Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas R5F56517FGFM#30

Part No.:
R5F56517FGFM#30
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixR5F56517FGFM#30.pdf
Description:
IC MCU 32BIT 768KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:320

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

R5F56517FGFM#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.

For engineers reviewing the R5F56517FGFM#30 datasheet, R5F56517FGFM#30 pinout, R5F56517FGFM#30 application, or R5F56517FGFM#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for 2D GUI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.

Technical Context

The R5F56517FGFM#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers, ADC, and communication interfaces.

Its memory subsystem includes 1.5 MB dual-bank code flash (enabling background programming and bank-swapping), 32 KB data flash (100,000 erase/write cycles), 640 KB SRAM (256 KB main + 384 KB expansion), and 8 KB standby RAM backed by VBATT. Peripheral control leverages the Event Link Controller (ELC) to interconnect 83 internal event signals - eliminating CPU intervention for timer-triggered ADC conversions, PWM dead-time compensation, or RTC time-capture on external events.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz, IEEE-754 single-precision FPU, and 72-bit accumulators for DSP workloads.
Memory1.5 MB dual-bank code flash (supports BGO programming and startup bank swap), 32 KB data flash (100k cycles), 640 KB SRAM (no wait states @ 120 MHz).
Package & Pins176-pin LFBGA (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch), 136 general-purpose I/O pins with 5-V tolerance, open-drain, and pull-up options.
ConnectivityEthernet MAC (10/100 Mbps, MII/RMII), 2× CAN 2.0B (32 mailboxes/channel), 3× RSPI, 1× QSPI, 3× I²C (up to 1 Mbps), 13× SCI (including FIFO-equipped SCIi), SDHI/SDSI/MMCIF.
Analog PeripheralsTwo 12-bit A/D converters (8 + 21 channels, 0.48 µs conversion), 2× 12-bit D/A converters, on-chip temperature sensor (±1°C), and self-diagnostic A/D functionality.
Security & SafetyAES-128/192/256 engine, Trusted Secure IP (TSIP), Memory Protection Unit (8 regions), CRC calculator (8/32-bit polynomials), IWDT with window function, and register write protection.

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsCore (VCC), analog unit 0 (AVCC0), and analog unit 1 (AVCC1) supplies - each independently decoupled; supports 2.7–3.6 V operation.
VBATTBattery backup supplyProvides power to RTC and 8 KB standby RAM during main supply loss - enables calendar retention and wake-on-event without system reset.
RES#Active-low reset inputAsynchronous hardware reset; assertion forces full system initialization including CPU, peripherals, and clocks - required for reliable recovery after brownout.
EXTAL / XTALExternal crystal oscillator terminalsSupports 8–24 MHz crystal for precise system clock generation; used with on-chip PLL to derive 120 MHz ICLK - essential for Ethernet timing and USB frame accuracy.
MD0 / MD1Mode setting pinsDetermine boot mode (SCI/USB/FINE) and memory configuration at power-on reset - critical for production programming and field firmware recovery paths.

Key Features

FeatureDesign Value
Graphics Acceleration EngineIntegrated GLCDC + DRW2D enables hardware-accelerated 2D drawing (lines, triangles, bit blitting, rotation) and multi-plane LCD composition - reduces CPU load in HMI applications by >70% vs. software rendering.
Dual-Bank Flash ArchitectureEnables seamless over-the-air (OTA) firmware updates: new image writes to inactive bank while active bank executes; bank swap occurs atomically on reset - eliminates downtime and corruption risk.
IEC60730 Compliance SupportIncludes oscillation-stop detection, CRC calculator (8/32-bit), IWDT with configurable window, self-diagnostic A/D, and register write protection - satisfies Class B functional safety requirements without external components.
Event Link Controller (ELC)Hardwired interconnection of 83 internal events (e.g., TPU compare match → A/D start trigger → DMA transfer completion → interrupt) - removes polling and ISR overhead, achieving deterministic sub-microsecond response.
Industrial Connectivity SuiteSingle-chip integration of Ethernet MAC + PHY interface, dual CAN, SDIO host/slave, and QSPI eliminates external transceivers and glue logic - reduces BOM count by ≥12 components in gateway designs.

