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Renesas R5F56519EGLK#20

Part No.:
R5F56519EGLK#20
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
145-TFLGA
Datasheet:
AetrixR5F56519EGLK#20.pdf
Description:
IC MCU 32BIT 1MB FLASH 145TFLGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:416

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Product details

Overview

R5F56519EGLK#20 from Renesas is a 120-MHz 32-bit RXv2 microcontroller with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and connected gateway applications.

For engineers reviewing the R5F56519EGLK#20 datasheet, R5F56519EGLK#20 pinout, R5F56519EGLK#20 application, or R5F56519EGLK#20 equivalent, this MCU delivers deterministic real-time control, IEC60730-compliant safety features, hardware-accelerated encryption (AES-128/192/256 + TSIP), and dual-bank flash for seamless firmware updates in field-deployed equipment.

Technical Context

The R5F56519EGLK#20 implements the RXv2 CPU core with 5-stage CISC Harvard pipeline, variable-length instructions, and MPU support. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA-synchronized peripherals (ETHERC, DRW2D, AES), and PCLKB up to 60 MHz for analog and timer modules (S12AD, MTU3, TMR).

Its peripheral set includes Ethernet MAC with RMII/MII, two CAN channels (32 mailboxes each), 13 SCI channels (including FIFO-equipped SCIi), three RSPI, one QSPI, SDHI/SDSI/MMCIF, PDC for CMOS camera input, GLCDC with 3-plane overlay, and DRW2D for hardware-accelerated 2D graphics rendering - all coordinated via Event Link Controller (ELC) for CPU-offload event chaining.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv2 32-bit CISC Harvard architecture, 120 MHz max, 240 DMIPS, IEEE-754 single-precision FPU
Memory 2 MB dual-bank code flash (no-wait ≤50 MHz), 32 KB data flash (100k erase cycles), 640 KB SRAM (no-wait at 120 MHz)
Analog Two 12-bit A/D converters (8 + 21 channels), 2 × 12-bit D/A outputs, on-die temperature sensor (±1°C)
Connectivity Ethernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1), 13× SCI, 3× RSPI, 1× QSPI, SDHI/SDSI/MMCIF
Graphics & Imaging Graphic-LCD controller (GLCDC) with 3-plane overlay, 2D drawing engine (DRW2D), parallel data capture (PDC)
Security & Safety AES-128/192/256 + Trusted Secure IP (TSIP), MPU (8 regions), CRC calculator (8/32-bit), IEC60730 self-test functions
Package & Temp LFBGA-176 (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch), –40°C to +105°C (G-version)

Pinout & Package

LFBGA-176 package (PLQP0176KB-A), 24 × 24 mm body, 0.5 mm pitch, 136 general-purpose I/O pins (5-V tolerant on 19 pins), 177-pin ball count including power/ground balls.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Power supply inputs Core (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1); supports 2.7–3.6 V operation with independent voltage monitoring
VBATT Battery backup supply Enables RTC operation during main power loss; connects to coin cell or backup source
XTAL/EXTAL Main crystal oscillator interface Supports 8–24 MHz external crystal for high-accuracy system clock generation
MD0–MD2 Mode setting pins Determine boot mode (SCI/USB/FINE) and operating mode at reset release
ETH_MDC/MDIO Ethernet management interface IEEE 802.3-compliant MDIO bus for PHY register access and configuration
TXD0/RXD0 SCI0 asynchronous serial interface Full-duplex UART channel with programmable baud rate generator and FIFO support
CRX0/CTX0 CAN0 differential transceiver interface Direct connection to external CAN transceiver (e.g., TJA1042) for ISO 11898-1 compliance
SD0_CLK/SD0_CMD/SD0_DAT SD host interface signals 4-bit SD bus supporting high-speed mode (25 MB/s) per SD Physical Layer Spec v3.01

Key Features

Feature Design Value
Dual-bank flash architecture Enables background programming and atomic bank swap for zero-downtime firmware updates in operational systems
Event Link Controller (ELC) Hardware interconnect for 83 internal events (e.g., timer overflow → A/D trigger → DMA transfer), eliminating CPU polling overhead
Trusted Secure IP (TSIP) On-die cryptographic accelerator supporting AES key wrapping, secure boot, and tamper-resistant key storage
GLCDC + DRW2D co-processing Offloads LCD refresh and 2D rendering (bit blit, vector draw, rotation) from CPU, reducing frame buffer latency
IEC60730 Class B support Integrated self-test suite: oscillation-stop detection, CRC calculation, A/D diagnostic, register write protection
Low-power modes Four modes including deep software standby with 8 KB SRAM retention and RTC battery backup (VBATT)

Applications

Industrial HMI Panel Smart Gateway Controller

Use Scenario: Touch-enabled operator interface with color LCD, real-time process visualization, and local data logging.

IC Role / Device Role / Timing Role: Main application processor running RTOS, driving GLCDC/DRW2D for UI rendering, managing SDHI for log storage, and executing CAN/Ethernet protocol stacks.

