Renesas R5F56517EDFP#10
- Part No.:
- R5F56517EDFP#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56517EDFP#10.pdf
- Description:
- IC MCU 32BIT 768KB FLSH 100LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,119
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Product details
Overview
R5F56517EDFP#10 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory, and 640 KB SRAM. It integrates Ethernet MAC, dual CAN channels (ISO 11898-1), SD host/slave interfaces, QSPI, GLCDC, DRW2D, and hardware AES encryption - targeting industrial HMI, networked gateway, and secure edge node applications.
For engineers reviewing the R5F56517EDFP#10 datasheet, R5F56517EDFP#10 pinout, R5F56517EDFP#10 application, or R5F56517EDFP#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe firmware updates, 12-bit A/D (21-channel unit + 8-channel unit), 2-channel 12-bit D/A, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.
Technical Context
The R5F56517EDFP#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes two multiply-and-accumulate units plus a 32×32→64-bit hardware multiplier completing in one cycle.
Its clock system combines external crystal (8–24 MHz), internal PLL, and multiple on-chip oscillators (LOCO at 240 kHz, HOCO at 16/18/20 MHz, IWDT-dedicated 120 kHz) with independent clock domains: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers and ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); enables real-time deterministic control loops |
| Flash Memory | 2 MB code flash with dual-bank structure - allows background programming and safe bank-swapping during runtime |
| SRAM | 640 KB total: 256 KB main RAM + 384 KB expansion RAM, all zero-wait-state at 120 MHz |
| A/D Converter | Two 12-bit units: S12AD0 (8 channels), S12AD1 (21 channels); conversion time as low as 0.42 µs (8-bit mode) |
| D/A Converter | 2-channel 12-bit R12DA with buffered/unbuffered output options and voltage range 0.2 V to AVCC1 – 0.2 V |
| Security Features | AES-128/192/256, Trusted Secure IP (TSIP), MPU (8 regions), register write protection, CRCA with configurable polynomials |
| Operating Temperature | –40°C to +85°C (D-version), suitable for industrial ambient environments without forced cooling |
Pinout & Package
Package: PLQP0176KB-A - 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC), analog unit 0 (AVCC0), and analog unit 1 (AVCC1) supplies enable noise isolation for precision ADC/DAC operation |
| VBATT | Battery backup input | Supplies RTC during main power loss; enables calendar/timekeeping continuity in deep software standby mode |
| RES# | Active-low reset input | Hardware reset assertion; synchronous release ensures deterministic startup sequence |
| EXTAL / XTAL | External crystal oscillator terminals | Supports 8–24 MHz crystal for precise timing; optional use with internal PLL for 120 MHz system clock |
| MD0 / MD1 | Mode setting pins | Select boot source (SCI/USB/FINE) and operating mode (single-chip, extended ROM enabled/disabled) at power-on reset |
| ETXD0–ETXD3 / ETXCK / ERXD0–ERXD3 / ERXCK | Ethernet PHY interface | MII/RMII-compatible 10/100 Mbps Ethernet physical layer interface with integrated transceiver support |
| CAN0TX / CAN0RX / CAN1TX / CAN1RX | CAN transceiver I/O | Dual ISO 11898-1 compliant CAN channels with 32 mailboxes each - supports automotive and industrial fieldbus communication |
| SD0DAT0–SD0DAT3 / SD0CMD / SD0CLK | SD host interface signals | 4-bit SD bus supporting SD memory and SDIO cards per Physical Layer Spec v3.01 (high-speed mode: 25 MB/s) |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Class B Support | Oscillation-stop detection, CRC calculator (CRCA), IWDT with window function, self-diagnostic A/D, and register write protection meet functional safety requirements for household appliances and industrial controls |
| Graphics Acceleration | Integrated GLCDC + DRW2D enables hardware-accelerated 2D rendering, layer compositing (3 planes), and texture mapping - eliminates need for external GPU in HMI designs |