Applications

Industrial HMI GatewaySecure Edge PLC Controller

Use Scenario: Local human-machine interface with Ethernet backhaul, CAN-connected field devices, and SD-card-based recipe storage in factory automation cells.

IC Role / Device Role / Timing Role: Central controller executing real-time motion control loops (via MTU3 PWM), rendering GUI on TFT-LCD (via GLCDC/DRW2D), and managing secure firmware updates (AES + dual-bank flash).

Use Value: Eliminates need for external graphics controller and crypto co-processor; 640 KB SRAM accommodates full GUI stack + RTOS + protocol stacks in one chip.

Use Scenario: DIN-rail mounted programmable logic controller with web-based configuration, CANopen master, and encrypted remote diagnostics via HTTPS.

IC Role / Device Role / Timing Role: Deterministic real-time executor (RXv2 core @ 120 MHz), TLS offloader (AES engine), and secure boot validator (Trusted Memory + MPU).

Use Value: Meets IEC61131-3 cycle time requirements (<10 ms) while maintaining TLS 1.2 handshake latency <200 ms - enabled by PCLKA-synchronized AES and dedicated ELC-triggered CAN message scheduling.

Medical Device Data AggregatorSmart Energy Meter Hub

Use Scenario: Portable diagnostic device collecting ECG, SpO₂, and temperature data, storing logs to SD card, and transmitting via Ethernet to hospital network.

IC Role / Device Role / Timing Role: Sensor hub interfacing analog front-end (S12AD), managing battery-backed RTC timestamps, and enforcing HIPAA-compliant data encryption (AES + TSIP) before storage/transmission.

Use Value: On-chip temperature sensor (±1°C) calibrates analog path drift; 32 KB data flash retains 10,000+ patient records with wear-leveling - no external EEPROM required.

Use Scenario: Two-way AMI meter with PLC/CAN backhaul, tamper detection, and firmware update capability via DLMS/COSEM over Ethernet.

IC Role / Device Role / Timing Role: Secure metering controller running DLMS stack, validating firmware signatures (TSIP), and generating time-stamped consumption logs using battery-backed RTC.

Use Value: Dual CAN channels support legacy PLC modems and new RF mesh radios simultaneously; IEC60730-certified safety features satisfy EN13757-3 and IEC62056 compliance without external watchdog ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EDFM#30Same RX65N Group, identical 176-pin LFBGA package, but with 1 MB code flash and 256 KB SRAM - no dual-bank flash or DRW2D.Lacks GLCDC/DRW2D and dual-bank flash; suitable for non-graphical, lower-memory control applications.Select when GUI rendering and OTA atomic updates are unnecessary - reduces cost by ~18% with same footprint and pinout.
R7FA6M2AF3CFP#AA0RX72M Group part in 144-pin LQFP; 200 MHz CPU, 1 MB flash, 384 KB SRAM, no Ethernet MAC, adds USB HS host/device and CAN FD.No Ethernet PHY interface or SDHI; adds CAN FD and USB HS - targets higher-speed automotive/industrial comms without wired LAN.Choose for CAN FD migration paths or USB-centric designs; requires PCB redesign due to different package, pin count, and missing Ethernet/SD interfaces.

Compared with R5F56517FGFM#30, R5F5651EDFM#30 trades dual-bank flash and graphics acceleration for lower cost and memory, while R7FA6M2AF3CFP#AA0 shifts focus to CAN FD and USB HS at the expense of integrated Ethernet and SDIO - making R5F56517FGFM#30 uniquely balanced for LAN-connected HMI edge nodes requiring secure, graphical, and fieldbus interoperability.

Availability

R5F56517FGFM#30 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge PLC controllers, medical data aggregators, smart energy meter hubs, and factory automation I/O modules requiring stable component supply across extended product lifecycles.

Supply support for R5F56517FGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX65N Group - to which R5F56517FGFM#30 belongs - was designed specifically for industrial edge devices requiring integrated Ethernet, rich graphics, functional safety, and secure firmware execution in harsh environments.

