Renesas R5F56517BGFP#30
- Part No.:
- R5F56517BGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56517BGFP#30.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:270
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Product details
Overview
R5F56517BGFP#30 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMIs with real-time graphics and secure connectivity.
For engineers reviewing the R5F56517BGFP#30 datasheet, R5F56517BGFP#30 pinout, R5F56517BGFP#30 application, or R5F56517BGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz deterministic real-time performance, integrated GLCDC + DRW2D for embedded GUIs, dual-bank flash for safe firmware updates, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.
Technical Context
The R5F56517BGFP#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection across eight configurable regions. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, enabling independent domain clocks: ICLK up to 120 MHz, PCLKA up to 120 MHz (for ETHERC, GLCDC, DRW2D), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz per A/D unit.
Peripheral integration centers on deterministic data movement: DMACAa (8-channel), EXDMAC (2-channel), DTCb (1-channel), and EDMAC (2 KB TX/RX FIFO) offload CPU during Ethernet, SD, and camera transfers. The ELC enables zero-CPU-latency event chaining - e.g., TPU capture triggering S12AD conversion - while TSIP provides hardware-accelerated AES and secure key management without software exposure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz - delivers deterministic real-time execution for motion control and protocol stacks. |
| Flash Memory | 1.5 MB code flash with dual-bank structure - enables background programming and atomic firmware swap without halting operation. |
| SRAM | 640 KB on-chip SRAM (256 KB main + 384 KB expansion), zero-wait-state access at 120 MHz - supports large frame buffers and real-time data processing. |
| A/D Converter | Two 12-bit S12AD units: Unit 0 (8 ch), Unit 1 (21 ch); 0.48 µs conversion time - meets high-speed sensor sampling in motor drives and power monitoring. |
| Connectivity | Ethernet MAC (10/100 Mbps MII/RMII), 2× CAN 2.0B (32 mailboxes/channel), 3× RSPI, 3× RIIC, QSPI, SDHI/SDSI, USB 2.0 FS OTG - enables multi-protocol industrial gateway designs. |
| Graphics Engine | GLCDC + DRW2D hardware accelerator - renders layered GUIs (3 planes), performs vector drawing and bit-blitting without CPU load, supporting 32-/16-/8-bpp displays. |
| Security | TSIP with AES-128/192/256, CRCA (8/32-bit CRC), register write protection, oscillation-stop detection - satisfies IEC60730 Class B functional safety requirements. |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Quad Flat Package, 24 × 24 mm, 0.5-mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC), analog unit 0 (AVCC0), and analog unit 1 (AVCC1) supplies - enable noise isolation for precision ADC/DAC operation. |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal - provides stable, low-jitter clock source for Ethernet PHY timing and real-time control loops. |
| ETH_MDC / ETH_MDIO | MDIO management interface | IEEE 802.3-compliant serial management bus - configures external PHY registers without dedicated GPIO overhead. |
| TXD0 / RXD0 | SCI0 asynchronous UART | Dedicated debug/console interface - operates independently of USB/Ethernet, ensuring firmware bring-up and field diagnostics remain available. |
| SD0_CLK / SD0_CMD / SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s) - enables local firmware update via SD card and data logging in standalone HMI deployments. |
| MTIOC0A / MTIOC0B | MTU3 channel 0 PWM outputs | Complementary PWM outputs with programmable dead time - directly drive gate drivers in 3-phase inverter applications without external logic. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: new image programmed into inactive bank while active bank continues execution - eliminates downtime during field upgrades. |
| Hardware-accelerated DRW2D engine | Performs vector drawing (lines, circles), bit-blitting (copy/rotate/stretch), and CLUT-based color conversion - reduces GUI rendering CPU load by >90% vs. software-only implementation. |
| Event Link Controller (ELC) | Chains 83 internal peripheral events (e.g., TPU capture → S12AD trigger → DMACA transfer) without CPU intervention - achieves sub-microsecond deterministic response in closed-loop systems. |
| IEC60730 safety support | Includes CRC calculator (CRCA), self-diagnostic A/D, IWDT windowing, oscillation-stop detection, and register write protection - simplifies certification for household appliances and industrial controllers. |
| Integrated Ethernet + USB + CAN | Single-chip support for wired industrial protocols: Ethernet for supervisory control, USB for configuration, CAN for distributed I/O - reduces BOM count and PCB layer count in gateway designs. |
Applications
| Industrial HMI Display | Secure Gateway Controller |
|---|---|
Use Scenario: Touch-enabled operator panel with animated graphics, real-time process visualization, and local alarm logging. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, driving GLCDC/DRW2D for layered GUI rendering, managing SDHI for firmware updates, and running TLS stack on TSIP. Use Value: 640 KB zero-wait SRAM stores full display frame buffers; dual-bank flash allows over-the-air updates without interrupting HMI operation; 120 MHz CPU sustains 60 Hz GUI refresh under load. | Use Scenario: Field-deployed protocol translator bridging Modbus TCP (Ethernet) to CANopen (CAN) and legacy RS-485 devices. IC Role / Device Role / Timing Role: Central protocol engine handling concurrent Ethernet frame parsing, CAN mailbox arbitration, SCI UART framing, and AES-encrypted cloud telemetry upload. Use Value: Integrated ETHERC + 2× CAN + 11× SCI eliminates external transceivers; TSIP accelerates TLS handshake; ELC synchronizes CAN Tx with Ethernet Rx timestamps for deterministic latency reporting. |
| Smart Energy Meter | Motor Drive Control Unit |
