Renesas R5F56517FGBP#20

Overview

R5F56517FGBP#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, dual-bank flash for background programming, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC with DRW2D graphics engine. It targets industrial HMI, networked gateway, and secure IoT edge controllers.

For engineers reviewing the R5F56517FGBP#20 datasheet, R5F56517FGBP#20 pinout, R5F56517FGBP#20 application, or R5F56517FGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C G-grade operation, 2-channel CAN with 32 mailboxes per channel, 12-bit dual A/D converter (29 total channels), and TSIP-based AES-128/192/256 encryption support.

Technical Context

The R5F56517FGBP#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a memory protection unit (MPU) with eight configurable regions and Trusted Memory (TM) for secure code execution in the flash target area.

Its clock system combines external crystal (8–24 MHz), internal HOCO (16/18/20 MHz), LOCO (240 kHz), and PLL for flexible domain partitioning: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for ETHERC/DRW2D/GLCDC, and PCLKB up to 60 MHz for most peripherals including S12AD units and TMR timers.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant, G-grade temperature range (−40°C to +105°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517FGBP#20, the R5F5651EDFP#30 reduces footprint and cost by removing Ethernet, graphics, and 384 KB of SRAM, while the R5F566TEBDFP#30 trades connectivity and security for superior motor-control timing precision and thermal robustness-neither offers pin compatibility or identical peripheral set.

Availability

R5F56517FGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge applications requiring stable component supply, long-term lifecycle assurance, and G-grade temperature resilience.

Supply support for R5F56517FGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group-including R5F56517FGBP#20-is designed for high-integration industrial edge devices requiring real-time performance, rich connectivity (Ethernet/CAN/SD), graphics capability, and hardware-rooted security (TSIP/AES).

FAQ

What is the maximum operating frequency and core architecture of the R5F56517FGBP#20?

The R5F56517FGBP#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit, two MAC units, and 32-bit multiplier with one-cycle execution. This architecture enables deterministic real-time response and compact code size essential for R5F56517FGBP#20-based industrial control systems.

Does the R5F56517FGBP#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56517FGBP#20 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256 encryption/decryption in hardware, CRC calculation for 8- and 32-bit data, and Trusted Memory (TM) functionality that prevents unauthorized read-out of protected code flash regions. Its dual-bank flash architecture allows background programming and atomic bank swapping-enabling secure, interruption-free firmware updates. These capabilities are fully implemented in the R5F56517FGBP#20 silicon and documented in Renesas Application Note R01AN3813.

What are the key differences between the R5F56517FGBP#20 and the R5F5651EDFP#30?

The R5F56517FGBP#20 uses a 176-pin LFBGA (PLQP0176KB-A) with 1.5 MB flash, 640 KB SRAM, Ethernet MAC, GLCDC, DRW2D, and TSIP, while the R5F5651EDFP#30 is a 144-pin LFQFP device with 1 MB flash, 256 KB SRAM, no Ethernet or graphics engines, and no TSIP. Both belong to the RX65N Group but differ in package, memory, and peripheral integration-R5F56517FGBP#20 targets feature-rich edge nodes, whereas R5F5651EDFP#30 serves cost-optimized control-only applications.

Which A/D converter resources are available on the R5F56517FGBP#20 and what is their performance?

The R5F56517FGBP#20 integrates two independent 12-bit A/D converters: S12AD0 (8 channels) and S12AD1 (21 channels), totaling 29 analog inputs. Conversion time is 0.48 µs per channel at 12-bit resolution, with selectable 8-/10-/12-bit modes. S12AD1 is clocked by PCLKD (up to 60 MHz), enabling precise phase-aligned sampling across all 21 channels-critical for power monitoring. Both units support self-diagnostic, disconnection detection, and trigger sources including MTU3, TMR, and external signals-fully specified for R5F56517FGBP#20 in Section 28 of Datasheet R01DS0276EJ0240.

What package type and temperature grade does the R5F56517FGBP#20 use?

The R5F56517FGBP#20 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for the G-grade industrial temperature range of −40°C to +105°C, making it suitable for demanding environments such as factory automation, energy infrastructure, and transportation systems. This package and grade are explicitly assigned to R5F56517FGBP#20 in Renesas' ordering information table and confirmed in Package Code "GB" documentation.