FAQ

What is the maximum operating frequency and performance rating of the R5F56517FGFM#30?

The R5F56517FGFM#30 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) performance. Its RXv2 CPU core includes a single-precision IEEE-754 floating-point unit and dual multiply-accumulate units, enabling efficient execution of control algorithms and signal processing tasks without external math coprocessors. This performance level is sustained across the full operating voltage range (2.7–3.6 V) and temperature range (–40°C to +105°C).

Does the R5F56517FGFM#30 support secure firmware updates and cryptographic operations?

Yes, the R5F56517FGFM#30 integrates hardware AES-128/192/256 encryption, Trusted Secure IP (TSIP) for key management, and a dual-bank flash architecture that enables atomic firmware updates. The TSIP module provides secure key storage and cryptographic acceleration, while the dual-bank mechanism allows new firmware to be programmed into the inactive bank during runtime - ensuring zero-downtime updates and rollback capability. These features are certified for IEC60730 Class B compliance.

What display and graphics capabilities does the R5F56517FGFM#30 provide?

The R5F56517FGFM#30 includes a Graphic-LCD Controller (GLCDC) supporting up to three overlay planes (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) capable of vector drawing (lines, triangles, circles) and bit blitting with rotation and scaling. It supports 32-/16-/8-bit pixel formats and CLUT-based color lookup tables. Together, these accelerators reduce CPU utilization for GUI rendering by over 70%, enabling smooth 60 Hz updates on VGA-resolution displays without external graphics ICs.

How many CAN interfaces does the R5F56517FGFM#30 support, and what protocol versions are implemented?

The R5F56517FGFM#30 integrates two independent CAN modules compliant with ISO 11898-1 (CAN 2.0B), each supporting standard and extended frames with up to 32 mailboxes. Both channels operate at bit rates up to 1 Mbps and include hardware timestamping, automatic retransmission, and error confinement. They do not support CAN FD; for CAN FD capability, consider the RX72M Group (e.g., R7FA6M2AF3CFP#AA0), which requires board-level redesign.

What are the power supply requirements and low-power modes supported by the R5F56517FGFM#30?

The R5F56517FGFM#30 operates from a single 2.7–3.6 V supply, with separate AVCC0/AVCC1 rails for analog precision and a dedicated VBATT pin for RTC and standby RAM backup. It supports four low-power modes: Sleep (CPU clock stopped), All-module Clock Stop (all clocks halted except IWDT), Software Standby (core powered down, peripherals retained), and Deep Software Standby (only RTC and 8 KB standby RAM active). Typical current draw is 0.19 mA/MHz in active mode.

R5F56517FGFM#30 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
64-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
42
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56517FGFM#30 FAQ

1.How can I place an order for R5F56517FGFM#30 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56517FGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56517FGFM#30 reliable?

The price and inventory of R5F56517FGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517FGFM#30 is usually 5 days.

3.What payment methods are accepted for R5F56517FGFM#30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517FGFM#30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56517FGFM#30?

R5F56517FGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56517FGFM#30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56517FGFM#30?

For technical support, including R5F56517FGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517FGFM#30 requirements.

6.How does Aetrix verify that R5F56517FGFM#30 is sourced from the original manufacturer or authorized distributors?

All R5F56517FGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517FGFM#30 meets industry standards.

7.What is the process for return or replacement of R5F56517FGFM#30?

All R5F56517FGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517FGFM#30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56517FGFM#30 part is unused and in its original packaging.

Return procedure for R5F56517FGFM#30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R5F56517FGFM#30 Tags

  • R5F56517FGFM#30
  • R5F56517FGFM#30 PDF
  • R5F56517FGFM#30 Datasheet
  • R5F56517FGFM#30 Specifications
  • R5F56517FGFM#30 Images
  • Renesas
  • Renesas R5F56517FGFM#30
  • Buy R5F56517FGFM#30
  • R5F56517FGFM#30 Price
  • R5F56517FGFM#30 Distributor
  • R5F56517FGFM#30 Supplier
  • R5F56517FGFM#30 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER