Renesas R5F56519EGFB#30

Overview

R5F56519EGFB#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 2 MB on-chip code flash, 640 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES encryption. It targets industrial HMI, networked gateway, and secure IoT edge devices requiring real-time control and connectivity.

For engineers reviewing the R5F56519EGFB#30 datasheet, R5F56519EGFB#30 pinout, R5F56519EGFB#30 application, or R5F56519EGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz deterministic real-time performance, integrated GLCDC + DRW2D for embedded graphics, and IEC60730-compliant safety features including MPU, TSIP, and CRC acceleration.

Technical Context

The R5F56519EGFB#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and dual multiply-accumulate units-enabling deterministic execution critical for motor control and protocol stacks. Its clock system supports independent domain scaling: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for ETHERC/EDMAC/GLCDC, and PCLKB up to 60 MHz for ADC/DAC/timers.

Peripheral integration follows a hierarchical bus architecture: AXI-like interconnect for high-speed modules (ETHERC, USB, QSPI), AHB-lite for medium-bandwidth peripherals (SCI, CAN, RSPI), and APB for low-speed functions (RTC, IWDT, GPIO). The ELC (Event Link Controller) enables zero-CPU-latency peripheral chaining-e.g., TPU capture event → trigger S12AD conversion → store result via DMACA-without interrupt overhead.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in industrial ambient conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F56519EGFB#30, the R5F56518EGFB#30 offers identical functionality at reduced memory capacity-ideal for incremental cost optimization-while the R5F56605GDFB#30 trades integrated graphics and pin compatibility for higher CPU throughput and security, necessitating hardware revision.

Availability

R5F56519EGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F56519EGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group-including R5F56519EGFB#30-is designed for industrial human-machine interfaces and networked edge devices requiring real-time determinism, rich connectivity, embedded graphics, and functional safety certification support.

FAQ

What is the maximum operating frequency and core type of the R5F56519EGFB#30?

The R5F56519EGFB#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core delivers 240 DMIPS performance and includes a single-precision IEEE-754 floating-point unit, two multiply-accumulate units, and a 5-stage pipeline for deterministic real-time execution. The R5F56519EGFB#30 achieves this speed with no wait states up to 50 MHz on code flash and one wait state up to 100 MHz.

Does the R5F56519EGFB#30 support Ethernet and CAN simultaneously?

Yes, the R5F56519EGFB#30 integrates a full Ethernet MAC (10/100 Mbps MII/RMII) and two independent CAN channels compliant with ISO11898-1, each with 32 mailboxes. These operate concurrently with dedicated DMA controllers (EDMACa for Ethernet, CAN-specific message RAM) and share no resource contention-enabling simultaneous protocol stack execution for gateway applications. The R5F56519EGFB#30 supports both interfaces without external transceivers beyond standard PHY components.

What graphics capabilities does the R5F56519EGFB#30 provide?

The R5F56519EGFB#30 includes a Graphic-LCD Controller (GLCDC) supporting 24-bit RGB parallel output up to WXGA resolution and a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector graphics, bit blitting, rotation, and scaling. These operate independently of the CPU-freeing it for application logic-while sharing frame buffer memory. The R5F56519EGFB#30 uses these to render UI elements directly, eliminating need for external GPU or display controller.

How does the R5F56519EGFB#30 meet IEC60730 safety requirements?

The R5F56519EGFB#30 incorporates multiple hardware features for IEC60730 Class B compliance: memory protection unit (MPU), register write protection, oscillation-stop detection, CRC calculator (CRCA) with configurable polynomials, self-diagnostic A/D converter, and independent watchdog timer (IWDTa) with window function. These reduce software verification burden and enable systematic fault detection-critical for R5F56519EGFB#30 deployments in industrial control and medical devices.

What is the package type and thermal specification of the R5F56519EGFB#30?

The R5F56519EGFB#30 is housed in a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. It is rated for industrial temperature range (–40°C to +105°C), features an exposed thermal pad for efficient heat dissipation, and complies with JEDEC J-STD-020 moisture sensitivity level 3. This package ensures mechanical robustness and thermal stability in demanding R5F56519EGFB#30 applications.