Renesas R5F56517BGLJ#20

Overview

R5F56517BGLJ#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES/TSIP encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.

For engineers reviewing the R5F56517BGLJ#20 datasheet, R5F56517BGLJ#20 pinout, R5F56517BGLJ#20 application, or R5F56517BGLJ#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz deterministic timing, dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for embedded GUIs, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F56517BGLJ#20 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory isolation. It integrates dedicated clocks for subsystems: ICLK up to 120 MHz for CPU/core logic, PCLKA up to 120 MHz for ETHERC/EDMAC/GLCDC/DRW2D, and PCLKB up to 60 MHz for timers, ADC, and serial peripherals.

Its peripheral interconnect uses Event Link Controller (ELC) to route 83 internal event signals - enabling timer-triggered ADC sampling, PWM edge-aligned A/D start pulses, and RTC alarm-driven wake-from-standby - without CPU intervention. The dual-bank flash supports background programming during execution, and Trusted Memory (TM) restricts instruction fetch to protected code regions only.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, lead-free, RoHS-compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517BGLJ#20, R5F5651EDFP#30 trades SD slave, Ethernet, and full GPIO count for smaller footprint and lower cost, while R5F566TEBDFP#30 abandons display/networking entirely to deliver superior real-time motor control precision - making R5F56517BGLJ#20 uniquely suited for secure, graphics-capable industrial gateways.

Availability

R5F56517BGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56517BGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX65N Group - including R5F56517BGLJ#20 - was designed for secure, graphics-rich industrial edge devices requiring real-time OS support, functional safety compliance (IEC60730), and integrated connectivity (Ethernet, CAN, SD, USB).

FAQ

What is the maximum operating frequency and core architecture of the R5F56517BGLJ#20?

The R5F56517BGLJ#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core, achieving 240 DMIPS performance. Its CISC Harvard architecture features a 5-stage pipeline, variable-length instructions, and ultra-compact code density. The core supports single-precision IEEE-754 floating-point operations, two multiply-and-accumulate units, and a 32-bit multiplier with one-cycle execution - all confirmed in the R01DS0276EJ0240 Rev.2.40 datasheet.

Does the R5F56517BGLJ#20 support secure firmware updates and cryptographic acceleration?

Yes, the R5F56517BGLJ#20 integrates hardware AES-128/192/256 encryption and the Trusted Secure IP (TSIP) module for key management and secure boot. Its dual-bank flash memory enables background programming during runtime, allowing safe over-the-air (OTA) firmware updates without interrupting system operation - a critical capability for remote industrial deployments where R5F56517BGLJ#20 serves as the trusted execution environment.

What display and graphics capabilities does the R5F56517BGLJ#20 provide?

The R5F56517BGLJ#20 includes a dedicated Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + two graphics planes) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing and bit blitting. It supports 32/16 bpp pixel formats and CLUT-based color lookups, enabling responsive GUI rendering without external graphics memory - making R5F56517BGLJ#20 ideal for industrial HMIs requiring local display control and low-latency interaction.

How many CAN channels and mailboxes does the R5F56517BGLJ#20 support?

The R5F56517BGLJ#20 integrates two independent CAN modules compliant with ISO 11898-1, each supporting 32 message mailboxes. This allows concurrent handling of multiple CAN networks (e.g., device control and diagnostics buses) with flexible filtering, FIFO buffering, and error frame detection - essential for R5F56517BGLJ#20's role in industrial gateways connecting heterogeneous fieldbus systems.

What is the package type and thermal specification for the R5F56517BGLJ#20?

The R5F56517BGLJ#20 is housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It is rated for industrial temperature range (–40°C to +85°C), classified as the D-version per Renesas documentation, and features an exposed thermal pad for enhanced heat dissipation in high-performance embedded applications using R5F56517BGLJ#20.