Renesas R5F56517EGFB#30
- Part No.:
- R5F56517EGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517EGFB#30.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:240
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Product details
Overview
R5F56517EGFB#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI applications. It operates from 2.7–3.6 V and supports –40°C to +105°C (G-version).
For engineers reviewing the R5F56517EGFB#30 datasheet, R5F56517EGFB#30 pinout, R5F56517EGFB#30 application, or R5F56517EGFB#30 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-A (176-pin LQFP, 24 × 24 mm, 0.5-mm pitch), functional role in industrial HMI and networked control systems, and validated alternative options.
Technical Context
The R5F56517EGFB#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. Its clock system integrates PLL, HOCO/LOCO oscillators, and independent PCLKA/PCLKB domains-PCLKA up to 120 MHz for ETHERC, GLCDC, DRW2D, and AES; PCLKB up to 60 MHz for most peripherals including S12AD units.
It features dual A/D converters (S12ADFa unit 0: 8 channels; unit 1: 21 channels), two 12-bit D/A channels (R12DA), 32 KB data flash (100,000 write cycles), and hardware-accelerated security via AES-128/192/256 and TSIP. The ELC enables deterministic event-driven peripheral coordination without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 FPU, 5-stage pipeline |
| Memory | 2 MB code flash (dual-bank, BGO support), 640 KB SRAM (no wait states), 32 KB data flash (100k cycles) |
| Analog | Two 12-bit S12AD units (8 + 21 ch), 2× R12DA DACs, on-die temperature sensor (±1°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1, 32 mailboxes/ch), 3× RSPI, 1× QSPI, 3× RIIC (1 Mbps), 13× SCI |
| Graphics & Media | GLCDC (3-plane overlay), DRW2D engine (vector/bitblit), PDC (CMOS camera interface), SDHI/SDSI/MMCIF |
| Package & Temp | PLQP0176KB-A (176-pin LQFP, 24 × 24 mm, 0.5-mm pitch), –40°C to +105°C (G-version) |
| Security | AES-128/192/256, Trusted Secure IP (TSIP), MPU (8 regions), CRC calculator (8/32-bit), register write protection |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-profile Quad Flat Package, 24 × 24 mm body, 0.5-mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core/analog domain supplies (2.7–3.6 V); separate AVCC domains enable noise-isolated ADC operation |
| RES# | Active-low reset input | Hardware reset assertion; internal POR/LVD also available for fail-safe startup sequencing |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external resonator; enables precise timing for Ethernet, USB, RTC |
| ETH_MDC / ETH_MDIO | MDIO management interface | IEEE 802.3-compliant PHY configuration and status access for integrated Ethernet MAC |
| TXD0 / RXD0 / RTS0 / CTS0 | SCI0 asynchronous interface | Full-duplex UART with hardware flow control; used for debug console or host communication |
| PE0–PE15 | General-purpose I/O port E | 16-bit parallel bus capable; configurable as SDHI/SDSI data lines or GLCDC output pins |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; requires external coin cell or supercap |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates with zero downtime: one bank executes while the other is reprogrammed |
| Event Link Controller (ELC) | Eliminates CPU polling by directly chaining peripheral events (e.g., TPU capture → S12AD trigger → DMA transfer) |
| Integrated GLCDC + DRW2D | Reduces external graphics controller BOM: supports 3-layer LCD overlay, vector drawing, and texture-mapped bitblit at 60 fps |
| IEC 60730 safety support | Includes oscillation-stop detection, CRC calculator, IWDT windowing, self-diagnostic A/D, and register write protection for Class B compliance |
| SDHI/SDSI dual-mode interface | Allows same MCU to act as SD host (for logging) and SD slave (for field-upgradable firmware storage) without external logic |
Applications
| Industrial HMI Panel | Smart Gateway Controller |
|---|---|
Use Scenario: Touch-enabled factory display with real-time process visualization, alarm logging, and remote diagnostics over Ethernet. IC Role / Device Role / Timing Role: Primary application processor running RTOS, driving 480×272 RGB LCD via GLCDC, capturing analog sensor data via dual S12AD, and managing secure OTA updates via SDHI/TSIP. Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash ensures safe firmware patching; Ethernet MAC + CAN enable multi-protocol edge connectivity. | Use Scenario: DIN-rail mounted protocol converter bridging Modbus RTU field devices to cloud via MQTT over Ethernet/Wi-Fi (via external PHY). IC Role / Device Role / Timing Role: Central protocol translator executing dual-stack firmware (Modbus master + TCP/IP stack), buffering data in 640 KB SRAM, and securing payloads with AES before transmission. Use Value: Hardware AES offloads encryption overhead; 136 GPIOs support isolated digital I/O expansion; PCLKA-synchronized ETHERC guarantees deterministic 100 Mbps throughput. |
| Medical Infusion Pump | Building Automation Node |
