Renesas R5F56517FGFP#10
- Part No.:
- R5F56517FGFP#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56517FGFP#10.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,341
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Product details
Overview
R5F56517FGFP#10 from Renesas is a 120-MHz 32-bit RXv2 core MCU with on-chip FPU, 240 DMIPS performance, 2 MB code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC/DRW2D graphics subsystems - deployed in industrial HMI, networked gateways, and secure IoT edge controllers.
For engineers reviewing the R5F56517FGFP#10 datasheet, R5F56517FGFP#10 pinout, R5F56517FGFP#10 application, or R5F56517FGFP#10 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +105°C G-grade operation, TSIP-based AES-128/192/256 encryption, dual 12-bit A/D converters (21+8 channels), and real-time clock with battery backup support.
Technical Context
The R5F56517FGFP#10 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, IEEE-754 single-precision FPU, and dual multiply-accumulate units - enabling deterministic real-time control and signal processing at 120 MHz. Its memory subsystem includes 2 MB flash with zero-wait access up to 50 MHz (cache-hit), 640 KB SRAM with no wait states, and 32 KB data flash rated for 100,000 erase/write cycles.
Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU), PCLKA (up to 120 MHz for ETHERC, GLCDC, DRW2D), PCLKB (up to 60 MHz for TMR, CMT, SCI), and PCLKC/PCLKD (60 MHz for S12AD units). The ELC enables hardware-triggered inter-module coordination without CPU intervention - critical for low-latency motor control and sensor fusion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 FPU, 5-stage pipeline |
| Memory | 2 MB dual-bank code flash (0-wait ≤50 MHz), 640 KB SRAM (no wait), 32 KB data flash (100k cycles) |
| Analog | Dual 12-bit S12AD (8+21 channels), 2× R12DA (buffered/unbuffered), on-die temperature sensor (±1°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1, 32 mailboxes/channel), 3× RSPI, 1× QSPI, 3× RIIC (1 Mbps), 13× SCI |
| Graphics & Media | GLCDC (3-plane overlay), DRW2D (vector/bitblit), PDC (CMOS camera interface), SDHI/SDSI/MMCIF (1–4-bit buses) |
| Security & Safety | TSIP crypto engine (AES-128/192/256), MPU (8 regions), Trusted Memory, CRC calculator, IEC60730 self-test functions |
| Package & Temp | LFBGA-176 (13 × 13 mm, 0.8 mm pitch), G-grade (-40°C to +105°C) |
Pinout & Package
Package: PLBG0176GA-A, 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1) - each requires local decoupling per datasheet layout guidelines |
| VBATT | Battery backup supply | Provides power to RTC during main VCC dropout; enables calendar/timekeeping in deep software standby mode |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal; required for high-accuracy timing and Ethernet PHY synchronization |
| MD0 / MD1 | Mode setting pins | Determine boot source (SCI/USB/FINE) and operating mode at reset release; must be pulled high/low per configuration |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring external Ethernet PHY registers |
| ETXD0–ETXD3 / ERXD0–ERXD3 | Ethernet data lines | MII interface signals (4-bit TX/RX data); RMII mode uses only ETXD0/ERXD0 + REF_CLK |
| CAN0TX / CAN0RX / CAN1TX / CAN1RX | CAN transceiver I/O | Differential signal pairs for two independent ISO 11898-1 CAN buses; require external CAN transceivers |
| SD0CMD / SD0CLK / SD0DAT0–3 | SD host interface signals | 4-bit SD bus supporting SD memory and SDIO cards per Physical Layer Spec v3.01 (no DDR) |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables background programming and seamless firmware updates without halting application execution |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES encryption/decryption with key wrapping and secure key storage - certified for IEC62443-3-3 |
| Event Link Controller (ELC) | 83 internal event sources routed without CPU involvement - reduces interrupt latency for time-critical tasks like PWM-triggered ADC sampling |
| Graphic-LCD controller (GLCDC) | Supports 3-layer overlay (background + 2 graphics planes), 32/16 bpp formats, and CLUT-based color mapping for embedded displays |
| 2D drawing engine (DRW2D) | Offloads CPU with hardware-accelerated vector rendering (lines, circles), bitblit (copy/stretch/rotate), and texture mapping |
| IEC60730 safety functions | Includes oscillation-stop detection, CRC calculator, IWDT windowing, A/D self-diagnostic, and register write protection for Class B compliance |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
Use Scenario: Standalone touch-enabled operator interface for PLC-controlled machinery with local graphics rendering and remote diagnostics. IC Role / Device Role / Timing Role: Primary application processor running RTOS, driving 480×272 LCD via GLCDC/DRW2D, managing CAN/RS485 fieldbus comms, and executing encrypted firmware updates. Use Value: Integrated graphics engine eliminates external GPU; dual-bank flash enables safe over-the-air updates; TSIP secures update payloads and device identity. | Use Scenario: Protocol-bridging gateway aggregating Modbus RTU, CANopen, and BACnet MS/TP traffic into encrypted TLS-secured MQTT streams to cloud platforms. IC Role / Device Role / Timing Role: Central protocol translator with Ethernet MAC + PHY interface, dual CAN channels, multiple SCI ports, and AES-256 encryption for payload confidentiality. Use Value: On-chip Ethernet and CAN eliminate external PHY/transceivers; TSIP accelerates TLS handshake; 640 KB SRAM buffers multi-protocol message queues. |
| Networked Energy Meter | Smart Building Controller |
