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Renesas R5F56519AGFP#30
- Part No.:
- R5F56519AGFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F56519AGFP#30.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:270
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Product details
Overview
R5F56519AGFP#30 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 1.5 MB on-chip code flash, 640 KB SRAM (no wait states), single-precision IEEE-754 FPU, dual-bank flash for background programming, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI applications.
For engineers reviewing the R5F56519AGFP#30 datasheet, R5F56519AGFP#30 pinout, R5F56519AGFP#30 application, or R5F56519AGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C G-grade operation, 12-bit dual A/D converter (21-channel unit), 2-channel 12-bit D/A, TSIP encryption, and IEC60730 safety support including CRC, IWDT, and self-diagnostic A/D functions.
Technical Context
The R5F56519AGFP#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU/flash access, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, AES, GLCDC), and PCLKB up to 60 MHz for timers, ADC, and communication interfaces.
Its peripheral subsystem includes a 2-channel CAN controller compliant with ISO11898-1 (32 mailboxes/channel), 13 SCI channels supporting asynchronous, SPI/I²C emulation, and LIN, plus dedicated hardware accelerators - DRW2D for 2D graphics rendering and PDC for CMOS camera interface - all coordinated via the Event Link Controller (ELC) to minimize CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU |
| Memory | 1.5 MB code flash (dual-bank), 640 KB SRAM (no wait states), 32 KB data flash (100k erase cycles) |
| Package | PLQP0176KB-A: 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, G-grade (–40°C to +105°C) |
| Analog | Dual 12-bit S12AD: Unit 0 (8 ch), Unit 1 (21 ch); 2-channel R12DA; on-die temperature sensor (±1°C) |
| Connectivity | Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN, 13× SCI, 3× RSPI, 1× QSPI, 3× I²C, SDHI/SDSI, MMCIF |
| Graphics & Imaging | GLCDC (3-plane overlay), DRW2D (vector/bit-blit), PDC (CMOS camera interface) |
| Security & Safety | TSIP encryption engine (AES-128/192/256), MPU, Trusted Memory (TM), CRCA, IWDT, A/D self-diagnostic |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Core/analog power domains (2.7–3.6 V); separate AVCC pins enable noise-isolated analog operation |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; supports long-term timekeeping without system reset |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external crystal for precise clock generation; enables oscillation-stop detection per IEC60730 |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Configures PHY registers over MDIO bus; required for Ethernet initialization and link status monitoring |
| TXD0 / RXD0 | SCI0 asynchronous serial I/O | Primary debug/communication channel; supports bootloader mode and firmware updates via UART |
| PE0–PE15 | General-purpose I/O port E | 16-bit parallel interface usable for GLCDC data bus, SD bus control, or event-linked timer outputs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates: execute from Bank A while reprogramming Bank B, eliminating downtime |
| Event Link Controller (ELC) | Hardware interconnect between 83 internal events (e.g., timer overflow → A/D trigger → DMA transfer) without CPU overhead |
| Trusted Secure IP (TSIP) | On-die cryptographic accelerator supporting AES-128/192/256 with key wrapping and secure boot verification |
| IEC60730 Class B compliance support | Integrated features include oscillation-stop detection, CRC calculator (CRCA), IWDT windowing, and A/D self-test |
| Graphics subsystem | GLCDC + DRW2D co-processing enables real-time GUI rendering on 800×480 displays with <1% CPU load |
Applications
| Industrial HMI Panel | Smart Energy Gateway |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time alarm display and historical trend logging. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving TFT-LCD via GLCDC, managing touch input via SCI/USB, and communicating with PLC over CAN/Ethernet. Use Value: Integrated DRW2D reduces external GPU requirement; dual-bank flash enables field-upgradable UI firmware without halting machine operation. | Use Scenario: DIN-rail mounted gateway aggregating data from smart meters (via RS485/SCI), solar inverters (CAN), and grid sensors (Ethernet), then forwarding to cloud via cellular modem. IC Role / Device Role / Timing Role: Central protocol translator and edge analytics node; handles concurrent CAN, Ethernet, and SD card logging with deterministic timing via ELC-synchronized triggers. Use Value: TSIP ensures secure firmware OTA updates; 640 KB SRAM buffers multi-minute meter data during network outages. |
| Medical Infusion Pump Controller | Automated Test Equipment (ATE) |
