Renesas R5F56519BGFB#30

Overview

R5F56519BGFB#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory (dual-bank), and 640 KB SRAM - deployed in industrial HMI, networked gateway, and secure IoT edge devices requiring Ethernet MAC, CAN, SD host/slave, and hardware encryption.

For engineers reviewing the R5F56519BGFB#30 datasheet, R5F56519BGFB#30 pinout, R5F56519BGFB#30 application, or R5F56519BGFB#30 equivalent, this MCU delivers deterministic real-time control with IEC60730 safety features, 136 GPIOs (19 with 5-V tolerance), and integrated GLCDC/DRW2D for embedded graphics - critical for BOM-stable, long-lifecycle industrial designs.

Technical Context

The R5F56519BGFB#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU/core peripherals, PCLKA up to 120 MHz for ETHERC/EDMAC/AES/GLCDC/DRW2D, and PCLKB up to 60 MHz for timers, ADC, and serial interfaces.

Its peripheral set includes an IEEE 802.3-compliant Ethernet MAC with RMII/MII support, two ISO11898-1 CAN channels (32 mailboxes each), three RSPI, one QSPI, three RIIC, eleven SCI (including two with 16-byte FIFOs), SDHI/SDSI/MMCIF controllers, and a full-featured 12-bit S12AD (21-channel unit) with self-diagnostic and disconnection detection.

Key Specifications

Pinout & Package

LFBGA-176 package (PLBG0176GA-A), 13 × 13 mm body, 0.8-mm ball pitch, 176-ball array with standard BGA footprint and thermal pad center.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56519BGFB#30, the R5F5651EHDFB#30 trades dual-bank flash and DRW2D for lower cost and reduced memory, while the R5F566TEHDFB#30 replaces graphics and storage peripherals with motor-control-specific timers and PWM features - making each alternative optimal only within its distinct application envelope.

Availability

R5F56519BGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for R5F56519BGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX65N Group, which includes R5F56519BGFB#30, was designed for high-integration industrial edge devices requiring embedded graphics, secure connectivity, and functional safety - targeting HMI, gateway, and metering applications with extended temperature and longevity requirements.

FAQ

What is the maximum operating frequency and core architecture of the R5F56519BGFB#30?

The R5F56519BGFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with 5-stage pipeline, variable-length instructions, and Harvard architecture. It delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit - enabling high-efficiency signal processing and real-time control without external math accelerators.

Does the R5F56519BGFB#30 support hardware encryption and functional safety standards?

Yes, the R5F56519BGFB#30 integrates AES-128/192/256 encryption, Trusted Secure IP (TSIP), memory protection unit (MPU), CRC calculator, independent watchdog timer (IWDT) with window function, and register write protection. These features collectively support IEC60730 Class B compliance and secure boot implementation - essential for certified industrial and medical equipment.

What display and graphics capabilities does the R5F56519BGFB#30 provide?

The R5F56519BGFB#30 includes a Graphic-LCD Controller (GLCDC) supporting 3-layer overlay, multiple pixel formats (32/16 bpp), and CLUT-based color mapping, plus a 2D Drawing Engine (DRW2D) for hardware-accelerated vector rendering and bit-blitting. Together, they enable direct driving of VGA-resolution TFT panels with smooth UI animation - eliminating need for external GPU or display controller ICs.

Which communication interfaces are integrated into the R5F56519BGFB#30?

The R5F56519BGFB#30 integrates Ethernet MAC (10/100 Mbps, MII/RMII), two ISO11898-1 CAN channels (32 mailboxes each), SD host/slave interfaces, quad SPI, three RSPI, three I2C, eleven SCI (including two with 16-byte FIFOs), and USB 2.0 FS host/function - providing native wired connectivity for industrial gateways, HMIs, and edge nodes without protocol bridge components.

What is the package type and pin count of the R5F56519BGFB#30?

The R5F56519BGFB#30 uses a 176-ball LFBGA package (PLBG0176GA-A), measuring 13 × 13 mm with 0.8-mm ball pitch. It provides 136 general-purpose I/O pins, of which 19 are 5-V tolerant, all configurable with pull-up resistors and open-drain outputs - optimized for high-density industrial PCB layouts with mixed-voltage interfacing requirements.