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Renesas R5F56517FDFB#10
- Part No.:
- R5F56517FDFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56517FDFB#10.pdf
- Description:
- IC MCU 32BIT 768KB FLSH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,499
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Product details
Overview
R5F56517FDFB#10 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES/TSIP encryption - deployed in industrial HMI and networked gateway applications requiring real-time control and secure connectivity.
For engineers reviewing the R5F56517FDFB#10 datasheet, R5F56517FDFB#10 pinout, R5F56517FDFB#10 application, or R5F56517FDFB#10 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz deterministic timing, dual-bank flash for safe firmware updates, integrated GLCDC + DRW2D for embedded graphics, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.
Technical Context
The R5F56517FDFB#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA-synchronized peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for timers, ADC, and communication interfaces.
Its memory subsystem includes 1.5 MB dual-bank code flash (1-wait state ≤100 MHz), 32 KB data flash (100,000 erase cycles), 640 KB SRAM (256 KB main + 384 KB expansion), and 8 KB standby RAM backed by VBATT. Peripheral integration centers on event-driven architecture via ELC (83 internal signals) and three DMA controllers (DMACAa: 8 ch, EXDMAC: 2 ch, DTCb: 1 ch) to offload CPU overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz - enables deterministic real-time execution of complex control algorithms. |
| Flash Memory | 1.5 MB dual-bank code flash - supports background programming and safe bank-swapping for zero-downtime firmware updates. |
| SRAM | 640 KB total (256 KB + 384 KB expansion), no wait states @ 120 MHz - eliminates memory bottlenecks in high-throughput data buffering and graphics rendering. |
| FPU | Single-precision IEEE-754 compliant - accelerates floating-point math for motor control, sensor fusion, and digital signal processing without software emulation. |
| Communication | Ethernet MAC (10/100 Mbps), 2× CAN (ISO 11898-1), SDHI/SDSI, QSPI, 3× RSPI, 13× SCI, 3× I2C - provides native connectivity for industrial gateways and edge nodes. |
| Analog Peripherals | Two 12-bit A/D converters (8 + 21 ch), 2× 12-bit D/A, on-chip temperature sensor (±1°C) - enables precision analog sensing and closed-loop control without external components. |
| Security | AES-128/192/256 + Trusted Secure IP (TSIP) - delivers hardware-accelerated encryption for secure boot, OTA updates, and data-at-rest protection. |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Quad Flat Package (LFBGA), 24 × 24 mm, 0.5 mm pitch, RoHS-compliant, rated for –40°C to +85°C (D-version).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails enable noise isolation for precision ADC/DAC operation. |
| VBATT | Battery backup supply | Provides power to RTC and 8 KB standby RAM during main power loss - maintains timekeeping and critical state. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system clock generation and Ethernet timing compliance. |
| ETH_MDC / ETH_MDIO / ETH_TXD[0:3] / ETH_RXD[0:3] | Ethernet PHY interface | Dedicated MII/RMII pins enable direct connection to external PHY without glue logic or level-shifting. |
| SD0_CMD / SD0_CLK / SD0_DATA[0:3] | SD host interface signals | Full 4-bit SD bus implementation supports high-speed mode (25 MB/s) for local storage and firmware image loading. |
| CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX | CAN transceiver I/O | Two independent CAN channels with 32 mailboxes each - suitable for multi-node industrial automation networks. |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Safety Support | Oscillation-stop detection, CRC calculator (8/32-bit), IWDT with window function, self-diagnostic A/D, and register write protection - simplifies Class B certification for household and industrial appliances. |
| Graphics Acceleration | Integrated GLCDC + DRW2D - renders layered UIs (3 planes), performs vector drawing and bit-blitting in hardware, reducing CPU load in HMI applications. |
| Event Link Controller (ELC) | 83 internal event sources - enables timer-triggered ADC sampling, PWM-triggered D/A updates, or CAN message transmission without CPU intervention. |
| Dual-Bank Flash Architecture | Independent bank read/write capability - allows active firmware execution from one bank while updating the other, eliminating reboot requirements during field upgrades. |
| Low-Power Operation | Four low-power modes (sleep, all-module stop, software standby, deep software standby) with 0.19 mA/MHz typical current - extends battery life in always-on edge devices. |
Applications
| Industrial HMI Panel | Smart Gateway Device |
|---|---|
Use Scenario: Embedded touchscreen display in factory automation panels with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving GLCDC/DRW2D for graphics rendering, and managing SDHI for log storage. Use Value: 640 KB SRAM and dual-bank flash enable smooth UI animation and atomic firmware updates without interrupting display operation. | Use Scenario: Protocol translation node connecting Modbus RTU field devices to cloud via Ethernet and TLS-secured MQTT. IC Role / Device Role / Timing Role: Network controller handling Ethernet packet processing, CAN frame bridging, and AES-encrypted TLS handshake acceleration. Use Value: Hardware TSIP and AES engines reduce CPU utilization by >40% during secure session establishment versus software-only crypto. |
| Secure Edge Node | Motor Control Gateway |
