Renesas R5F56519EGFP#30

Overview

R5F56519EGFP#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz max operating frequency, 240 DMIPS performance, single-precision IEEE-754 FPU, 2 MB on-chip code flash memory (dual-bank), and 640 KB SRAM - deployed in industrial HMI systems requiring Ethernet MAC, SD host/slave, CAN, and GLCDC-driven graphical displays.

For engineers reviewing the R5F56519EGFP#30 datasheet, R5F56519EGFP#30 pinout, R5F56519EGFP#30 application, or R5F56519EGFP#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), integrated 12-bit dual A/D converters (29 total channels), hardware AES-128/192/256 engine, TSIP security IP, and support for IEC60730 functional safety compliance.

Technical Context

The R5F56519EGFP#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, GLCDC), and PCLKB up to 60 MHz for timers and analog modules.

Its peripheral subsystem includes an Ethernet MAC with MII/RMII support, dual-channel CAN (ISO11898-1, 32 mailboxes/channel), 13 SCI channels (including FIFO-equipped SCIi), 3 RSPI, 1 QSPI, SDHI/SDSI/MMCIF interfaces, and a full-featured graphics subsystem comprising GLCDC + DRW2D + PDC for CMOS camera input and multi-layer LCD rendering.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin LFBGA, 24 × 24 mm, 0.5 mm pitch, –40°C to +85°C (D-version).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F56519EGFP#30, the R5F5651EDFP#30 reduces footprint and memory but sacrifices graphics acceleration and dual SD interfaces, while the R5F566TEADFP#30 trades connectivity for deterministic motor control peripherals - making R5F56519EGFP#30 optimal for connected, display-rich embedded systems requiring both safety and rich I/O.

Availability

R5F56519EGFP#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, medical patient monitors, and building automation controllers requiring stable component supply and long-term lifecycle support.

Supply support for R5F56519EGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group, including R5F56519EGFP#30, was designed for high-integration industrial and medical applications demanding real-time performance, functional safety, rich connectivity, and embedded graphics capabilities.

FAQ

What is the maximum operating frequency and CPU performance of the R5F56519EGFP#30?

The R5F56519EGFP#30 operates at a maximum frequency of 120 MHz and delivers 240 DMIPS of processing performance using the RXv2 CPU core. Its single-precision IEEE-754 floating-point unit enables efficient math-intensive tasks such as sensor fusion and waveform analysis. The R5F56519EGFP#30 achieves this performance with zero wait-state access to SRAM and optimized flash cache behavior up to 50 MHz.

Does the R5F56519EGFP#30 support functional safety standards like IEC60730?

Yes, the R5F56519EGFP#30 includes multiple hardware features for IEC60730 Class B compliance: oscillation-stop detection, hardware CRC calculator (CRCA), independent watchdog timer (IWDT) with windowing, A/D converter self-diagnostic function, and register write protection. These features allow developers to implement robust runtime checks without software overhead - critical for R5F56519EGFP#30 deployments in medical and industrial safety-critical systems.

What graphics and display interfaces does the R5F56519EGFP#30 integrate?

The R5F56519EGFP#30 integrates a complete graphics subsystem: Graphic-LCD Controller (GLCDC) supporting 3-plane overlay and 24-bit RGB output, 2D Drawing Engine (DRW2D) for vector and bit-blit operations, and Parallel Data Capture (PDC) for CMOS camera input. It supports common LCD panel types and enables smooth UI rendering - making the R5F56519EGFP#30 ideal for HMI applications requiring responsive touchscreens and multi-layer visual feedback.

How does the R5F56519EGFP#30 handle secure firmware and data operations?

The R5F56519EGFP#30 incorporates Trusted Secure IP (TSIP) for hardware-accelerated AES-128/192/256 encryption/decryption and secure key storage, plus a Memory Protection Unit (MPU) with eight configurable regions. It also supports Trusted Memory (TM) to prevent unauthorized readout of protected code flash areas. These capabilities make the R5F56519EGFP#30 suitable for secure boot, encrypted OTA updates, and confidential data handling in networked devices.

What is the package type and thermal specification of the R5F56519EGFP#30?

The R5F56519EGFP#30 uses the PLQP0176KB-A package: a 176-pin LFBGA with 24 × 24 mm body size and 0.5 mm pitch. It is rated for the industrial D-version temperature range of –40°C to +85°C. This package provides high I/O density (136 general-purpose pins, 19 with 5-V tolerance) and thermal performance suitable for convection-cooled industrial enclosures - confirming the R5F56519EGFP#30's suitability for space-constrained, thermally demanding applications.