My Inquiry
My Account
Renesas R5F56517BGFB#30
- Part No.:
- R5F56517BGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517BGFB#30.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:240
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56517BGFB#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded industrial HMI and connectivity applications.
For engineers reviewing the R5F56517BGFB#30 datasheet, R5F56517BGFB#30 pinout, R5F56517BGFB#30 application, or R5F56517BGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +105°C operating range, dual-bank flash for safe firmware updates, hardware AES/TSIP encryption, and real-time clock with battery backup support.
Technical Context
The R5F56517BGFB#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) for IEC60730-compliant safety-critical operation. It integrates dual-clock domains: ICLK up to 120 MHz for CPU/core peripherals, and PCLKA/PCLKB up to 120/60 MHz for high-speed modules like ETHERC, DRW2D, and S12AD.
Its peripheral set includes Ethernet MAC with RMII/MII, two CAN channels (ISO11898-1), 13 SCI channels (asynchronous/smart-card/SPI/I²C modes), three RSPI, one QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera input, GLCDC with 3-plane overlay, and DRW2D for hardware-accelerated 2D graphics rendering - all synchronized via configurable clock dividers and event linking controller (ELC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU |
| Memory | 2 MB code flash (dual-bank, BGO support), 640 KB SRAM (no wait states), 32 KB data flash (100k erase cycles) |
| Package | LFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, G-version (–40°C to +105°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN, 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF |
| Analog | Two 12-bit A/D units (8+21 ch), 2× 12-bit D/A, on-chip temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256, TSIP, MPU (8 regions), CRC calculator, IWDT with window function, register write protection |
| Graphics & Timing | GLCDC (3-plane overlay), DRW2D engine, RTC with battery backup, 25+ timers including MTU3a/TPUa/CMTW |
Pinout & Package
Package: PLQP0176KB-A, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital/analog supplies (2.7–3.6 V); AVCC1 powers A/D and D/A converters |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; connects to coin-cell or backup source |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system clock generation |
| MD0 / MD1 | Mode setting pins | Determine boot mode (SCI/USB/FINE) and single-chip vs extended mode at reset release |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO bus for configuring external Ethernet PHY |
| ETXD0–ETXD3 / ERXD0–ERXD3 | Ethernet data lines | 4-bit nibble interface for RMII; full 8-bit MII requires external PHY connection |
| CRX0 / CTX0 | CAN channel 0 transceiver I/O | Differential CANH/CANL signals compliant with ISO11898-1 physical layer |
| SD0CMD / SD0CLK / SD0DAT0–3 | SD host interface signals | 4-bit SD bus supporting SD memory and SDIO cards per Physical Layer Spec v3.01 |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables background programming and seamless firmware update without halting execution |
| Hardware-accelerated 2D graphics | DRW2D engine supports vector drawing, bit blitting, rotation, and texture mapping for HMI display offload |
| Integrated GLCDC | Drives color LCD panels with 3-layer plane composition (background, graphic 1, graphic 2) |
| Event Linking Controller (ELC) | Direct hardware interconnection of 83 internal events eliminates CPU overhead for timer-triggered ADC or PWM sync |
| IEC60730 safety functions | Includes oscillation-stop detection, CRC calculator, self-diagnostic A/D, IWDT windowing, and register write protection |
Applications
| Industrial HMI Panel | Smart Gateway Device |
|---|---|
Use Scenario: Standalone touchscreen panel in factory automation with local logic, data logging, and Ethernet/USB connectivity. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving TFT-LCD via GLCDC+DRW2D, managing SD card storage, and handling EtherCAT or Modbus TCP over Ethernet MAC. Use Value: Dual-bank flash enables field firmware updates without downtime; 640 KB SRAM accommodates large GUI frame buffers and protocol stacks. | Use Scenario: Edge gateway aggregating CAN bus data from machinery and forwarding to cloud via Ethernet or USB host-connected cellular modem. IC Role / Device Role / Timing Role: Central protocol translator with dual CAN interfaces, Ethernet MAC, USB host, and hardware AES for secure TLS offload. Use Value: Integrated CAN mailboxes (32 per channel) and ELC-synchronized timestamping ensure deterministic multi-bus data correlation. |
| Medical Monitoring Terminal | Building Automation Controller |
Use Scenario: Portable patient monitor with analog sensor front-end, local display, and network upload capability. IC Role / Device Role / Timing Role: Sensor fusion hub using dual 12-bit A/D units (21-channel unit for multi-sensor acquisition), temperature-compensated RTC, and encrypted SDHI data logging. Use Value: On-chip temperature sensor and self-diagnostic A/D meet IEC60601-1 Class II safety requirements; TSIP accelerates TLS handshake for HIPAA-compliant transmission. | Use Scenario: HVAC controller integrating BACnet MS/TP over RS485 (via SCI), BLE bridge (via USB), and web server over Ethernet. IC Role / Device Role / Timing Role: Real-time control unit running scheduler-driven HVAC logic, managing multiple serial protocols, and serving HTML UI via integrated TCP/IP stack. Use Value: 13 SCI channels allow concurrent BACnet, Modbus, and debug interfaces; PCLKB-synchronized TMR timers provide precise 1-sec HVAC cycle timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#30 | Same RX65N Group, 144-pin LQFP package, 1.5 MB flash, 256 KB SRAM, operates at –40°C to +85°C | Suitable for space-constrained PCBs without BGA assembly; lower memory and temp grade limit design envelope | Select when footprint and reflow compatibility outweigh need for 2 MB flash or extended temperature operation. |
