Renesas R5F56519ADFB#10
- Part No.:
- R5F56519ADFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56519ADFB#10.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:397
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Product details
Overview
R5F56519ADFB#10 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption - deployed in industrial HMI gateways requiring real-time connectivity, secure firmware updates, and local graphics rendering.
For engineers reviewing the R5F56519ADFB#10 datasheet, R5F56519ADFB#10 pinout, R5F56519ADFB#10 application, or R5F56519ADFB#10 equivalent, key selection criteria include its 176-pin LFBGA package with 136 general-purpose I/Os (19 pins 5-V tolerant), dual-bank flash for safe OTA updates, integrated GLCDC + DRW2D for embedded GUI acceleration, and IEC60730-compliant safety features including CRC calculator, IWDT with window function, and register write protection.
Technical Context
The R5F56519ADFB#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a dedicated 120-kHz IWDT clock source and supports endian-selectable data arrangement (little or big) while maintaining little-endian instruction encoding.
Its memory subsystem includes dual-bank flash supporting background programming and bank-swapping during execution, 32 KB data flash rated for 100,000 erase/write cycles, and 8 KB standby RAM backed by VBATT. Peripheral clocks are independently configurable: PCLKA (up to 120 MHz) for ETHERC/EDMAC/GLCDC/DRW2D, PCLKB (up to 60 MHz) for most timers and communication modules, and separate ADCLK domains for two independent 12-bit A/D units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Flash Memory | 1.5 MB code flash with dual-bank structure enabling live firmware updates without halting execution |
| SRAM | 640 KB main SRAM (256 KB + 384 KB expansion) with zero-wait access at 120 MHz |
| FPU | Single-precision IEEE-754 compliant unit supporting 32-bit floating-point arithmetic |
| Communication | Ethernet MAC (10/100 Mbps), 2× CAN (ISO 11898-1), 3× RSPI, 3× I²C (1 Mbps max), QSPI, SDHI/SDSI, USB 2.0 FS host/function |
| Analog Peripherals | Two 12-bit A/D converters (8 + 21 channels), 2× 12-bit D/A outputs, on-die temperature sensor (±1°C) |
| Security | AES engine (128/192/256-bit keys), Trusted Secure IP (TSIP), MPU with 8 regions, CRC calculator (8-/32-bit polynomials) |
Pinout & Package
Package: PLQP0176KB-A, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, –40°C to +85°C operating range (D-version).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate analog/digital domains enable noise isolation; AVCC1 powers A/D and D/A circuits |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; connects to coin-cell or supercapacitor |
| RES# | Active-low reset input | Asynchronous hardware reset; internal pull-up ensures reliable startup without external components |
| EXTAL / XTAL | External crystal oscillator terminals | Supports 8–24 MHz crystals for precise system timing and Ethernet PHY synchronization |
| MD0 / MD1 | Mode setting pins | Determine boot source (SCI/USB/FINE) and operating mode at power-on reset |
| ETXD0–ETXD3 / ERXD0–ERXD3 | Ethernet PHY interface | Direct MII/RMII connection to external PHY; supports 10/100 Mbps full/half-duplex operation |
| TXD0 / RXD0 | SCI0 serial interface | Asynchronous UART channel used for debug console, bootloader communication, or host interface |
Key Features
| Feature | Design Value |
|---|---|
| IEC60730 Safety Support | Oscillation-stop detection, CRC calculator, IWDT windowing, self-diagnostic A/D, register write protection |
| Graphics Acceleration | Integrated GLCDC driving up to WXGA panels + DRW2D hardware engine for vector drawing and bit-blitting |
| Secure Boot & Updates | Trusted Memory (TM) prevents code readout from flash; dual-bank flash enables atomic firmware swaps |
| Real-Time Determinism | Event Link Controller (ELC) enables hardware-triggered peripheral chaining (e.g., timer → A/D → DMA) without CPU intervention |
| Low-Power Operation | Four low-power modes including deep software standby with 8 KB RAM retention and RTC battery backup |
Applications
| Industrial HMI Gateway | Secure Edge Node |
|---|---|
Use Scenario: Local human-machine interface with Ethernet backhaul, SD card logging, and CAN bus field device integration in factory automation. IC Role / Device Role / Timing Role: Central controller executing real-time UI rendering via GLCDC/DRW2D, managing dual CAN networks, and synchronizing time-critical events using ELC-linked MTU3 timers. Use Value: Eliminates external graphics processor and FPGA logic; reduces BOM cost by integrating Ethernet MAC, SDHI, and crypto acceleration. | Use Scenario: Field-deployed IoT node performing encrypted sensor aggregation, over-the-air firmware validation, and watchdog-monitored control output. IC Role / Device Role / Timing Role: Root-of-trust anchor running secure boot, AES-encrypted data packaging, and IEC60730-compliant diagnostics with IWDT windowing and CRC integrity checks. Use Value: Meets SIL-2 functional safety requirements without external safety monitor; enables certified remote firmware updates. |
| Medical Device Controller | Building Automation Hub |
Use Scenario: Patient monitor with LCD display, USB host for printer/storage, and isolated CAN for bedside equipment interconnect. IC Role / Device Role / Timing Role: Real-time data acquisition hub interfacing 12-bit A/D sensors, driving graphic LCD via GLCDC, and handling USB mass storage class transfers. Use Value: Single-chip solution replaces multi-IC design; 640 KB SRAM buffers high-resolution waveform data before compression/transmission. | Use Scenario: HVAC control panel with touch interface, Ethernet management, and legacy BACnet MS/TP over RS-485 via SCI UART. IC Role / Device Role / Timing Role: Protocol gateway translating Modbus TCP to serial fieldbus, using SCIg in smart-card or clock-synchronous mode with ELC-triggered DMA transfers. Use Value: Reduces latency in protocol translation; eliminates external level shifters via 5-V tolerant I/O pins on selected channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EHDFB#10 | Same RX65N Group, identical 176-pin LFBGA package, but with 2 MB flash and 640 KB SRAM - no difference in peripheral set or clocking | Preferred where larger firmware image size or future feature expansion is required; same pinout and thermal profile | Select when >1.5 MB flash is needed for bootloader + application + secure storage partitioning |
| R5F566TEADFP#30 | RX66T Group part in 144-pin LQFP; higher 160 MHz CPU speed, enhanced MTU3 for motor control, but lacks Ethernet MAC and GLCDC | Targeted at real-time motor drives rather than networked HMI; no graphics or Ethernet capability | Choose only for servo/inverter control where Ethernet and GUI are unnecessary and deterministic PWM timing is critical |
Compared with R5F56519ADFB#10, the R5F5651EHDFB#10 offers direct scalability in flash capacity without layout or firmware changes, while the R5F566TEADFP#30 trades networking and graphics for higher motor-control precision - making R5F56519ADFB#10 uniquely balanced for connected, display-rich industrial edge devices.
