Renesas R5F56519BGBP#20
- Part No.:
- R5F56519BGBP#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-TFBGA
- Datasheet:
-
R5F56519BGBP#20.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:490
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Product details
Overview
R5F56519BGBP#20 from Renesas is a 32-bit RXv2 core MCU operating at up to 120 MHz (240 DMIPS), featuring 2 MB on-chip code flash, 640 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES encryption. It targets industrial HMI, networked gateway, and secure IoT edge controllers requiring real-time processing, connectivity, and functional safety support.
For engineers reviewing the R5F56519BGBP#20 datasheet, R5F56519BGBP#20 pinout, R5F56519BGBP#20 application, or R5F56519BGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +105°C operating range (G-version), dual-bank flash for safe firmware updates, integrated GLCDC with DRW2D graphics acceleration, and IEC60730-compliant self-test features including CRC, IWDT, and A/D diagnostic modes.
Technical Context
The R5F56519BGBP#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates a memory protection unit (MPU) supporting eight configurable regions and Trusted Memory (TM) for secure code execution in designated flash areas.
Its clock system combines external crystal oscillators (8–24 MHz), internal HOCO/LOCO sources, and PLL-based frequency synthesis to drive ICLK up to 120 MHz and multiple independent peripheral clocks (PCLKA/B/C/D) - enabling concurrent high-speed operation of Ethernet, USB, and graphics subsystems without contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Flash Memory | 2 MB code flash with dual-bank structure enabling background programming and safe bank switching during runtime |
| RAM | 640 KB SRAM (256 KB main + 384 KB expansion), 8 KB standby RAM with battery backup |
| Operating Temp | -40°C to +105°C (G-version), qualified for industrial and extended-temperature embedded applications |
| Connectivity | Ethernet MAC (10/100 Mbps), 2× CAN FD-capable channels (ISO 11898-1), USB 2.0 FS host/function/OTG, SDHI/SDSI/MMCIF |
| Analog Peripherals | Two 12-bit A/D converters (8+21 channels), 2× 12-bit D/A converters, on-chip temperature sensor (±1°C) |
| Security | AES-128/192/256 engine, Trusted Secure IP (TSIP), CRC calculator (8/32-bit), register write protection, self-diagnostic A/D |
Pinout & Package
Package: PLQP0176KB-A - 176-pin LFBGA, 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate analog/digital domains enable noise isolation; AVCC1 powers A/D and D/A converters |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system timing and Ethernet PHY synchronization |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Enables MDIO-based PHY configuration and status monitoring without CPU intervention |
| TXD0 / RXD0 | SCI0 asynchronous serial interface | Dedicated UART pins for debug console or host communication; supports LIN protocol via SCIh |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 full-speed transceiver | Integrated PHY eliminates external transceiver; VBUS sensing enables OTG role negotiation |
| SD0_CLK / SD0_CMD / SD0_DAT0–3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); compatible with SD/SDIO cards per Physical Layer Spec v3.01 |
Key Features
| Feature | Design Value |
|---|---|
| Graphics Acceleration | GLCDC + DRW2D engine supports 3-plane overlay, 32-bit pixel rendering, and hardware-accelerated bit blitting for touch HMI displays |
| Functional Safety Support | IEC60730-compliant features include oscillation-stop detection, CRC calculation, IWDT windowing, and A/D self-diagnostic voltage generation |
| Secure Firmware Execution | Trusted Memory (TM) restricts instruction fetch to protected flash regions, preventing unauthorized code readout or execution |
| Real-Time Determinism | Event Link Controller (ELC) enables direct peripheral-to-peripheral triggering (e.g., TPU → A/D start) without CPU latency or ISR overhead |
| Low-Power Operation | Four low-power modes including deep software standby with RTC and 8 KB RAM retention powered from VBATT |
Applications
| Industrial HMI Controller | Smart Gateway Device |
|---|---|
Use Scenario: Embedded display controller for factory-floor HMIs with touch interface, real-time data visualization, and local alarm logging. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, driving GLCDC/DRW2D for layered graphics, managing Ethernet/USB for PLC communication, and sampling analog sensors via S12AD. Use Value: Integrated graphics engine eliminates external GPU; dual-bank flash enables seamless field firmware updates without downtime. | Use Scenario: Edge gateway aggregating Modbus, CAN, and sensor data for cloud upload via Ethernet or cellular modem. IC Role / Device Role / Timing Role: Central protocol translator and security enforcer - terminating CAN/Modbus RTU, encrypting payloads with AES, and forwarding via TCP/IP stack on Ethernet MAC. Use Value: Hardware AES and TSIP accelerate TLS handshake; dual CAN channels support redundant vehicle or machinery networks. |
| Secure IoT Node | Medical Data Logger |