| R5F566TEADFP#30 | RX66T Group, 100-pin LQFP, 1.5 MB flash, 384 KB SRAM, optimized for motor control with 32-bit MTU3 timers and encoder interfaces | Focused on servo/inverter control with enhanced PWM dead-time compensation and position capture; lacks Ethernet and GLCDC | Choose for motor drive applications requiring higher-resolution PWM and encoder timing, not HMI or networking. |
Compared with R5F56517BGFB#30, R5F5651EDFBL#30 trades BGA density and extended temperature for LQFP manufacturability and lower cost, while R5F566TEADFP#30 shifts focus from connectivity and graphics to deterministic motor control - neither offers pin-to-pin compatibility or identical peripheral coverage.
Availability
R5F56517BGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateways, medical terminals, and building automation controllers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F56517BGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX65N Group, including R5F56517BGFB#30, was designed for high-integration industrial HMI and edge connectivity applications demanding real-time performance, functional safety, and rich peripheral sets including Ethernet, CAN, SD, and graphics acceleration.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F56517BGFB#30?
The R5F56517BGFB#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. It implements a CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and single-precision IEEE-754 floating-point unit. This architecture enables efficient code density and deterministic real-time execution critical for industrial control and HMI applications where the R5F56517BGFB#30 is deployed.
Does the R5F56517BGFB#30 support dual-bank flash for firmware updates?
Yes, the R5F56517BGFB#30 includes a dual-bank flash memory structure enabling background programming and safe firmware updates. One bank can execute code while the other is being programmed or erased, allowing seamless over-the-air or field updates without system interruption. This capability is essential for maintaining uptime in industrial HMI and gateway applications where the R5F56517BGFB#30 serves as the primary controller.
What graphics and display capabilities does the R5F56517BGFB#30 provide?
The R5F56517BGFB#30 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background, graphic 1, graphic 2) and a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, rotation, and texture mapping. These features enable responsive, low-CPU-load graphical user interfaces on color TFT-LCD panels - a core requirement for the R5F56517BGFB#30's target use in industrial HMI and medical display terminals.
Which communication interfaces are integrated into the R5F56517BGFB#30?
The R5F56517BGFB#30 integrates Ethernet MAC (10/100 Mbps, MII/RMII), two CAN 2.0B channels (ISO11898-1), 13 SCI channels (supporting asynchronous, SPI, I²C, and smart-card modes), three RSPI, one QSPI, SD host/slave, and MMCIF interfaces. This comprehensive suite supports complex industrial networking topologies - such as CAN-based machine control combined with Ethernet backhaul - making the R5F56517BGFB#30 ideal for smart gateway and automation controller designs.
What safety and security features does the R5F56517BGFB#30 include for industrial applications?
The R5F56517BGFB#30 includes IEC60730-compliant safety features such as oscillation-stop detection, CRC calculator (8-/32-bit), self-diagnostic A/D, independent watchdog timer with window function, and register write protection. For security, it provides AES-128/192/256 encryption and Trusted Secure IP (TSIP) for secure key management and TLS acceleration. These capabilities directly support functional safety and data integrity requirements in the R5F56517BGFB#30's deployment across industrial HMI, medical, and building automation systems.
R5F56517BGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517BGFB#30 FAQ
1.How can I place an order for R5F56517BGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517BGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517BGFB#30 reliable?
The price and inventory of R5F56517BGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517BGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56517BGFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517BGFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517BGFB#30?
R5F56517BGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517BGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517BGFB#30?
For technical support, including R5F56517BGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517BGFB#30 requirements.
6.How does Aetrix verify that R5F56517BGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56517BGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517BGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56517BGFB#30?
All R5F56517BGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517BGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517BGFB#30 part is unused and in its original packaging.
Return procedure for R5F56517BGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56517BGFB#30 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