Use Scenario: UL 60601-certified infusion pump requiring precise motor control, pressure sensing, touch UI, and audit-trail logging. IC Role / Device Role / Timing Role: Safety-critical controller executing IEC 60730 Class B routines, generating PWM waveforms via MTU3 for stepper drivers, sampling analog pressure sensors via S12AD unit 1, and storing logs in data flash. Use Value: IWDT windowing and MPU prevent runaway code; temperature sensor monitors die temp for thermal derating; dual A/D units allow simultaneous critical/supervisory channel sampling. | Use Scenario: HVAC controller managing zone dampers, CO₂ sensors, and VFDs via BACnet MS/TP and Ethernet/IP. IC Role / Device Role / Timing Role: Real-time coordinator using ELC to synchronize CAN message reception, analog sensor reads, and PWM fan outputs-without CPU scheduling jitter. Use Value: ELC-triggered DMA transfers reduce CPU load below 5%; 21-channel S12AD unit 1 supports multi-sensor fusion; RTC with battery backup maintains schedule across power outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#30 | Same RX65N Group, 176-pin LQFP, but 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDC | Lacks integrated Ethernet and graphics subsystems; suitable for cost-sensitive CAN/USB-only nodes | Select when Ethernet, LCD, or DRW2D are unnecessary and BOM cost reduction is prioritized |
| R7FA6M2AF3CFP#AA0 | RX72M Group, 176-pin LQFP, 100 MHz, 2 MB flash, 384 KB SRAM, no GLCDC, adds EtherCAT slave support | Targets motion control with EtherCAT; omits DRW2D/GLCDC but adds high-precision timers and encoder interfaces | Prefer for servo drives or PLCs needing real-time industrial Ethernet, not HMI-centric designs |
Compared with R5F56517EGFB#30, R5F5651EDFBL#30 reduces memory and peripheral count for simpler nodes, while R7FA6M2AF3CFP#AA0 shifts focus to deterministic motion control-neither replicates the full HMI+connectivity+security integration of the R5F56517EGFB#30.
Availability
R5F56517EGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart gateways, medical infusion pumps, and building automation nodes requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.
Supply support for R5F56517EGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX65N Group-including R5F56517EGFB#30-is designed for high-integration human-machine interface and networked control applications, combining rich connectivity, graphics acceleration, and functional safety features in a single chip.
FAQ
What is the maximum operating frequency and core type of the R5F56517EGFB#30?
The R5F56517EGFB#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. It includes a single-precision IEEE-754 floating-point unit, 5-stage pipeline, and variable-length instruction set optimized for code density and real-time determinism. This specification is confirmed in Renesas datasheet R01DS0276EJ0240 Rev.2.40, Section 1.1.
Does the R5F56517EGFB#30 support Ethernet and CAN simultaneously?
Yes, the R5F56517EGFB#30 integrates one Ethernet MAC (10/100 Mbps, MII/RMII) and two CAN channels (ISO 11898-1 compliant, 32 mailboxes per channel), enabling concurrent operation. Both interfaces operate on independent clock domains (PCLKA for ETHERC, PCLKB for CAN), allowing full-duplex Ethernet traffic and real-time CAN messaging without resource contention. This capability is documented in Table 1.1 and Section 1.1 of R01DS0276EJ0240.
What package and pin count does the R5F56517EGFB#30 use?
The R5F56517EGFB#30 uses the PLQP0176KB-A package: a 176-pin Low-profile Quad Flat Package with 24 × 24 mm body size, 0.5-mm pitch, and exposed thermal pad. It provides 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain capability, and programmable pull-up resistors-matching the high-pin-count requirement for HMI and multi-interface applications.
How much on-chip memory does the R5F56517EGFB#30 include?
The R5F56517EGFB#30 includes 2 MB of on-chip code flash memory (with dual-bank structure and background programming), 640 KB of SRAM (no wait states at 120 MHz), 32 KB of reprogrammable data flash (rated for 100,000 erase/write cycles), and 8 KB of standby RAM backed by VBATT. These values are specified in Table 1.1 (Page 2) and Section 1.1 of the official Renesas datasheet R01DS0276EJ0240 Rev.2.40.
Is the R5F56517EGFB#30 qualified for industrial temperature range?
Yes, the R5F56517EGFB#30 is rated for the industrial temperature range of –40°C to +105°C (G-version), as explicitly stated in the "Operating temp. range" section of the datasheet feature list and confirmed in Table 1.2 (Page 187) of R01DS0276EJ0240 Rev.2.40. This makes it suitable for deployment in harsh environments such as factory floors, outdoor gateways, and medical equipment.
R5F56517EGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517EGFB#30 FAQ
1.How can I place an order for R5F56517EGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517EGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517EGFB#30 reliable?
The price and inventory of R5F56517EGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517EGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F56517EGFB#30?
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Once your R5F56517EGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517EGFB#30?
For technical support, including R5F56517EGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517EGFB#30 requirements.
6.How does Aetrix verify that R5F56517EGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F56517EGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517EGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F56517EGFB#30?
All R5F56517EGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517EGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517EGFB#30 part is unused and in its original packaging.
Return procedure for R5F56517EGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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