Use Scenario: Battery-powered remote patient monitor collecting ECG, temperature, and SpO₂, then transmitting encrypted data over Ethernet or USB to central station. IC Role / Device Role / Timing Role: Sensor hub with A/D acquisition, on-chip temperature measurement, secure boot, and cryptographic signing of logs using TSIP. Use Value: Standby RAM retains critical logs during power loss; IWDT windowing and CRC ensure runtime integrity per IEC62304 Class B requirements. | Use Scenario: Portable diagnostic device capturing analog biomedical waveforms and storing them to SD card with timestamped metadata. IC Role / Device Role / Timing Role: High-fidelity signal processor - synchronizing 12-bit A/D sampling across 21 channels, buffering data in SRAM, and writing to SDHI with DMA offload. Use Value: 0.48 µs conversion time per channel enables >2 MSPS aggregate throughput; SDHI supports high-speed mode (25 MB/s) for rapid bulk storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group, 144-pin LQFP package, 1 MB flash, 256 KB SRAM, no Ethernet MAC or GLCDC | Suitable for cost-sensitive control-only applications without display or wired networking | Select when footprint, BOM cost, or simplified layout outweigh need for graphics/Ethernet |
| R5F566TEBDFP#30 | RX66T Group, 144-pin LQFP, 1.5 MB flash, 384 KB SRAM, enhanced PWM timers (3-phase inverter control), no SDHI or TSIP | Optimized for motor control with complementary PWM dead-time insertion and encoder interface | Select for servo drives or inverters where real-time PWM precision exceeds R5F56519BGBP#20 capabilities |
Compared with R5F56519BGBP#20, the R5F5651EDFP#30 reduces integration (no Ethernet/GLCDC) for lower cost and simpler layout, while the R5F566TEBDFP#30 trades connectivity and security for deterministic motor control peripherals - making each alternative optimal only within narrowly defined subsystem roles.
Availability
R5F56519BGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for R5F56519BGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.
The RX65N Group - to which R5F56519BGBP#20 belongs - was designed for high-integration industrial and networked applications requiring rich connectivity, graphics capability, functional safety compliance, and secure firmware execution.
FAQ
What is the maximum operating frequency and performance rating of the R5F56519BGBP#20?
The R5F56519BGBP#20 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance. Its RXv2 CPU core supports single-precision IEEE-754 floating-point operations and includes dedicated multiply-and-accumulate units. This performance level enables real-time execution of complex control algorithms, graphics rendering, and protocol stacks - all confirmed in the official R01DS0276EJ0240 datasheet for the R5F56519BGBP#20.
Does the R5F56519BGBP#20 support secure boot and cryptographic functions?
Yes, the R5F56519BGBP#20 includes hardware-accelerated AES-128/192/256 encryption, Trusted Secure IP (TSIP) for key management and secure boot, CRC calculation (8/32-bit), and register write protection. These features are explicitly documented in the R01DS0276EJ0240 datasheet and enable compliance with IEC60730 Class B and IEC62304 requirements - making the R5F56519BGBP#20 suitable for certified medical and industrial safety applications.
What display and graphics interfaces does the R5F56519BGBP#20 integrate?
The R5F56519BGBP#20 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background, graphic 1, graphic 2), and a 2D Drawing Engine (DRW2D) capable of vector drawing, bit blitting, rotation, and texture mapping. It supports 32-/16-/8-bit pixel formats and CLUT-based color lookups. These peripherals are fully functional in the R5F56519BGBP#20 and eliminate the need for external graphics ICs in HMI designs - as verified in Section 1.1 and Table 1.1 of the R01DS0276EJ0240 datasheet.
How many CAN channels does the R5F56519BGBP#20 support, and what protocol versions are compliant?
The R5F56519BGBP#20 supports two CAN channels compliant with ISO 11898-1, handling both standard (11-bit) and extended (29-bit) frame formats. Each channel provides 32 mailboxes for flexible message filtering and prioritization. This dual-CAN capability is confirmed in the "Communication function" section of the R01DS0276EJ0240 datasheet and enables robust networking in automotive diagnostics, industrial automation, and machinery control systems using the R5F56519BGBP#20.
What is the package type and pin count of the R5F56519BGBP#20?
The R5F56519BGBP#20 uses a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch and an exposed thermal pad. This package supports 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain outputs, and programmable pull-up resistors - all specified in Table 1.2 of the R01DS0276EJ0240 datasheet for the R5F56519BGBP#20.
R5F56519BGBP#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-TFBGA
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56519BGBP#20 FAQ
1.How can I place an order for R5F56519BGBP#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56519BGBP#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56519BGBP#20 reliable?
The price and inventory of R5F56519BGBP#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519BGBP#20 is usually 5 days.
3.What payment methods are accepted for R5F56519BGBP#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56519BGBP#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56519BGBP#20?
R5F56519BGBP#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56519BGBP#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56519BGBP#20?
For technical support, including R5F56519BGBP#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519BGBP#20 requirements.
6.How does Aetrix verify that R5F56519BGBP#20 is sourced from the original manufacturer or authorized distributors?
All R5F56519BGBP#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519BGBP#20 meets industry standards.
7.What is the process for return or replacement of R5F56519BGBP#20?
All R5F56519BGBP#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519BGBP#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56519BGBP#20 part is unused and in its original packaging.
Return procedure for R5F56519BGBP#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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