Renesas R5F56519BGFP#10

Overview

R5F56519BGFP#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash, 640 KB SRAM, and hardware AES encryption. It integrates Ethernet MAC, dual CAN channels, SD host/slave interfaces, QSPI, GLCDC, and DRW2D - targeting industrial HMI, networked gateways, and secure IoT edge controllers.

For engineers reviewing the R5F56519BGFP#10 datasheet, R5F56519BGFP#10 pinout, R5F56519BGFP#10 application, or R5F56519BGFP#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe firmware updates, and full peripheral support for embedded vision, motor control, and fieldbus connectivity.

Technical Context

The R5F56519BGFP#10 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes two 72-bit accumulators, a 32×32→64-bit multiplier, and a 32/32→32-bit divider.

Its clock system combines external crystal oscillators (8–24 MHz), internal HOCO/LOCO sources, and a PLL to generate ICLK up to 120 MHz, PCLKA up to 120 MHz (for ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz (for most peripherals including S12AD units). The device uses separate clock domains for analog (ADCLK on PCLKC/PCLKD) and flash interface (FCLK up to 60 MHz).

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm, 0.5-mm ball pitch, lead-free, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56519BGFP#10, the R5F5651EDFPL#30 reduces footprint and cost by removing Ethernet and graphics but sacrifices fieldbus convergence capability; the R5F566TEBDFP#30 trades networking for superior motor control precision - making R5F56519BGFP#10 uniquely balanced for HMI-integrated industrial gateways.

Availability

R5F56519BGFP#10 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure networked PLCs, edge AI vision nodes, and smart energy gateways requiring stable component supply across extended product lifecycles.

Supply support for R5F56519BGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RX65N Group - including R5F56519BGFP#10 - was designed for high-integrity industrial edge devices requiring real-time performance, functional safety, cybersecurity, and rich human-machine interface capabilities.

FAQ

What is the maximum operating frequency and core type of the R5F56519BGFP#10?

The R5F56519BGFP#10 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables deterministic real-time execution critical for industrial control applications. The R5F56519BGFP#10 achieves this speed with no wait states on SRAM and optimized flash access via ROM cache.

Does the R5F56519BGFP#10 support Ethernet connectivity, and what interface standards does it implement?

Yes, the R5F56519BGFP#10 integrates a full-featured Ethernet MAC supporting both MII and RMII interfaces per IEEE 802.3u, enabling 10/100 Mbps operation in full- and half-duplex modes. It includes EDMAC for descriptor-based DMA transfers, Magic Packet™ wake-on-LAN detection, and IEEE 802.3x flow control - all implemented in hardware without external PHY logic. The R5F56519BGFP#10 requires only an external 10/100 PHY IC for physical layer connectivity.

What security features are included in the R5F56519BGFP#10 for firmware and data protection?

The R5F56519BGFP#10 includes hardware-based security features: AES-128/192/256 encryption engine, Trusted Secure IP (TSIP) with secure key storage, Memory Protection Unit (MPU) with eight configurable regions, Trusted Memory (TM) for code flash read protection, and CRC calculator supporting multiple polynomials. These features collectively enable secure boot, encrypted OTA updates, and runtime memory isolation - essential for meeting IEC60730 Class B and industrial cybersecurity requirements. The R5F56519BGFP#10 leverages these to protect both firmware integrity and sensitive operational data.

Can the R5F56519BGFP#10 drive a color LCD display directly, and what graphics acceleration is available?

Yes, the R5F56519BGFP#10 integrates a Graphic-LCD Controller (GLCDC) supporting RGB, SYS, and CCIR656 interfaces with up to 3 overlay planes (background + 2 graphics layers) and pixel formats from 1-bit CLUT to 32-bit true color. It also includes a dedicated 2D Drawing Engine (DRW2D) that accelerates vector drawing (lines, triangles, circles), bit-blitting (copy, stretch, rotate), and texture mapping. This combination allows the R5F56519BGFP#10 to drive high-resolution TFT displays at 60 Hz without burdening the CPU - ideal for industrial HMIs and medical displays.

What is the pin count, package type, and temperature grade of the R5F56519BGFP#10?

The R5F56519BGFP#10 is housed in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A, measuring 24 mm × 24 mm with 0.5-mm ball pitch. It is rated for industrial operation from –40°C to +105°C (G-version), with exposed thermal pad for reliable thermal management under sustained 120-MHz operation. This package provides high I/O density (136 general-purpose pins, 19 5-V tolerant) while maintaining compatibility with standard SMT assembly processes. The R5F56519BGFP#10's mechanical and thermal specs align with IPC-7351B and JEDEC J-STD-020 standards.