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Renesas R5F56519AGFB#10
- Part No.:
- R5F56519AGFB#10
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F56519AGFB#10.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,751
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Product details
Overview
R5F56519AGFB#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash, 640 KB SRAM, and hardware AES encryption. It integrates Ethernet MAC, dual CAN, SD host/slave, QSPI, GLCDC, DRW2D, and 12-bit A/D + D/A converters - targeting industrial HMI, networked gateway, and secure embedded control applications.
For engineers reviewing the R5F56519AGFB#10 datasheet, R5F56519AGFB#10 pinout, R5F56519AGFB#10 application, or R5F56519AGFB#10 equivalent, key selection criteria include its 176-pin LFBGA (PLQP0176KB-A) package, dual-bank flash for safe firmware updates, 120 MHz real-time execution with zero-wait access at ≤50 MHz, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.
Technical Context
The R5F56519AGFB#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. Its memory subsystem includes dual-bank 2 MB flash supporting background programming and bank-swapping, plus 640 KB SRAM with no wait states at 120 MHz - partitioned into 256 KB main RAM and 384 KB expansion RAM.
Peripherals are clocked across multiple domains: PCLKA (up to 120 MHz) drives ETHERC, EDMAC, AES, GLCDC, and DRW2D; PCLKB (up to 60 MHz) serves TPU, MTU3, SCI, and S12AD unit 0; PCLKC/D (up to 60 MHz) drive S12AD units 0/1 respectively. The ELC enables deterministic event chaining without CPU intervention between timers, ADCs, and I/O pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock; flash zero-wait access ≤50 MHz, 1-wait ≤100 MHz |
| Memory | 2 MB dual-bank code flash, 640 KB SRAM (256 KB + 384 KB), 32 KB data flash |
| Analog Peripherals | Two 12-bit A/D units (8 + 21 channels), two 12-bit D/A channels, on-die temperature sensor |
| Connectivity | Ethernet MAC + RMII/MII, 2× CAN (ISO11898-1), 3× RSPI, 1× QSPI, 3× I²C, 13× SCI, SDHI/SDSI/MMCIF |
| Security & Safety | AES-128/192/256, TSIP, MPU (8 regions), Trusted Memory, CRC calculator, IWDT with window function |
| Package | PLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, –40°C to +105°C (G-version) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS compliant, rated for –40°C to +105°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1) - each require local decoupling; AVCC1 powers S12AD unit 1 and R12DA |
| VBATT | Battery backup supply | Provides power to RTC during main VCC dropout; enables calendar/clock retention in deep software standby |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; required for high-accuracy timing and Ethernet PHY clock derivation |
| MD0 / MD1 | Mode setting pins | Determine boot mode (SCI/USB/FINE) and single-chip vs. extended mode at reset release |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Required for PHY configuration via SMI; supports auto-negotiation and link status monitoring |
| RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLK | Reduced Media Independent Interface | Direct connection to RMII-compliant PHY; REF_CLK must be 50 MHz ±50 ppm for 100 Mbps operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating runtime interruption |
| Integrated GLCDC + DRW2D | Hardware-accelerated 2D graphics rendering and LCD panel control - supports 3-layer composition, 32 bpp, and rotation without CPU load |
| IEC60730 Class B support | Includes oscillation-stop detection, CRC calculator, IWDT with windowing, self-diagnostic A/D, and register write protection for functional safety compliance |
| Event Link Controller (ELC) | Hardwired peripheral interconnection: e.g., MTU3 output triggers A/D conversion or GPIO toggle without ISR latency or CPU cycles |
| SDHI/SDSI + MMCIF triple interface | Single-chip support for SD memory cards, SDIO peripherals (Wi-Fi/BT modules), and eMMC storage - all with DMA and CRC-16 error checking |
Applications
| Industrial HMI Panel | Secure Gateway Controller |
|---|---|
Use Scenario: Standalone touch-based operator interface for PLC-controlled machinery with local data logging and remote diagnostics. IC Role / Device Role / Timing Role: Primary application processor running RTOS, driving 480×272 TFT via GLCDC, handling USB/SD card data export, and executing AES-encrypted firmware updates. Use Value: Integrated DRW2D accelerates UI rendering; dual-bank flash ensures fail-safe OTA updates; 120 MHz real-time response meets deterministic motion control timing requirements. | Use Scenario: Edge node aggregating Modbus RTU, CAN bus, and sensor data, then forwarding via Ethernet or cellular to cloud platform. IC Role / Device Role / Timing Role: Protocol translation hub with concurrent Ethernet MAC, dual CAN, and multiple SCI ports - managing time-synchronized packet routing and TLS offload via TSIP. Use Value: Hardware CRC and IWDT satisfy IEC60730 Class B; RMII interface enables low-latency 100 Mbps uplink; 640 KB SRAM buffers multi-protocol traffic without external memory. |
| Networked Building Controller | Medical Data Logger |
Use Scenario: HVAC and lighting controller with BACnet/IP, LonWorks, and KNX interfaces deployed in commercial buildings. IC Role / Device Role / Timing Role: Real-time network stack host with Ethernet MAC, dual CAN for fieldbus bridging, and SDHI for local event log storage. Use Value: PCLKA-synchronized ETHERC and EDMAC sustain full 100 Mbps throughput; 2 MB flash stores multiple protocol stacks and configuration profiles; RTC with battery backup maintains audit trail timestamps. | Use Scenario: Portable patient monitor recording ECG, SpO₂, and temperature, storing encrypted waveform data to microSD card. IC Role / Device Role / Timing Role: Mixed-signal acquisition controller using S12AD (21-channel unit 1) for analog front-end digitization, R12DA for calibration reference, and TSIP for HIPAA-compliant data encryption. Use Value: On-die temperature sensor calibrates A/D offset drift; 12-bit resolution and 0.48 µs/channel conversion meet AAMI EC13 requirements; SDHI DMA enables gapless 1 kHz waveform capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFBL#10 | Same RX65N Group, 144-pin LQFP (PLQP0144KA-B), 1 MB flash, 256 KB SRAM, no Ethernet MAC | Lacks Ethernet and GLCDC/DRW2D; suited for cost-sensitive CAN/SCI-only controllers without display | Select when Ethernet, graphics, or >1 MB flash are unnecessary and LQFP assembly is preferred. |