| Secure Boot & Firmware Protection | Trusted Memory (TM) function restricts instruction fetch to protected code flash regions; prevents unauthorized read-out of firmware binaries |
| Flexible Low-Power Operation | Four low-power modes (sleep, all-module clock stop, software standby, deep software standby) with 0.19 mA/MHz typical active current and VBATT-backed RTC retention |
| Event Link Controller (ELC) | 83 internal event signals routed without CPU intervention - enables deterministic peripheral chaining (e.g., timer-triggered ADC → DMA → memory store) |
| High-Integration Communication | Single-chip solution with Ethernet MAC, dual CAN, USB 2.0 FS host/function, 3x RSPI, 3x I2C, 13x SCI, QSPI, SDHI/SDSI, MMCIF - reduces BOM count and board space |
Applications
| Industrial HMI Panel | Smart Gateway Device |
|---|---|
Use Scenario: Touch-enabled display panel with local logic, sensor aggregation, and remote connectivity via Ethernet or CAN. IC Role / Device Role / Timing Role: Main application processor running RTOS, driving GLCDC+DRW2D for UI rendering, managing SD card logging, and executing AES-encrypted OTA updates. Use Value: On-chip graphics engine and 640 KB SRAM eliminate external frame buffer memory; dual CAN + Ethernet enables multi-protocol fieldbus bridging. | Use Scenario: Edge node aggregating Modbus RTU, CANopen, and BACnet MS/TP devices into a unified IP-based management network. IC Role / Device Role / Timing Role: Protocol translation hub with real-time packet scheduling, secure TLS offload via TSIP, and time-synchronized data timestamping using RTC with capture function. Use Value: Integrated Ethernet MAC + dual CAN + USB + SDIO allows direct connection to legacy fieldbuses and cloud uplink without external PHYs or bridge ICs. |
| Secure IoT Endpoint | Networked Power Monitor |
Use Scenario: Tamper-resistant energy meter with encrypted data upload, firmware validation, and local anomaly detection. IC Role / Device Role / Timing Role: Security-enforced controller performing AES-256 encryption of metering data, validating signed firmware images, and monitoring analog inputs via dual 12-bit ADC units. Use Value: Hardware TSIP and MPU prevent side-channel attacks and privilege escalation; self-diagnostic A/D ensures measurement integrity per IEC60730. | Use Scenario: DIN-rail mounted power quality analyzer capturing voltage/current waveforms, computing harmonics, and reporting via Ethernet. IC Role / Device Role / Timing Role: High-precision acquisition engine synchronizing 21-channel ADC sampling with MTU3 timer triggers, storing raw samples in SRAM, and post-processing with FPU-assisted FFT. Use Value: 0.42 µs 8-bit ADC conversion + 240 DMIPS + FPU enables real-time harmonic analysis without external DSP; PDC interface supports optional CMOS camera for visual event logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#10 | Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB code flash and 256 KB SRAM instead of 2 MB/640 KB | Suitable for cost-sensitive designs where full memory capacity is unnecessary; lacks expansion RAM for large framebuffer or protocol stack buffers | Select when application firmware size < 1 MB and graphics/data buffering needs fit within 256 KB SRAM |
| R5F566TEBDFP#30 | RX66T Group part; same pinout (PLQP0176KB-A), 160 MHz CPU, enhanced PWM (3-phase complementary with dead-time control), no Ethernet or GLCDC | Optimized for motor control with advanced timer peripherals; excludes networking and graphics accelerators present in R5F56517EDFP#10 | Choose for servo/inverter applications requiring high-resolution PWM and encoder interfacing - not a drop-in replacement for HMI or gateway use cases |
Compared with R5F5651EDFP#10, the R5F56517EDFP#10 provides double flash/SRAM capacity and full graphics acceleration, while R5F566TEBDFP#30 trades networking and display features for higher CPU speed and motor-control-specific peripherals - making each optimal for distinct subsystem roles.
