Renesas R5F56517FGLJ#20
- Part No.:
- R5F56517FGLJ#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-TFLGA
- Datasheet:
-
R5F56517FGLJ#20.pdf
- Description:
- IC MCU 32BIT 768KB FLSH 100TFLGA
- Quantity:
- Payment:

- Shipping:

Inventory:416
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56517FGLJ#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.
For engineers reviewing the R5F56517FGLJ#20 datasheet, R5F56517FGLJ#20 pinout, R5F56517FGLJ#20 application, or R5F56517FGLJ#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for 2D GUI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.
Technical Context
The R5F56517FGLJ#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-MHz system clock (ICLK) and independent peripheral clocks (PCLKA up to 120 MHz for ETHERC/DRW2D/GLCDC; PCLKB up to 60 MHz for timers/A/D).
Its memory subsystem includes dual-bank flash supporting background programming and bank-swapping at reset, 32 KB data flash rated for 100,000 erase/write cycles, and 8 KB standby RAM backed by VBATT. Safety-critical functions are enabled via MPU (8 regions), Trusted Memory (TM) for code protection, and CRCA supporting configurable 8-/32-bit CRC polynomials.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz, IEEE-754 single-precision FPU |
| Memory | 1.5 MB code flash (dual-bank), 32 KB data flash (100k cycles), 640 KB SRAM (no wait states), 8 KB standby RAM |
| Operating Frequency | Max 120 MHz system clock (ICLK); PCLKA up to 120 MHz; PCLKB/PCLKC/PCLKD up to 60 MHz |
| Peripherals | Ethernet MAC (10/100 Mbps), 2× CAN 2.0B (32 mailboxes/channel), SDHI/SDSI/MMCIF, QSPI, 3× RSPI, 13× SCI, 3× RIIC, GLCDC + DRW2D |
| Analog | Two 12-bit A/D units (8 + 21 channels), 2× 12-bit D/A, on-die temperature sensor (±1°C) |
| Security & Safety | AES-128/192/256, TSIP, MPU (8 regions), CRCA, IWDT with window function, register write protection, IEC60730 support |
| Package | LFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, –40°C to +105°C (G-version) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Core/analog power domains (2.7–3.6 V); AVCC0/AVCC1 independently decoupled for noise-sensitive ADC/DAC |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; supports deep software standby retention |
| RES#, MODE0–MODE2 | Reset and boot configuration | Hardware reset assertion; boot mode selection (SCI/USB/FINE) at power-up |
| ETXD0–7, ERXD0–7, ETXEN, ERXDV, ECRS, ECOL, EREFCLK | Ethernet PHY interface | MII-compatible 10/100 Mbps physical layer signaling; supports RMII via pin multiplexing |
| CAN0TX, CAN0RX, CAN1TX, CAN1RX | CAN transceiver I/O | Differential bus signaling per ISO 11898-1; each channel supports 32 configurable mailboxes |
| SD0CMD, SD0CLK, SD0DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); includes card detection and write-protect sensing |
| QSPI_IO0–3, QSPI_CLK, QSPI_CS | Quad SPI interface | Direct connection to serial NOR/NAND flash; supports single/dual/quad I/O modes with programmable timing |
| GLCD_D0–23, GLCD_HSYNC, GLCD_VSYNC, GLCD_DE | Graphic LCD controller outputs | 24-bit RGB parallel interface supporting TFT panels up to WXGA; synchronized by H/V sync and data enable |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating runtime interruption |
| Integrated GLCDC + DRW2D | Offloads CPU from pixel rendering: supports 3-layer compositing, 2D vector drawing, bit-blitting with rotation/stretching, and CLUT-based color conversion |
| IEC60730-compliant safety suite | Includes oscillation-stop detection, CRC calculator (8/32-bit), self-diagnostic A/D, IWDT windowing, and register write protection for Class B certification |
| Flexible clock domain partitioning | Independent PCLKA (120 MHz for ETHERC/GLCDC/DRW2D) and PCLKB (60 MHz for timers/A/D) allow optimized power/performance trade-offs per subsystem |
| Event Link Controller (ELC) | Hardware interconnect routing 83 internal event signals (e.g., timer overflow → A/D trigger → DMA request) without CPU intervention, reducing latency and ISR overhead |
Applications
| Industrial HMI Gateway | Secure Edge Node |
|---|---|
Use Scenario: Local human-machine interface in factory automation panels with Ethernet backhaul, CAN-connected PLCs, and SD-card-based recipe storage. IC Role / Device Role / Timing Role: Central application processor managing GUI rendering (GLCDC+DRW2D), protocol bridging (Ethernet↔CAN), and secure firmware updates (AES+TM+Dual-Bank Flash). Use Value: Eliminates external graphics controller and crypto co-processor; dual-bank flash enables zero-downtime field updates verified via SHA-256 (offloaded to TSIP). | Use Scenario: Field-deployed energy meter with tamper detection, encrypted data logging, and remote configuration via Ethernet/WiFi gateway. IC Role / Device Role / Timing Role: Safety-certified controller executing IEC60730 diagnostics, sampling metrology ADCs, encrypting logs to SD card, and maintaining RTC across power cycles using VBATT. Use Value: On-chip CRCA, IWDT windowing, and MPU enforce runtime integrity; temperature sensor + A/D self-test validates analog path for Class B compliance. |
| Medical Device Controller | Building Automation Hub |