| R5F566TEADFP#30 | RX66T Group, 100-pin LQFP, 120 MHz, 1 MB flash, 192 KB SRAM, enhanced PWM (3-phase inverter control), no Ethernet or SD | Optimized for motor control with MTU3 complementary PWM and dead-time compensation; no networking peripherals | Choose for servo/inverter applications requiring precise 3-phase gate driving - not for networked HMI or data logging. |
Compared with R5F56519AGFB#10, the R5F5651EDFBL#10 reduces footprint and cost but removes Ethernet and graphics acceleration, while the R5F566TEADFP#30 trades networking for superior motor control timing and PWM precision - making R5F56519AGFB#10 uniquely balanced for secure, connected, display-enabled industrial edge devices.
Availability
R5F56519AGFB#10 is available at Aetrix Electronics and suitable for industrial HMI, secure gateway, building automation, and medical data logging applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature resilience.
Supply support for R5F56519AGFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The RX65N Group - including R5F56519AGFB#10 - was designed for high-integrity, network-connected embedded systems requiring real-time performance, functional safety certification (IEC60730), and rich human-machine interface capabilities.
FAQ
What is the maximum operating frequency and flash access performance of the R5F56519AGFB#10?
The R5F56519AGFB#10 operates at a maximum system clock frequency of 120 MHz. Its 2 MB on-chip code flash delivers zero-wait-state access at frequencies ≤50 MHz, one-wait-state access up to 100 MHz, and two-wait-state access above 100 MHz. When ROM cache hits occur, instruction fetch remains zero-wait even at 120 MHz - critical for deterministic real-time execution in the R5F56519AGFB#10.
Does the R5F56519AGFB#10 support IEC60730 Class B functional safety certification?
Yes, the R5F56519AGFB#10 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (CRCA) with configurable polynomials, independent watchdog timer (IWDTa) with windowing, self-diagnostic A/D converter, and register write protection. These are documented in the R01DS0276EJ0240 datasheet and enable certified safety routines without external components - a core design objective of the R5F56519AGFB#10.
What display and graphics capabilities does the R5F56519AGFB#10 provide?
The R5F56519AGFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting up to 3 composited layers (background, graphic 1, graphic 2) and a 2D Drawing Engine (DRW2D) with vector drawing, bit blitting, rotation, and texture mapping. It handles 32/16 bpp pixel formats and CLUT-based palettes - enabling responsive, low-CPU-load GUIs on TFT panels up to WVGA resolution directly from the R5F56519AGFB#10's internal memory subsystem.
Can the R5F56519AGFB#10 execute firmware updates without interrupting real-time operation?
Yes, the R5F56519AGFB#10's dual-bank flash architecture allows background programming: while one bank executes application code, the other bank can be erased and reprogrammed via on-chip programming. Bank swapping occurs atomically at reset, ensuring zero downtime during firmware updates - a guaranteed capability of the R5F56519AGFB#10 per its hardware design and supported by Renesas' FDL library.
What are the key differences between the R5F56519AGFB#10 and the R5F5651EDFBL#10?
The R5F56519AGFB#10 uses a 176-pin LFBGA (PLQP0176KB-A) package with 2 MB flash, 640 KB SRAM, Ethernet MAC, GLCDC, and DRW2D. The R5F5651EDFBL#10 is a 144-pin LQFP variant with 1 MB flash, 256 KB SRAM, and no Ethernet or graphics peripherals. Both belong to the RX65N Group and share the same RXv2 core and safety features, but the R5F56519AGFB#10 targets higher-integration, display-enabled applications where the R5F5651EDFBL#10 serves cost-optimized, communication-only use cases.
R5F56519AGFB#10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56519AGFB#10 FAQ
1.How can I place an order for R5F56519AGFB#10 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56519AGFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56519AGFB#10 reliable?
The price and inventory of R5F56519AGFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519AGFB#10 is usually 5 days.
3.What payment methods are accepted for R5F56519AGFB#10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56519AGFB#10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56519AGFB#10?
R5F56519AGFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56519AGFB#10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56519AGFB#10?
For technical support, including R5F56519AGFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519AGFB#10 requirements.
6.How does Aetrix verify that R5F56519AGFB#10 is sourced from the original manufacturer or authorized distributors?
All R5F56519AGFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519AGFB#10 meets industry standards.
7.What is the process for return or replacement of R5F56519AGFB#10?
All R5F56519AGFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519AGFB#10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56519AGFB#10 part is unused and in its original packaging.
Return procedure for R5F56519AGFB#10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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