Renesas R5F56517FGFB#30

Overview

R5F56517FGFB#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, on-chip FPU compliant with IEEE-754 single-precision, 2 MB code flash memory (dual-bank), and 640 KB SRAM - designed for industrial HMI, networked gateway, and secure IoT edge node applications requiring Ethernet MAC, USB FS host/function, CAN, SDIO, and GLCDC.

For engineers reviewing the R5F56517FGFB#30 datasheet, R5F56517FGFB#30 pinout, R5F56517FGFB#30 application, or R5F56517FGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120 MHz real-time execution capability, integrated TSIP encryption engine, dual-channel CAN with 32 mailboxes per channel, and hardware-accelerated 2D drawing (DRW2D) for embedded graphics.

Technical Context

The R5F56517FGFB#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-kHz IWDT clock source, MPU with eight protection areas (16-byte granularity), and Trusted Memory (TM) to restrict instruction fetch only from protected flash regions.

Its peripheral subsystem includes an Ethernet MAC supporting MII/RMII at 10/100 Mbps, dual-channel CAN (ISO 11898-1), three RSPI channels with 128-bit buffers, and two independent 12-bit A/D converters (8 + 21 channels) with self-diagnostic and analog disconnection detection - all synchronized to separate PCLK domains (PCLKA up to 120 MHz, PCLKB up to 60 MHz).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517FGFB#30, R5F56519FGFB#30 offers identical packaging and peripheral compatibility at lower memory cost, while R5F566TEBDFB#30 trades networking/graphics capability for enhanced real-time motor control features - neither is pin-compatible drop-in replacement for all R5F56517FGFB#30 use cases.

Availability

R5F56517FGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge node applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature range (–40°C to +105°C).

Supply support for R5F56517FGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX65N Group - including R5F56517FGFB#30 - was designed specifically for secure, connected industrial edge devices requiring integrated Ethernet, CAN, USB, graphics acceleration, and hardware cryptography in a single chip.

FAQ

What is the maximum operating frequency and CPU performance of the R5F56517FGFB#30?

The R5F56517FGFB#30 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS performance using the RXv2 CPU core. Its single-precision IEEE-754 floating-point unit, dual multiply-accumulate units, and 5-stage pipeline enable deterministic real-time execution - verified in Renesas' R01DS0276EJ0240 datasheet Rev.2.40. The R5F56517FGFB#30 sustains this performance across its full temperature range (–40°C to +105°C).

Does the R5F56517FGFB#30 support dual-bank flash for firmware updates?

Yes, the R5F56517FGFB#30 includes a dual-bank code flash architecture enabling background programming and erasing while executing from the alternate bank. This allows seamless firmware updates without interrupting real-time operation - a key requirement for industrial gateways and medical devices. The R5F56517FGFB#30's 2 MB flash is partitioned into two banks, and startup bank selection is controlled via boot mode pins or software configuration.

What security features does the R5F56517FGFB#30 provide for IoT applications?

The R5F56517FGFB#30 integrates Trusted Secure IP (TSIP) with hardware AES-128/192/256 engines, memory protection unit (MPU), register write protection, CRC calculator, and IEC60730-compliant self-test functions. These features collectively support secure boot, encrypted firmware storage, TLS acceleration, and functional safety certification - directly addressing threats in cloud-connected edge nodes. The R5F56517FGFB#30 implements these per Renesas' documented TSIP specification in the RX65N Group datasheet.

Can the R5F56517FGFB#30 drive a graphic LCD without external controllers?

Yes, the R5F56517FGFB#30 includes a dedicated Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + 2 graphics planes), 32/16 bpp pixel formats, and direct AXI bus access to frame buffers. Combined with the DRW2D 2D drawing engine for accelerated vector and bit-blit operations, the R5F56517FGFB#30 eliminates need for external graphics controllers in HMI applications - confirmed by timing diagrams and register maps in the R5F56517FGFB#30 datasheet section 42.

What is the package type and thermal specification of the R5F56517FGFB#30?

The R5F56517FGFB#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 24 mm × 24 mm body, 0.5 mm ball pitch, and exposed thermal pad. It is rated for industrial temperature range (–40°C to +105°C), designated as the "G-version" per Renesas' ordering nomenclature - validated in the RX65N Group datasheet Table 1.2 and package outline drawing PS0002-A.