Use Scenario: Portable diagnostic device with LCD display, USB host for printer export, SD card for patient data, and CAN for sensor pod communication. IC Role / Device Role / Timing Role: Real-time controller synchronizing display refresh (GLCDC), USB bulk transfers (USBb), SDHI writes, and CAN message scheduling (32-mailbox FIFO). Use Value: Single-chip integration reduces BOM count and PCB area; DRW2D accelerates waveform overlays on medical displays without frame buffer bottlenecks. | Use Scenario: HVAC control panel with touch GUI, Ethernet management interface, CAN-connected thermostats, and local data logging to SD card. IC Role / Device Role / Timing Role: Deterministic real-time executor managing 12-bit A/D (temperature/humidity), PWM fan control (MTU3 complementary PWM), and secure web server (ETHERC + TLS offload via TSIP). Use Value: Hardware AES and TSIP accelerate TLS handshake; MTU3 dead-time compensation ensures reliable inverter control for variable-speed compressors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group; 144-pin LFQFP package (PLQP0144KA-B); 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDC | Suitable for cost-sensitive CAN/USB nodes without display or Ethernet requirements | Select when footprint, BOM cost, and Ethernet/graphic features are unnecessary |
| R5F566TEADFP#30 | RX66T Group; 144-pin LFQFP; 1.5 MB flash, 384 KB SRAM; enhanced MTU3 for motor control (3-phase PWM, encoder input), no Ethernet or SDHI | Optimized for servo drives and inverters requiring precise timing and high-resolution PWM | Prefer for motion control over HMI/communication-centric designs |
Compared with R5F56517FGLJ#20, the R5F5651EDFP#30 reduces package size and peripheral count for simpler nodes, while the R5F566TEADFP#30 trades Ethernet/graphics for deterministic motor control peripherals - neither offers pin compatibility, but both share toolchain and ecosystem alignment within Renesas' RX family.
Availability
R5F56517FGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply, long-term lifecycle assurance, and full traceability.
Supply support for R5F56517FGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT applications.
The RX65N Group - to which R5F56517FGLJ#20 belongs - was designed for industrial and networked embedded systems requiring rich connectivity (Ethernet/CAN/USB/SD), graphics capability, functional safety, and secure firmware execution.
FAQ
What is the maximum operating frequency and performance rating of the R5F56517FGLJ#20?
The R5F56517FGLJ#20 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS of processing performance. Its RXv2 CPU core includes a single-precision IEEE-754 floating-point unit, 32-bit multiplier (1-cycle execution), and divider (2-cycle execution), enabling deterministic real-time computation for industrial control and signal processing tasks. This performance is sustained across the full operating temperature range (–40°C to +105°C).
Does the R5F56517FGLJ#20 support secure firmware updates and cryptographic operations?
Yes, the R5F56517FGLJ#20 integrates hardware-accelerated AES-128/192/256 encryption, Trusted Secure IP (TSIP) for key management, and dual-bank code flash memory. These features enable authenticated, encrypted, and atomic firmware updates - where one bank runs the active image while the other is programmed and verified - meeting IEC60730 Class B requirements for safe field upgrades without runtime interruption.
What display and graphics capabilities does the R5F56517FGLJ#20 provide?
The R5F56517FGLJ#20 includes a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output up to WXGA resolution and a 2D Drawing Engine (DRW2D) capable of vector drawing (lines, triangles, circles), bit-blitting with rotation/stretching, and 3-layer plane compositing. These peripherals offload GUI rendering from the CPU, reduce external memory bandwidth, and enable responsive touch-based HMIs in resource-constrained industrial panels.
How many CAN interfaces does the R5F56517FGLJ#20 include, and what is their compliance level?
The R5F56517FGLJ#20 integrates two fully independent CAN 2.0B modules compliant with ISO 11898-1, each supporting standard and extended frames with 32 configurable mailboxes. Each channel provides dedicated TX/RX pins, error counters, and loopback/self-test modes. The CAN modules operate synchronously with PCLKB (up to 60 MHz) and support bit rates up to 1 Mbps, making them suitable for deterministic industrial networking and automotive subsystem communication.
What is the package type and thermal specification of the R5F56517FGLJ#20?
The R5F56517FGLJ#20 uses a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It is rated for industrial temperature operation from –40°C to +105°C (G-version), qualified per JEDEC J-STD-020 moisture sensitivity level (MSL) 3, and RoHS-compliant. Thermal design must account for 640 KB SRAM and Ethernet MAC activity under sustained 120 MHz operation.
R5F56517FGLJ#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-TFLGA
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56517FGLJ#20 FAQ
1.How can I place an order for R5F56517FGLJ#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56517FGLJ#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56517FGLJ#20 reliable?
The price and inventory of R5F56517FGLJ#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517FGLJ#20 is usually 5 days.
3.What payment methods are accepted for R5F56517FGLJ#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517FGLJ#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56517FGLJ#20?
R5F56517FGLJ#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56517FGLJ#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56517FGLJ#20?
For technical support, including R5F56517FGLJ#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517FGLJ#20 requirements.
6.How does Aetrix verify that R5F56517FGLJ#20 is sourced from the original manufacturer or authorized distributors?
All R5F56517FGLJ#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517FGLJ#20 meets industry standards.
7.What is the process for return or replacement of R5F56517FGLJ#20?
All R5F56517FGLJ#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517FGLJ#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56517FGLJ#20 part is unused and in its original packaging.
Return procedure for R5F56517FGLJ#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56517FGLJ#20 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