Use Scenario: DIN-rail mounted meter with pulse counting, harmonic analysis, and IEEE 802.3-compliant Ethernet reporting for utility grid monitoring. IC Role / Device Role / Timing Role: Real-time data acquisition node using dual S12AD units (21-channel for voltage/current sensors), RTC with leap-year correction, and Ethernet MAC for time-synchronized reporting. Use Value: 120 MHz CPU handles FFT-based harmonic calculations in real time; battery-backed RTC maintains accurate timestamping during mains failure. | Use Scenario: HVAC and lighting controller integrating BACnet/IP, KNX, and DALI interfaces with local scheduling and occupancy-based optimization. IC Role / Device Role / Timing Role: Multi-protocol system-on-chip with SDHI for firmware logging, DRW2D for UI rendering, and multiple SCI/RIIC channels for peripheral bridging. Use Value: Single-chip integration reduces BOM count and board area; 176-pin LFBGA supports dense routing of 136 GPIOs for sensor/actuator expansion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFPL#30 | Same RX65N Group, 144-pin LQFP package, 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDC | Suitable for cost-sensitive, non-graphical control applications without Ethernet connectivity | Select when Ethernet, graphics, or >1 MB flash are unnecessary - reduces PCB complexity and cost |
| R5F566TEADFP#30 | RX66T Group, 176-pin LFBGA, 120 MHz, 2 MB flash, but optimized for motor control (32-bit MTU3, encoder interfaces, no GLCDC/SDHI) | Targeted at servo drives and inverters requiring high-precision PWM and position feedback | Choose for motion control where real-time PWM dead-time compensation and encoder capture outweigh graphics/Ethernet needs |
Compared with R5F56517FGFP#10, the R5F5651EDFPL#30 sacrifices Ethernet, graphics, and memory capacity for lower cost and simpler packaging, while the R5F566TEADFP#30 trades multimedia peripherals for enhanced motor-control peripherals - making R5F56517FGFP#10 optimal for connected, display-rich industrial edge nodes.
Availability
R5F56517FGFP#10 is available at Aetrix Electronics and suitable for industrial HMIs, secure edge gateways, and networked energy meters requiring stable component supply, long-term lifecycle assurance, and automotive-grade thermal reliability.
Supply support for R5F56517FGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RX65N Group - including R5F56517FGFP#10 - was designed for secure, connected industrial equipment requiring rich human-machine interaction, real-time networking, and functional safety certification support.
FAQ
What is the maximum operating frequency and core type of the R5F56517FGFP#10?
The R5F56517FGFP#10 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. It includes a single-precision IEEE-754 floating-point unit, dual MAC units, and a 5-stage pipeline - all confirmed in the official R01DS0276EJ0240 datasheet Rev.2.40. This specification applies specifically to the R5F56517FGFP#10 in its G-grade temperature range.
Does the R5F56517FGFP#10 include hardware encryption capabilities?
Yes, the R5F56517FGFP#10 integrates Renesas' Trusted Secure IP (TSIP) module supporting AES-128, AES-192, and AES-256 encryption/decryption with key wrapping and secure key storage. TSIP is hardware-accelerated and certified for IEC62443-3-3, enabling secure firmware updates and TLS offload - a confirmed feature in the RX65N Group security section of the datasheet.
What package type and pin count does the R5F56517FGFP#10 use?
The R5F56517FGFP#10 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) measuring 13 mm × 13 mm with 0.8 mm ball pitch. This matches the "G-version" industrial temperature grade (-40°C to +105°C) and is explicitly listed in Table 1.2 of the R01DS0276EJ0240 datasheet.
Which communication interfaces are integrated into the R5F56517FGFP#10?
The R5F56517FGFP#10 integrates Ethernet MAC (10/100 Mbps, MII/RMII), two CAN 2.0B channels (ISO 11898-1), three RSPI, one QSPI, three RIIC (1 Mbps), 13 SCI channels (including SCIi with 16-byte FIFOs), SD host/slave interfaces, and MMCIF - all verified in the "Communication function" section of the R01DS0276EJ0240 datasheet.
Is the R5F56517FGFP#10 supported for IEC60730 Class B safety compliance?
Yes, the R5F56517FGFP#10 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stoppage detection, frequency measurement, CRC calculator (CRCA), independent watchdog timer (IWDTa) with windowing, A/D converter self-diagnostic, and register write protection - all documented in Section 1.1 and the "Useful functions for IEC60730 compliance" subsection of the R01DS0276EJ0240 datasheet.
R5F56517FGFP#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517FGFP#10 FAQ
1.How can I place an order for R5F56517FGFP#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517FGFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517FGFP#10 reliable?
The price and inventory of R5F56517FGFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517FGFP#10 is usually 5 days.
3.What payment methods are accepted for R5F56517FGFP#10?
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Once your R5F56517FGFP#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517FGFP#10?
For technical support, including R5F56517FGFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517FGFP#10 requirements.
6.How does Aetrix verify that R5F56517FGFP#10 is sourced from the original manufacturer or authorized distributors?
All R5F56517FGFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517FGFP#10 meets industry standards.
7.What is the process for return or replacement of R5F56517FGFP#10?
All R5F56517FGFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517FGFP#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517FGFP#10 part is unused and in its original packaging.
Return procedure for R5F56517FGFP#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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