Use Scenario: Field-deployed sensor aggregator collecting vibration, temperature, and humidity data with encrypted local storage and scheduled upload. IC Role / Device Role / Timing Role: Data acquisition hub running sensor fusion algorithms, storing results in data flash, and performing AES-GCM encryption before transmission. Use Value: On-chip temperature sensor and 12-bit dual A/D converters eliminate external signal conditioning, reducing BOM cost and board area. | Use Scenario: Centralized drive controller coordinating multiple BLDC motors via CANopen, with real-time torque profiling and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller generating complementary PWM waveforms using MTU3a, reading position feedback via SCIi, and logging faults to data flash. Use Value: MTU3a's dead-time compensation and phase-counting mode enable precise 3-phase inverter control without external gate drivers or FPGA logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFB#10 | Same RX65N Group, identical 176-pin LFBGA package, but with 2 MB flash and 640 KB SRAM - no change in peripheral set or clock specs. | Preferred where larger firmware footprint (e.g., full TCP/IP stack + web server) or extended data logging requires >1.5 MB code space. | Select R5F5651EDFB#10 only if additional flash capacity is required; pinout, software, and layout are identical. |
| R5F566TEADFP#30 | RX66T Group part in 144-pin LQFP; higher max frequency (160 MHz), enhanced MTU3 with 3-phase PWM, but lacks Ethernet MAC, SDHI, and TSIP. | Targeted at high-performance motor control (e.g., servo drives) where Ethernet and secure boot are not needed. | Not interchangeable - different package, no Ethernet/SD support, and incompatible safety features; requires full hardware and software redesign. |
Compared with R5F56517FDFB#10, R5F5651EDFB#10 offers identical functionality with expanded flash for complex protocol stacks, while R5F566TEADFP#30 trades connectivity and security for raw motor-control performance - making R5F56517FDFB#10 optimal for secure, connected industrial edge nodes requiring balanced compute, I/O, and trust.
Availability
R5F56517FDFB#10 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, secure edge node, and motor control gateway applications requiring stable component supply across long product lifecycles.
Supply support for R5F56517FDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for automotive, industrial, and IoT markets.
The RX65N Group - to which R5F56517FDFB#10 belongs - was designed for industrial and building automation systems requiring rich connectivity (Ethernet, CAN, SD), embedded graphics, functional safety, and secure firmware execution.
FAQ
What is the maximum operating frequency and core type of the R5F56517FDFB#10?
The R5F56517FDFB#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit, 5-stage pipeline, and variable-length instruction set. Its architecture supports deterministic real-time execution essential for industrial control tasks within the R5F56517FDFB#10 design envelope.
Does the R5F56517FDFB#10 support Ethernet connectivity, and what interface standards does it implement?
Yes, the R5F56517FDFB#10 integrates a full Ethernet MAC supporting both 10 Mbps and 100 Mbps operation in full- and half-duplex modes. It implements IEEE 802.3u-compliant MII and RMII physical layer interfaces and includes EDMAC for descriptor-based DMA transfers. The R5F56517FDFB#10 also supports Wake-on-LAN and IEEE 802.3x flow control - enabling robust wired network integration without external PHY logic.
What security features are built into the R5F56517FDFB#10 for firmware and data protection?
The R5F56517FDFB#10 includes AES-128/192/256 encryption engines and Renesas' Trusted Secure IP (TSIP) module for secure key management and cryptographic acceleration. It also provides a memory protection unit (MPU), register write protection, oscillation-stop detection, and CRC calculation (8-/32-bit) - all certified for IEC60730 Class B compliance. These features collectively protect the R5F56517FDFB#10 against unauthorized access, tampering, and runtime faults.
How much on-chip memory does the R5F56517FDFB#10 provide, and what are its access characteristics?
The R5F56517FDFB#10 includes 1.5 MB of dual-bank code flash (with 1-wait state up to 100 MHz), 32 KB of reprogrammable data flash (100,000 erase cycles), 640 KB of SRAM (256 KB main + 384 KB expansion, zero wait states at 120 MHz), and 8 KB of battery-backed standby RAM. The R5F56517FDFB#10's memory architecture enables concurrent execution and programming, critical for fail-safe firmware updates in field-deployed systems.
What is the package type and pin count of the R5F56517FDFB#10, and what are its thermal specifications?
The R5F56517FDFB#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Quad Flat Package (LFBGA) measuring 24 × 24 mm with 0.5 mm pitch. It is rated for industrial temperature range (–40°C to +85°C), classified as D-version per Renesas documentation. This package supports high I/O density (136 general-purpose pins, 19 with 5-V tolerance) and is optimized for automated assembly and thermal dissipation in compact industrial enclosures.
R5F56517FDFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517FDFB#10 FAQ
1.How can I place an order for R5F56517FDFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517FDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517FDFB#10 reliable?
The price and inventory of R5F56517FDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517FDFB#10 is usually 5 days.
3.What payment methods are accepted for R5F56517FDFB#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517FDFB#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517FDFB#10?
R5F56517FDFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517FDFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517FDFB#10?
For technical support, including R5F56517FDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517FDFB#10 requirements.
6.How does Aetrix verify that R5F56517FDFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F56517FDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517FDFB#10 meets industry standards.
7.What is the process for return or replacement of R5F56517FDFB#10?
All R5F56517FDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517FDFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517FDFB#10 part is unused and in its original packaging.
Return procedure for R5F56517FDFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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