRAM (no wait states)
Analog PeripheralsTwo 12-bit A/D units (8 + 21 channels), 2-channel 12-bit D/A, on-die temperature sensor (±1°C)
ConnectivityEthernet MAC (10/100 Mbps, MII/RMII), 2× CAN, 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF, USB 2.0 FS host/function/OTG
Graphics & ImagingGLCDC (3-plane overlay), DRW2D (vector/bit-blit, texture support), PDC (CMOS camera interface)
SecurityTSIP (AES-128/192/256), MPU (8 regions), Trusted Memory (TM), CRC calculator (8/32-bit), register write protection

Pinout & Package

Package: PLQP0176KB-A - 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, RoHS-compliant, rated for –40°C to +85°C (D-version).

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsSeparate digital/analog supplies enable noise isolation; AVCC1 powers A/D and D/A converters
XTAL / EXTALMain crystal oscillator terminalsSupports 8–24 MHz external resonator for precise system timing and Ethernet PHY clock derivation
ETH_MDC / ETH_MDIOEthernet management interfaceIEEE 802.3-compliant MDIO/MDC for PHY configuration and status monitoring
ETH_TXD0–3 / ETH_RXD0–3Ethernet data lanesMII mode: 4-bit TX/RX data; RMII mode: shared 2-bit data with REF_CLK
CAN0_TX / CAN0_RXChannel 0 CAN transceiver I/ODifferential signaling compliant with ISO 11898-1; supports standard/extended frames and 32 mailboxes
SD0_CMD / SD0_CLK / SD0_DAT0–3SD host interface signals4-bit SD bus supporting high-speed mode (25 MB/s); includes card detect and write protect inputs
GLCD_D0–23 / GLCD_HSYNC / VSYNCGraphic LCD controller outputs24-bit RGB parallel interface with programmable timing; supports TFT, STN, and segment LCDs

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables seamless firmware updates without halting application execution - critical for industrial gateways requiring zero-downtime field upgrades
Trusted Secure IP (TSIP)Hardware-accelerated AES encryption/decryption with key wrapping and secure key storage - meets IEC 62443-3-3 SL2 requirements
Event Link Controller (ELC)83 internal event sources can trigger peripheral actions (e.g., timer-triggered A/D conversion) without CPU intervention, reducing latency and ISR overhead
DRW2D 2D drawing engineOffloads GUI rendering tasks (lines, circles, bit-blits, rotation) from CPU; supports 32/16/8-bit pixel formats and CLUT-based color conversion
IEC 60730 safety functionsIncludes oscillation-stop detection, CRC calculation, IWDT windowing, A/D self-test, and register write protection - simplifies Class B certification

Applications

Industrial HMI PanelSmart Gateway Device

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time alarm display and historical trend visualization.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving 480×272 TFT LCD via GLCDC, capturing touch input via SCI-based controller, and logging data to SD card.

Use Value: Integrated DRW2D accelerates GUI redraws; dual-bank flash enables silent OTA updates; TSIP secures firmware integrity against tampering.

Use Scenario: Protocol translator bridging Modbus RTU field devices to cloud via Ethernet and TLS-secured MQTT.

IC Role / Device Role / Timing Role: Central protocol stack executor with concurrent Ethernet TCP/IP, CAN bus, and serial communication handling - managed by ELC-synchronized DMA transfers.

Use Value: Hardware CRC and TSIP accelerate secure packet processing; 120 MHz CPU sustains deterministic response under multi-protocol load; SDHI stores encrypted logs locally.

Secure Network ApplianceEmbedded Vision Edge Node

Use Scenario: Firewall or intrusion detection unit in building automation, inspecting Ethernet packets and enforcing ACLs at line rate.

IC Role / Device Role / Timing Role: Real-time packet classifier using Ethernet MAC + EDMAC descriptors, offloading crypto to TSIP, and managing policy tables in SRAM.

Use Value: PCLKA-synchronized EDMAC handles 100 Mbps traffic with minimal CPU load; MPU enforces memory isolation between network stack and application; dual-bank flash isolates boot loader from runtime image.

Use Scenario: Low-power vision node capturing CMOS camera feed, performing motion detection, and transmitting alerts over CAN.

IC Role / Device Role / Timing Role: Image acquisition controller using PDC to capture raw YUV frames, triggering DRW2D for ROI cropping before CAN transmission.