Use Scenario: DIN-rail mounted meter with pulse counting, harmonic analysis, tamper detection, and secure remote firmware updates. IC Role / Device Role / Timing Role: Real-time data acquisition controller sampling current/voltage sensors via S12AD, computing RMS/harmonics on FPU, storing logs in data flash, and signing updates with TSIP. Use Value: Dual 12-bit A/D units sample 29 total channels at 0.48 µs/ch; 32 KB data flash rated for 100,000 erase cycles retains 10+ years of usage logs; RTC with battery backup maintains time during mains failure. | Use Scenario: Compact servo drive controlling PMSM motors with field-oriented control (FOC), current sensing, thermal monitoring, and CAN-based position feedback. IC Role / Device Role / Timing Role: Motion controller generating complementary PWM (MTU3), acquiring current/voltage/temperature via S12AD/R12DA, executing FOC loop on FPU, and communicating status via CAN. Use Value: MTU3's dead-time compensation and synchronous PWM update ensure precise phase alignment; temperature sensor + S12AD enable real-time thermal derating; 120 MHz CPU executes 20 kHz FOC loop with margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group, identical 176-pin LFBGA package, but with 2 MB flash and 640 KB SRAM - no difference in peripheral set or clocking. | Preferred where larger firmware image size is required (e.g., dual-application images, extended crypto libraries). | Select R5F5651EDFP#30 only if >1.5 MB flash is needed; R5F56517BGFP#30 offers optimal cost/performance for most HMI and gateway use cases. |
| R5F566TEBDFP#30 | RX66T Group part: higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM + encoder input), but lacks Ethernet MAC, GLCDC, and DRW2D. | Targeted at high-performance motor drives requiring >100 kHz PWM and encoder interpolation - not suitable for display or networking roles. | Choose R5F566TEBDFP#30 only for dedicated motor control; R5F56517BGFP#30 remains superior for integrated HMI+control+connectivity applications. |
Compared with R5F5651EDFP#30, the R5F56517BGFP#30 trades 512 KB flash capacity for identical peripheral functionality and lower unit cost - ideal when firmware fits within 1.5 MB. Against R5F566TEBDFP#30, it sacrifices raw CPU speed and motor-specific timers but gains Ethernet, graphics, and security IP essential for edge-node convergence.
Availability
R5F56517BGFP#30 is available at Aetrix Electronics and suitable for industrial HMIs, secure protocol gateways, smart energy meters, and motor drive control units requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F56517BGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX65N Group - including the R5F56517BGFP#30 - was designed for high-integration industrial applications demanding real-time performance, rich connectivity, embedded graphics, and functional safety compliance in a single chip.
FAQ
What is the maximum operating frequency and core type of the R5F56517BGFP#30?
The R5F56517BGFP#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. It supports single-precision IEEE-754 floating-point operations and includes two multiply-and-accumulate units. This core architecture enables deterministic real-time execution critical for industrial control and communication stacks in the R5F56517BGFP#30.
Does the R5F56517BGFP#30 support Ethernet connectivity, and what PHY interface options does it offer?
Yes, the R5F56517BGFP#30 integrates a full-featured Ethernet MAC supporting 10/100 Mbps operation with both MII and RMII physical layer interfaces per IEEE 802.3u. It includes an integrated EDMAC with 2 KB transmit and receive FIFOs, Magic Packet™ wake-on-LAN detection, and IEEE 802.3x flow control - all implemented in hardware to minimize CPU overhead in the R5F56517BGFP#30.
What graphics capabilities does the R5F56517BGFP#30 provide for embedded display applications?
The R5F56517BGFP#30 integrates a Graphic-LCD Controller (GLCDC) supporting 3-layer superposition (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) capable of vector drawing, bit-blitting, rotation, and CLUT-based color conversion. These hardware accelerators offload GUI rendering from the CPU, enabling smooth animation and multi-format display support in the R5F56517BGFP#30 without external graphics ICs.
How does the R5F56517BGFP#30 support functional safety standards like IEC60730?
The R5F56517BGFP#30 includes multiple IEC60730-compliant safety features: CRC calculator (CRCA), self-diagnostic A/D converter, independent watchdog timer (IWDT) with windowing, oscillation-stop detection, register write protection, and memory protection unit (MPU). These are documented in Renesas' safety manual for the RX65N Group and form the foundation for Class B certification in the R5F56517BGFP#30.
What is the flash and RAM configuration of the R5F56517BGFP#30, and how is it structured for reliability?
The R5F56517BGFP#30 contains 1.5 MB of on-chip code flash memory organized in a dual-bank structure - allowing background programming and atomic bank switching - plus 640 KB of zero-wait-state SRAM (256 KB main + 384 KB expansion) and 8 KB of battery-backed standby RAM. This configuration ensures robust firmware update capability and real-time data buffering in the R5F56517BGFP#30.
R5F56517BGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517BGFP#30 FAQ
1.How can I place an order for R5F56517BGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517BGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517BGFP#30 reliable?
The price and inventory of R5F56517BGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517BGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F56517BGFP#30?
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R5F56517BGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517BGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517BGFP#30?
For technical support, including R5F56517BGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517BGFP#30 requirements.
6.How does Aetrix verify that R5F56517BGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56517BGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517BGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56517BGFP#30?
All R5F56517BGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517BGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517BGFP#30 part is unused and in its original packaging.
Return procedure for R5F56517BGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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