Renesas R5F56517BGBP#20

Overview

R5F56517BGBP#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 2 MB on-chip code flash, 640 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.

For engineers reviewing the R5F56517BGBP#20 datasheet, R5F56517BGBP#20 pinout, R5F56517BGBP#20 application, or R5F56517BGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package with 136 GPIOs (19 × 5-V tolerant), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for 2D GUI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.

Technical Context

The R5F56517BGBP#20 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-based memory protection. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers and ADCs.

Its peripheral subsystem includes three independent DMA controllers (DMACAa: 8-channel, EXDMAC: 2-channel, DTCb: 1-channel), event-linking capability across 83 internal signals, and synchronized trigger routing between MTU3/TPU timers and S12AD converters - enabling deterministic real-time control without CPU intervention.

Key Specifications

Pinout & Package

LFBGA-176 package (PLQP0176KB-A) with 136 general-purpose I/O pins, 19 × 5-V tolerant inputs, 136 pull-up resistors, and 136 open-drain outputs - optimized for high-density industrial PCB layouts with thermal pad grounding and controlled impedance routing for Ethernet and high-speed serial buses.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517BGBP#20, the R5F5651EDFP#30 reduces package size and Ethernet capability but lowers BOM cost, while the R5F566TEBDFP#30 trades graphics and storage interfaces for superior motor-control timing and analog performance - making R5F56517BGBP#20 uniquely suited for HMI-rich, networked industrial edge nodes.

Availability

R5F56517BGBP#20 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56517BGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - to which R5F56517BGBP#20 belongs - was designed for industrial and medical applications demanding high reliability, functional safety compliance (IEC60730), rich connectivity, and embedded graphics acceleration.

FAQ

What is the maximum operating frequency and DMIPS rating of the R5F56517BGBP#20?

The R5F56517BGBP#20 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS performance. This is achieved through its RXv2 CPU core with 5-stage pipeline, single-cycle 32-bit multiply, and dual MAC units. The R5F56517BGBP#20 maintains this throughput across its full 640 KB SRAM and 2 MB flash memory with zero-wait access up to 50 MHz and cache-hit operation at 120 MHz.

Does the R5F56517BGBP#20 support dual-bank flash for safe firmware updates?

Yes, the R5F56517BGBP#20 includes a dual-bank flash architecture that enables background programming and atomic bank switching. This allows one bank to execute active firmware while the other is being reprogrammed - critical for fail-safe over-the-air (OTA) updates. The R5F56517BGBP#20 supports this feature natively in its ROM bootloader and is validated for IEC60730 Class B compliance in safety-critical deployments.

What graphics capabilities does the R5F56517BGBP#20 provide for HMI applications?

The R5F56517BGBP#20 integrates both a Graphic-LCD Controller (GLCDC) and a 2D Drawing Engine (DRW2D). The GLCDC supports 3-layer overlay (background, graphic 1, graphic 2) and multiple pixel formats (32/16/8/4/1 bpp). The DRW2D accelerates vector drawing (lines, circles), bit blitting (copy, stretch, rotate), and texture mapping - reducing CPU load for dynamic GUIs. These features make the R5F56517BGBP#20 ideal for TFT displays up to VGA resolution in industrial HMIs.

How does the R5F56517BGBP#20 meet IEC60730 functional safety requirements?

The R5F56517BGBP#20 includes multiple IEC60730-compliant features: oscillation-stop detection, hardware CRC calculator (8-/32-bit), independent watchdog timer (IWDT) with configurable window, self-diagnostic A/D converter, and register write protection. These are documented in Renesas' Functional Safety Manual (R01UM0591EJ0200) and enable Class B certification. The R5F56517BGBP#20 also supports Trusted Secure IP (TSIP) for cryptographic integrity checks required in safety-critical boot flows.

What is the pin count, package type, and temperature grade of the R5F56517BGBP#20?

The R5F56517BGBP#20 uses a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) and is rated for industrial temperature range of –40°C to +105°C (G-version). It provides 136 general-purpose I/O pins, 19 of which are 5-V tolerant, with configurable pull-up resistors and open-drain outputs - enabling direct interfacing with legacy industrial sensors and actuators without level-shifting components.