Use Value: PDC synchronizes to external camera HSYNC/VSYNC; ELC chains PDC completion → DRW2D start → CAN transmit; low-power modes extend battery life during idle periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EDFP#30Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB code flash and 256 KB SRAM instead of 2 MB/640 KBSuitable for cost-sensitive designs where full memory capacity is unnecessary; lacks dual-bank flash for background programmingSelect when firmware size < 1 MB and background flash update is not required
R5F566TEBDFP#30RX66T Group part; same 176-pin LFBGA, 160 MHz CPU, enhanced MTU3 timers for motor control, but no Ethernet MAC or GLCDCOptimized for servo drives and inverters; replaces R5F56517BDFP#10 only where networking and graphics are irrelevantSelect only for high-performance motor control applications requiring PWM dead-time compensation and encoder interfacing

Compared with R5F56517BDFP#10, the R5F5651EDFP#30 offers reduced memory and no dual-bank flash, limiting safe firmware update capability, while the R5F566TEBDFP#30 trades Ethernet and graphics for superior motor control peripherals - neither is pin-compatible nor functionally interchangeable without hardware and software redesign.

Availability

R5F56517BDFP#10 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure network appliance applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F56517BDFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F56517BDFP#10 - was engineered for secure, connected industrial edge devices requiring real-time Ethernet, functional safety compliance (IEC 60730), and rich human-machine interface capabilities.

FAQ

What is the maximum operating frequency and CPU performance of the R5F56517BDFP#10?

The R5F56517BDFP#10 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance using the RXv2 CPU core. Its single-precision IEEE-754 floating-point unit enables efficient math-intensive tasks such as sensor fusion and control algorithms. The R5F56517BDFP#10 achieves this performance with no wait states on SRAM and optimized flash access via ROM cache hit logic.

Does the R5F56517BDFP#10 support Ethernet connectivity, and what physical layer options are available?

Yes, the R5F56517BDFP#10 integrates a full-featured Ethernet MAC compliant with IEEE 802.3, supporting both 10 and 100 Mbps operation in full- and half-duplex modes. It supports MII and RMII physical layer interfaces, allowing direct connection to external PHYs. The R5F56517BDFP#10 also includes an integrated EDMAC for descriptor-based DMA transfers, minimizing CPU overhead during packet processing.

What security features does the R5F56517BDFP#10 provide for firmware and data protection?

The R5F56517BDFP#10 includes Trusted Secure IP (TSIP) for hardware-accelerated AES-128/192/256 encryption, a Memory Protection Unit (MPU) with eight configurable regions, Trusted Memory (TM) to prevent code readout from flash, and a CRC calculator supporting multiple polynomials. These features collectively support IEC 62443-3-3 SL2 and IEC 60730 Class B compliance. The R5F56517BDFP#10 uses these to protect firmware integrity, isolate critical tasks, and secure communications.

How does the R5F56517BDFP#10 handle graphics and display output?

The R5F56517BDFP#10 integrates a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output to TFT, STN, and segment displays, plus a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector and bit-blit operations. The DRW2D supports rotation, scaling, and CLUT-based color conversion, offloading GUI rendering from the CPU. The R5F56517BDFP#10 uses these to drive complex HMIs with smooth animation and low CPU utilization.

What is the package type and pin count of the R5F56517BDFP#10, and is it RoHS-compliant?

The R5F56517BDFP#10 is housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 × 24 mm with 0.5 mm pitch. It is RoHS-compliant and rated for industrial temperature range (–40°C to +85°C). This package provides high I/O density (136 general-purpose pins, 19 with 5-V tolerance) and thermal performance suitable for fanless industrial enclosures. The R5F56517BDFP#10's pinout is documented in Renesas datasheet R01DS0276EJ0240.

R5F56517BDFP#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56517BDFP#10 FAQ

1.How can I place an order for R5F56517BDFP#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56517BDFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56517BDFP#10 reliable?

The price and inventory of R5F56517BDFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517BDFP#10 is usually 5 days.

3.What payment methods are accepted for R5F56517BDFP#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517BDFP#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56517BDFP#10?

R5F56517BDFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56517BDFP#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56517BDFP#10?

For technical support, including R5F56517BDFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517BDFP#10 requirements.

6.How does Aetrix verify that R5F56517BDFP#10 is sourced from the original manufacturer or authorized distributors?

All R5F56517BDFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517BDFP#10 meets industry standards.

7.What is the process for return or replacement of R5F56517BDFP#10?

All R5F56517BDFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517BDFP#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56517BDFP#10 part is unused and in its original packaging.

Return procedure for R5F56517BDFP#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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