Use Scenario: Safety-critical infusion pump requiring real-time motor control, pressure sensing, and human-readable display with audit trail storage. IC Role / Device Role / Timing Role: Primary safety controller running IEC62304-compliant software; manages stepper motor via MTU3 PWM, reads pressure transducer via S12AD, logs events to SDHI. Use Value: MPU and register write protection prevent unintended memory/register corruption; A/D self-diagnostic validates analog path integrity before each dose delivery. | Use Scenario: Rack-mounted ATE platform performing parametric testing of ICs using high-speed digital I/O, precision voltage sourcing, and waveform capture. IC Role / Device Role / Timing Role: Timing master and data acquisition engine: generates synchronized test patterns via TPU/MTU3, captures responses via PDC/SCIi FIFOs, stores results to SD card. Use Value: 120 MHz deterministic timing and 16-byte SCIi FIFOs ensure sub-microsecond jitter in stimulus-response loops; QSPI interfaces with external calibration lookup tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group, identical 176-pin LFBGA package, but 2 MB flash and 640 KB SRAM; no functional difference in peripherals or clocking | Preferred when full 2 MB firmware image size or extended bootloader partitioning is required | Select R5F5651EDFP#30 only if >1.5 MB flash capacity is needed; otherwise R5F56519AGFP#30 offers optimal cost/performance balance |
| R5F566TEBDFP#30 | RX66T Group part; same pinout (176-pin LFBGA), higher 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time compensation), no GLCDC/DRW2D | Targeted at servo drives and inverters where real-time motor control dominates over HMI rendering | Choose R5F566TEBDFP#30 for motion control focus; retain R5F56519AGFP#30 when graphics, Ethernet, and SD interfaces are essential |
Compared with R5F5651EDFP#30, the R5F56519AGFP#30 trades 512 KB flash for lower cost and identical peripheral capability; versus R5F566TEBDFP#30, it retains full HMI subsystems (GLCDC/DRW2D/PDC) at the expense of peak CPU frequency and motor-control-specific timers - making it the optimal choice for embedded industrial displays with connectivity and security.
Availability
R5F56519AGFP#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, medical infusion pumps, and automated test equipment requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R5F56519AGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX65N Group - including the R5F56519AGFP#30 - was designed specifically for industrial human-machine interfaces and edge-connected devices requiring rich graphics, multiple high-speed interfaces, functional safety support, and secure firmware execution.
FAQ
What is the maximum operating frequency and core type of the R5F56519AGFP#30?
The R5F56519AGFP#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. It includes a single-precision IEEE-754 floating-point unit and supports ultra-compact code via variable-length instructions. This specification is confirmed in the official Renesas datasheet R01DS0276EJ0240 Rev.2.40, page 2.
Does the R5F56519AGFP#30 support IEC60730 Class B compliance?
Yes, the R5F56519AGFP#30 includes dedicated hardware features for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (CRCA), independent watchdog timer (IWDT) with windowing, register write protection, and self-diagnostic functionality for the 12-bit A/D converter. These are documented in Section 1.1 and Table 1.1 of the R01DS0276EJ0240 datasheet.
What package and temperature grade does the R5F56519AGFP#30 use?
The R5F56519AGFP#30 uses the PLQP0176KB-A package: a 176-pin LFBGA with 24 mm × 24 mm footprint and 0.5 mm ball pitch. It is rated for the G-grade industrial temperature range of –40°C to +105°C, as specified in the "Operating temp. range" section of the datasheet and confirmed in the package dimension table on page 187.
How much on-chip memory does the R5F56519AGFP#30 include?
The R5F56519AGFP#30 integrates 1.5 MB of code flash memory (with dual-bank structure), 640 KB of SRAM (no wait states up to 120 MHz), 32 KB of reprogrammable data flash (rated for 100,000 erase cycles), and 8 KB of standby RAM backed by VBATT. These values are explicitly listed in Table 1.1, "Outline of Specifications", pages 2–3 of R01DS0276EJ0240.
Which communication interfaces are integrated into the R5F56519AGFP#30?
The R5F56519AGFP#30 integrates Ethernet MAC (10/100 Mbps), 2-channel CAN (ISO11898-1), 13 SCI channels (including LIN-capable SCIh), 3 RSPI, 1 QSPI, 3 I²C (up to 1 Mbps), SD host/slave interfaces, MMCIF, and USB 2.0 FS host/function. This full suite is detailed in the "Various communications interfaces" feature list and Table 1.1 of the R01DS0276EJ0240 datasheet.
R5F56519AGFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 22x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56519AGFP#30 FAQ
1.How can I place an order for R5F56519AGFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56519AGFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56519AGFP#30 reliable?
The price and inventory of R5F56519AGFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519AGFP#30 is usually 5 days.
3.What payment methods are accepted for R5F56519AGFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56519AGFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56519AGFP#30?
R5F56519AGFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56519AGFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56519AGFP#30?
For technical support, including R5F56519AGFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519AGFP#30 requirements.
6.How does Aetrix verify that R5F56519AGFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F56519AGFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519AGFP#30 meets industry standards.
7.What is the process for return or replacement of R5F56519AGFP#30?
All R5F56519AGFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519AGFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56519AGFP#30 part is unused and in its original packaging.
Return procedure for R5F56519AGFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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