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Renesas R5F56517FGLJ#20

Part No.:
R5F56517FGLJ#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-TFLGA
Datasheet:
AetrixR5F56517FGLJ#20.pdf
Description:
IC MCU 32BIT 768KB FLSH 100TFLGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:416

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Product details

Overview

R5F56517FGLJ#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.

For engineers reviewing the R5F56517FGLJ#20 datasheet, R5F56517FGLJ#20 pinout, R5F56517FGLJ#20 application, or R5F56517FGLJ#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for 2D GUI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.

Technical Context

The R5F56517FGLJ#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-MHz system clock (ICLK) and independent peripheral clocks (PCLKA up to 120 MHz for ETHERC/DRW2D/GLCDC; PCLKB up to 60 MHz for timers/A/D).

Its memory subsystem includes dual-bank flash supporting background programming and bank-swapping at reset, 32 KB data flash rated for 100,000 erase/write cycles, and 8 KB standby RAM backed by VBATT. Safety-critical functions are enabled via MPU (8 regions), Trusted Memory (TM) for code protection, and CRCA supporting configurable 8-/32-bit CRC polynomials.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz, IEEE-754 single-precision FPU
Memory1.5 MB code flash (dual-bank), 32 KB data flash (100k cycles), 640 KB SRAM (no wait states), 8 KB standby RAM
Operating FrequencyMax 120 MHz system clock (ICLK); PCLKA up to 120 MHz; PCLKB/PCLKC/PCLKD up to 60 MHz
PeripheralsEthernet MAC (10/100 Mbps), 2× CAN 2.0B (32 mailboxes/channel), SDHI/SDSI/MMCIF, QSPI, 3× RSPI, 13× SCI, 3× RIIC, GLCDC + DRW2D
AnalogTwo 12-bit A/D units (8 + 21 channels), 2× 12-bit D/A, on-die temperature sensor (±1°C)
Security & SafetyAES-128/192/256, TSIP, MPU (8 regions), CRCA, IWDT with window function, register write protection, IEC60730 support
PackageLFBGA-176 (PLQP0176KB-A), 24 × 24 mm, 0.5-mm pitch, –40°C to +105°C (G-version)

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/TerminalCircuit RoleDesign Meaning
VCC, AVCC0, AVCC1Power supply inputsCore/analog power domains (2.7–3.6 V); AVCC0/AVCC1 independently decoupled for noise-sensitive ADC/DAC
VBATTBattery backup supplyEnables RTC operation during main power loss; supports deep software standby retention
RES#, MODE0–MODE2Reset and boot configurationHardware reset assertion; boot mode selection (SCI/USB/FINE) at power-up
ETXD0–7, ERXD0–7, ETXEN, ERXDV, ECRS, ECOL, EREFCLKEthernet PHY interfaceMII-compatible 10/100 Mbps physical layer signaling; supports RMII via pin multiplexing
CAN0TX, CAN0RX, CAN1TX, CAN1RXCAN transceiver I/ODifferential bus signaling per ISO 11898-1; each channel supports 32 configurable mailboxes
SD0CMD, SD0CLK, SD0DAT0–3SD host interface signals4-bit SD bus supporting high-speed mode (25 MB/s); includes card detection and write-protect sensing
QSPI_IO0–3, QSPI_CLK, QSPI_CSQuad SPI interfaceDirect connection to serial NOR/NAND flash; supports single/dual/quad I/O modes with programmable timing
GLCD_D0–23, GLCD_HSYNC, GLCD_VSYNC, GLCD_DEGraphic LCD controller outputs24-bit RGB parallel interface supporting TFT panels up to WXGA; synchronized by H/V sync and data enable

Key Features

FeatureDesign Value
Dual-bank flash architectureEnables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating runtime interruption
Integrated GLCDC + DRW2DOffloads CPU from pixel rendering: supports 3-layer compositing, 2D vector drawing, bit-blitting with rotation/stretching, and CLUT-based color conversion
IEC60730-compliant safety suiteIncludes oscillation-stop detection, CRC calculator (8/32-bit), self-diagnostic A/D, IWDT windowing, and register write protection for Class B certification
Flexible clock domain partitioningIndependent PCLKA (120 MHz for ETHERC/GLCDC/DRW2D) and PCLKB (60 MHz for timers/A/D) allow optimized power/performance trade-offs per subsystem
Event Link Controller (ELC)Hardware interconnect routing 83 internal event signals (e.g., timer overflow → A/D trigger → DMA request) without CPU intervention, reducing latency and ISR overhead

Applications

Industrial HMI GatewaySecure Edge Node

Use Scenario: Local human-machine interface in factory automation panels with Ethernet backhaul, CAN-connected PLCs, and SD-card-based recipe storage.

IC Role / Device Role / Timing Role: Central application processor managing GUI rendering (GLCDC+DRW2D), protocol bridging (Ethernet↔CAN), and secure firmware updates (AES+TM+Dual-Bank Flash).

Use Value: Eliminates external graphics controller and crypto co-processor; dual-bank flash enables zero-downtime field updates verified via SHA-256 (offloaded to TSIP).

Use Scenario: Field-deployed energy meter with tamper detection, encrypted data logging, and remote configuration via Ethernet/WiFi gateway.

IC Role / Device Role / Timing Role: Safety-certified controller executing IEC60730 diagnostics, sampling metrology ADCs, encrypting logs to SD card, and maintaining RTC across power cycles using VBATT.

Use Value: On-chip CRCA, IWDT windowing, and MPU enforce runtime integrity; temperature sensor + A/D self-test validates analog path for Class B compliance.