Availability
R5F56517EDFP#10 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT endpoint applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for R5F56517EDFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.
The RX65N Group - including R5F56517EDFP#10 - was designed specifically for industrial human-machine interfaces and networked edge nodes requiring integrated graphics, real-time connectivity, and functional safety certification support.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F56517EDFP#10?
The R5F56517EDFP#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core features a Harvard architecture with a 5-stage pipeline, variable-length instructions, and support for single-precision IEEE-754 floating-point operations. Its 240 DMIPS performance enables deterministic real-time processing for industrial control and graphics rendering tasks - critical for applications relying on the R5F56517EDFP#10's integrated GLCDC and DRW2D engines.
Does the R5F56517EDFP#10 support secure boot and firmware authentication?
Yes, the R5F56517EDFP#10 supports secure boot through its Trusted Memory (TM) function, which restricts instruction fetch to protected code flash regions and prevents unauthorized firmware read-out. It also includes hardware AES-128/192/256 encryption, Trusted Secure IP (TSIP), and register write protection - all documented in the R01DS0276EJ0240 datasheet as part of its IEC60730 Class B compliance suite. These features ensure that only authenticated, unmodified firmware executes on the R5F56517EDFP#10.
What are the memory resources available on the R5F56517EDFP#10?
The R5F56517EDFP#10 integrates 2 MB of on-chip code flash memory with dual-bank architecture for background programming and safe bank-swapping, 640 KB of SRAM (256 KB main + 384 KB expansion), and 32 KB of reprogrammable data flash rated for 100,000 erase/write cycles. All SRAM operates at zero wait states up to 120 MHz. These resources directly support complex RTOS-based applications, large framebuffer storage for the GLCDC, and secure firmware update mechanisms required by modern industrial deployments of the R5F56517EDFP#10.
Which communication interfaces does the R5F56517EDFP#10 integrate?
The R5F56517EDFP#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), dual CAN 2.0B channels (32 mailboxes each), USB 2.0 FS host/function/OTG, 3x RSPI, 3x I2C (up to 1 Mbps), 13x SCI (asynchronous, SPI/I2C emulation), QSPI, SD host/slave (SDHI/SDSI), and MMCIF. This comprehensive set eliminates the need for external bridge ICs in gateway and HMI applications - allowing direct interfacing with fieldbuses, memory cards, displays, and sensors while maintaining full functionality within the R5F56517EDFP#10's single-chip architecture.
What is the package type and pin count of the R5F56517EDFP#10?
The R5F56517EDFP#10 uses the PLQP0176KB-A package: a 176-pin low-profile fine-pitch ball grid array measuring 24 × 24 mm with 0.5 mm pitch. This LFBGA package supports 136 general-purpose I/O pins (including 19 with 5-V tolerance), dedicated power/ground balls, and optimized signal routing for high-speed interfaces like Ethernet and QSPI. The mechanical footprint and thermal characteristics of this package are fully specified in the R5F56517EDFP#10's official packaging documentation.
R5F56517EDFP#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517EDFP#10 FAQ
1.How can I place an order for R5F56517EDFP#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517EDFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517EDFP#10 reliable?
The price and inventory of R5F56517EDFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517EDFP#10 is usually 5 days.
3.What payment methods are accepted for R5F56517EDFP#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517EDFP#10 transactions.
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4.How is shipping managed for R5F56517EDFP#10?
R5F56517EDFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517EDFP#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517EDFP#10?
For technical support, including R5F56517EDFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517EDFP#10 requirements.
6.How does Aetrix verify that R5F56517EDFP#10 is sourced from the original manufacturer or authorized distributors?
All R5F56517EDFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517EDFP#10 meets industry standards.
7.What is the process for return or replacement of R5F56517EDFP#10?
All R5F56517EDFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517EDFP#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517EDFP#10 part is unused and in its original packaging.
Return procedure for R5F56517EDFP#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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