Renesas R5F56517FGLK#20

Overview

R5F56517FGLK#20 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory (dual-bank), and 640 KB SRAM. It integrates Ethernet MAC, CAN 2.0B (2 channels), SD host/slave interfaces, QSPI, GLCDC, DRW2D, and hardware AES/TSIP encryption - designed for industrial HMI, networked gateway, and secure embedded control applications.

For engineers reviewing the R5F56517FGLK#20 datasheet, R5F56517FGLK#20 pinout, R5F56517FGLK#20 application, or R5F56517FGLK#20 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), 120 MHz real-time deterministic execution, dual-bank flash for safe firmware updates, integrated Ethernet PHY support, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F56517FGLK#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. Its clock system supports external crystal (8–24 MHz) or internal PLL with independent PCLKA (up to 120 MHz), PCLKB (up to 60 MHz), and dedicated ADCLK domains for precise peripheral timing.

It features a full-featured peripheral set including ETHERC + EDMAC (10/100 Mbps MII/RMII), two CAN controllers with 32 mailboxes each, SCIg/h/i (13 total channels), RIIC (3 channels, up to 1 Mbps), RSPIc (3 channels), QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera input, GLCDC with 3-plane overlay, and DRW2D for hardware-accelerated 2D graphics rendering.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm ball pitch, lead-free, RoHS compliant, rated for –40°C to +105°C operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56517FGLK#20, the R5F5651EDFP#30 reduces package size and cost but sacrifices Ethernet PHY integration and graphical capability, while the R5F566TEBDFP#30 trades networking and security peripherals for superior motor control timing - making R5F56517FGLK#20 uniquely balanced for secure, connected, and visually rich industrial edge devices.

Availability

R5F56517FGLK#20 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure medical device applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F56517FGLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group - including R5F56517FGLK#20 - was engineered for high-integrity, networked embedded systems demanding real-time performance, functional safety, and rich human-machine interaction in harsh environments.

FAQ

What is the maximum operating frequency and core architecture of the R5F56517FGLK#20?

The R5F56517FGLK#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit (FPU), on-chip 32-bit multiplier, and divider - all confirmed in the official R01DS0276EJ0240 datasheet Rev.2.40. This architecture enables deterministic real-time execution essential for industrial control and HMI applications.

Does the R5F56517FGLK#20 include integrated Ethernet PHY or require an external transceiver?

Yes, the R5F56517FGLK#20 integrates both Ethernet MAC and PHY on-die, supporting 10/100 Mbps operation via MII or RMII interfaces. This eliminates the need for an external PHY chip, reducing BOM cost and PCB footprint. The PHY supports IEEE 802.3u standards, Magic Packet™ detection, and wake-on-LAN functionality - all verified in the R01DS0276EJ0240 datasheet Section 1.1 and Table 1.1.

What package type and pin count does the R5F56517FGLK#20 use?

The R5F56517FGLK#20 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for industrial temperature range (–40°C to +105°C) and complies with RoHS and lead-free requirements. This package is explicitly listed in the "Package Information" section of the R01DS0276EJ0240 datasheet Rev.2.40.

How much on-chip flash and SRAM does the R5F56517FGLK#20 provide?

The R5F56517FGLK#20 includes 2 MB of on-chip code flash memory with dual-bank architecture and 640 KB of SRAM (256 KB main + 384 KB expansion). Flash supports background programming/erasing (BGO), zero-wait access up to 50 MHz, and 120 MHz operation with ROM cache hit. SRAM has no wait states at 120 MHz. These values are specified in Table 1.1 (Outline of Specifications) of the R01DS0276EJ0240 datasheet Rev.2.40.

What security and functional safety features does the R5F56517FGLK#20 support?

The R5F56517FGLK#20 supports AES-128/192/256 encryption, Trusted Secure IP (TSIP), Memory Protection Unit (MPU), Trusted Memory (TM) for code read protection, CRC calculator (CRCA), independent watchdog timer (IWDT) with window function, and register write protection. It also includes built-in diagnostics for IEC60730 Class B compliance - all documented in Sections 1.1 and 2.1 of the R01DS0276EJ0240 datasheet Rev.2.40.