Medical Device ControllerBuilding Automation Hub

Use Scenario: Portable diagnostic device with LCD display, USB host for printer export, SD card for patient data, and CAN for sensor pod communication.

IC Role / Device Role / Timing Role: Real-time controller synchronizing display refresh (GLCDC), USB bulk transfers (USBb), SDHI writes, and CAN message scheduling (32-mailbox FIFO).

Use Value: Single-chip integration reduces BOM count and PCB area; DRW2D accelerates waveform overlays on medical displays without frame buffer bottlenecks.

Use Scenario: HVAC control panel with touch GUI, Ethernet management interface, CAN-connected thermostats, and local data logging to SD card.

IC Role / Device Role / Timing Role: Deterministic real-time executor managing 12-bit A/D (temperature/humidity), PWM fan control (MTU3 complementary PWM), and secure web server (ETHERC + TLS offload via TSIP).

Use Value: Hardware AES and TSIP accelerate TLS handshake; MTU3 dead-time compensation ensures reliable inverter control for variable-speed compressors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EDFP#30Same RX65N Group; 144-pin LFQFP package (PLQP0144KA-B); 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDCSuitable for cost-sensitive CAN/USB nodes without display or Ethernet requirementsSelect when footprint, BOM cost, and Ethernet/graphic features are unnecessary
R5F566TEADFP#30RX66T Group; 144-pin LFQFP; 1.5 MB flash, 384 KB SRAM; enhanced MTU3 for motor control (3-phase PWM, encoder input), no Ethernet or SDHIOptimized for servo drives and inverters requiring precise timing and high-resolution PWMPrefer for motion control over HMI/communication-centric designs

Compared with R5F56517FGLJ#20, the R5F5651EDFP#30 reduces package size and peripheral count for simpler nodes, while the R5F566TEADFP#30 trades Ethernet/graphics for deterministic motor control peripherals - neither offers pin compatibility, but both share toolchain and ecosystem alignment within Renesas' RX family.

Availability

R5F56517FGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for R5F56517FGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT applications.

The RX65N Group - to which R5F56517FGLJ#20 belongs - was designed for industrial and networked embedded systems requiring rich connectivity (Ethernet/CAN/USB/SD), graphics capability, functional safety, and secure firmware execution.

FAQ

What is the maximum operating frequency and performance rating of the R5F56517FGLJ#20?

The R5F56517FGLJ#20 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS of processing performance. Its RXv2 CPU core includes a single-precision IEEE-754 floating-point unit, 32-bit multiplier (1-cycle execution), and divider (2-cycle execution), enabling deterministic real-time computation for industrial control and signal processing tasks. This performance is sustained across the full operating temperature range (–40°C to +105°C).

Does the R5F56517FGLJ#20 support secure firmware updates and cryptographic operations?

Yes, the R5F56517FGLJ#20 integrates hardware-accelerated AES-128/192/256 encryption, Trusted Secure IP (TSIP) for key management, and dual-bank code flash memory. These features enable authenticated, encrypted, and atomic firmware updates - where one bank runs the active image while the other is programmed and verified - meeting IEC60730 Class B requirements for safe field upgrades without runtime interruption.

What display and graphics capabilities does the R5F56517FGLJ#20 provide?

The R5F56517FGLJ#20 includes a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output up to WXGA resolution and a 2D Drawing Engine (DRW2D) capable of vector drawing (lines, triangles, circles), bit-blitting with rotation/stretching, and 3-layer plane compositing. These peripherals offload GUI rendering from the CPU, reduce external memory bandwidth, and enable responsive touch-based HMIs in resource-constrained industrial panels.

How many CAN interfaces does the R5F56517FGLJ#20 include, and what is their compliance level?

The R5F56517FGLJ#20 integrates two fully independent CAN 2.0B modules compliant with ISO 11898-1, each supporting standard and extended frames with 32 configurable mailboxes. Each channel provides dedicated TX/RX pins, error counters, and loopback/self-test modes. The CAN modules operate synchronously with PCLKB (up to 60 MHz) and support bit rates up to 1 Mbps, making them suitable for deterministic industrial networking and automotive subsystem communication.

What is the package type and thermal specification of the R5F56517FGLJ#20?

The R5F56517FGLJ#20 uses a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It is rated for industrial temperature operation from –40°C to +105°C (G-version), qualified per JEDEC J-STD-020 moisture sensitivity level (MSL) 3, and RoHS-compliant. Thermal design must account for 640 KB SRAM and Ethernet MAC activity under sustained 120 MHz operation.

R5F56517FGLJ#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-TFLGA
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56517FGLJ#20 FAQ

1.How can I place an order for R5F56517FGLJ#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56517FGLJ#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56517FGLJ#20 reliable?

The price and inventory of R5F56517FGLJ#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56517FGLJ#20 is usually 5 days.

3.What payment methods are accepted for R5F56517FGLJ#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56517FGLJ#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56517FGLJ#20?

R5F56517FGLJ#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56517FGLJ#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56517FGLJ#20?

For technical support, including R5F56517FGLJ#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56517FGLJ#20 requirements.

6.How does Aetrix verify that R5F56517FGLJ#20 is sourced from the original manufacturer or authorized distributors?

All R5F56517FGLJ#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56517FGLJ#20 meets industry standards.

7.What is the process for return or replacement of R5F56517FGLJ#20?

All R5F56517FGLJ#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56517FGLJ#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56517FGLJ#20 part is unused and in its original packaging.

Return procedure for R5F56517FGLJ#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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