Availability
R5F56519ADFB#10 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge nodes, medical device controllers, and building automation hubs requiring stable component supply across extended product lifecycles.
Supply support for R5F56519ADFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RX65N Group - including R5F56519ADFB#10 - was designed specifically for industrial and medical applications demanding functional safety (IEC60730), rich human interface capabilities, and secure network connectivity in a single-chip solution.
FAQ
What is the maximum operating frequency and performance rating of the R5F56519ADFB#10?
The R5F56519ADFB#10 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance. Its RXv2 CPU core supports single-cycle 32-bit multiplication and two-cycle division, along with a single-precision IEEE-754 floating-point unit. This performance level is sustained across the full operating voltage range (2.7–3.6 V) and temperature range (–40°C to +85°C), making R5F56519ADFB#10 suitable for deterministic real-time control tasks in industrial environments.
Does the R5F56519ADFB#10 support secure firmware updates and cryptographic operations?
Yes, the R5F56519ADFB#10 includes hardware-accelerated AES encryption supporting 128-, 192-, and 256-bit keys, plus Trusted Secure IP (TSIP) for key management and secure boot. Its dual-bank flash architecture allows background programming and atomic bank switching - essential for fail-safe over-the-air updates. The R5F56519ADFB#10 also implements register write protection and CRC calculation (8-/32-bit) to ensure runtime integrity, fulfilling IEC60730 Class B requirements without external components.
What display and graphics capabilities does the R5F56519ADFB#10 provide?
The R5F56519ADFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting resolutions up to WXGA (1280×800) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit-blitting, rotation, and scaling. It supports multiple pixel formats (32/16/8 bpp) and CLUT-based color lookup tables. These peripherals eliminate the need for external GPU or frame buffer memory, enabling responsive GUIs directly from the R5F56519ADFB#10's 640 KB SRAM - ideal for industrial HMIs and medical displays.
Which communication interfaces are integrated into the R5F56519ADFB#10?
The R5F56519ADFB#10 integrates Ethernet MAC (10/100 Mbps MII/RMII), two CAN 2.0B channels (32 mailboxes each), three RSPI, three I²C (1 Mbps max), quad SPI, SD host/slave interfaces, USB 2.0 FS host/function, and up to 13 SCI channels with flexible mode support (UART, SPI, I²C, smart card). This comprehensive suite enables R5F56519ADFB#10 to serve as a protocol gateway connecting field buses (CAN, RS-485 via SCI), storage (SD), and enterprise networks (Ethernet/USB) in a single chip.
What is the package type and pin count of the R5F56519ADFB#10?
The R5F56519ADFB#10 uses the PLQP0176KB-A package: a 176-pin Low-Profile Quad Flat No-Lead (LFBGA) with 24 × 24 mm body size and 0.5-mm pitch. It provides 136 general-purpose I/O pins (19 of which are 5-V tolerant), supporting industrial-level noise immunity and mixed-voltage interfacing. This package is RoHS-compliant and rated for operation from –40°C to +85°C, matching the R5F56519ADFB#10's D-version specification.
R5F56519ADFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56519ADFB#10 FAQ
1.How can I place an order for R5F56519ADFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56519ADFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56519ADFB#10 reliable?
The price and inventory of R5F56519ADFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519ADFB#10 is usually 5 days.
3.What payment methods are accepted for R5F56519ADFB#10?
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R5F56519ADFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56519ADFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56519ADFB#10?
For technical support, including R5F56519ADFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519ADFB#10 requirements.
6.How does Aetrix verify that R5F56519ADFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F56519ADFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519ADFB#10 meets industry standards.
7.What is the process for return or replacement of R5F56519ADFB#10?
All R5F56519ADFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519ADFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56519ADFB#10 part is unused and in its original packaging.
Return procedure for R5F56519ADFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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