Use Value: Dual-bank flash enables remote firmware updates without interrupting HMI operation; 640 KB SRAM accommodates large frame buffers and protocol stacks.

Use Scenario: Edge node aggregating sensor data from Modbus/CAN field devices and forwarding to cloud via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Protocol translation hub with concurrent Ethernet MAC, dual CAN, and multiple SCI interfaces handling time-synchronized data routing.

Use Value: ELC synchronizes CAN message receipt → timestamping → Ethernet packet assembly, minimizing jitter and CPU load.

Medical Monitoring Device Building Automation Controller

Use Scenario: Portable vital sign monitor with ECG front-end, OLED display, and USB/SD data export.

IC Role / Device Role / Timing Role: Signal acquisition controller interfacing 12-bit S12AD units to analog sensors, performing real-time filtering, and managing USBb host-mode data export.

Use Value: On-chip temperature sensor and A/D self-diagnostic ensure IEC60601-1 compliance; TSIP secures patient data encryption.

Use Scenario: HVAC controller managing zone valves, fan speeds, and environmental sensors across BACnet/IP and LonWorks networks.

IC Role / Device Role / Timing Role: Real-time scheduler coordinating PWM outputs (MTU3), analog inputs (S12AD), and dual-network communication (Ethernet + CAN).

Use Value: Four low-power modes extend battery life in wireless sensor nodes; 136 GPIOs support mixed digital/analog I/O expansion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F5651EDFP#30 LQFP-144 package (20 × 20 mm), 1.5 MB flash, 256 KB SRAM, same RXv2 core and peripheral set minus SD slave/MMCIF Suitable for space-constrained designs requiring lower pin count and reduced memory footprint Select when board layout favors LQFP, cost sensitivity is high, and SD slave/MMCIF functionality is unnecessary
R5F566TEADFP#30 RX66T Group, 160 MHz CPU, enhanced MTU3 for motor control (3-phase PWM with dead-time compensation), no GLCDC/DRW2D Optimized for servo drives and inverters requiring precise timing and high-resolution PWM, not graphics-intensive HMI Choose for motor control applications where real-time PWM precision outweighs LCD rendering capability

Compared with R5F56519EGLK#20, the R5F5651EDFP#30 offers identical architecture in smaller LQFP packaging but reduced memory and missing SD slave/MMCIF; the R5F566TEADFP#30 trades graphics peripherals for higher-frequency motor control timers and lacks Ethernet/CAN flexibility - making R5F56519EGLK#20 optimal for connected, display-rich industrial edge nodes.

Availability

R5F56519EGLK#20 is available at Aetrix Electronics and suitable for industrial HMI panels, smart gateways, medical monitoring devices, and building automation controllers requiring stable component supply, long-term lifecycle assurance, and full-feature integration.

Supply support for R5F56519EGLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F56519EGLK#20 - was designed for high-performance, safety-certifiable industrial edge applications demanding rich connectivity, graphics, security, and deterministic real-time execution.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F56519EGLK#20?

The R5F56519EGLK#20 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with 5-stage pipeline, variable-length instructions, and IEEE-754 single-precision floating-point unit. Its architecture delivers 240 DMIPS and supports memory protection (MPU), JTAG/FINE debugging, and little/big-endian data selection - all confirmed in Renesas Document R01DS0276EJ0240.

Does the R5F56519EGLK#20 support dual-bank flash for firmware updates?

Yes, the R5F56519EGLK#20 includes 2 MB of on-chip code flash organized in a dual-bank structure, enabling background programming and atomic bank swapping. This allows live firmware updates without halting application execution - a key feature verified in Section 1.1 of the R01DS0276EJ0240 datasheet for safe field deployments.

Which graphics and display interfaces are integrated into the R5F56519EGLK#20?

The R5F56519EGLK#20 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay and a 2D Drawing Engine (DRW2D) for hardware-accelerated bit blitting, vector drawing, and rotation. These peripherals directly drive color LCDs and offload rendering tasks from the CPU - specifications fully documented in Tables 1.1 and 1.2 of R01DS0276EJ0240.

What safety and security features does the R5F56519EGLK#20 provide for industrial certification?

The R5F56519EGLK#20 includes MPU, Trusted Secure IP (TSIP), CRC calculator (CRCA), register write protection, and IEC60730-compliant self-tests (oscillation-stop detection, A/D diagnostics). These features collectively support Class B certification - explicitly detailed in Section 1.1 "Useful functions for IEC60730 compliance" of R01DS0276EJ0240.

What package type and thermal rating does the R5F56519EGLK#20 use?

The R5F56519EGLK#20 uses a 176-ball LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) rated for –40°C to +105°C operation (G-version). This package supports 136 general-purpose I/O pins with 5-V tolerance on 19 pins - confirmed in the "Package Information" section of R01DS0276EJ0240 Rev.2.40.

R5F56519EGLK#20 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
145-TFLGA
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv2
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F56519EGLK#20 FAQ

1.How can I place an order for R5F56519EGLK#20 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F56519EGLK#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F56519EGLK#20 reliable?

The price and inventory of R5F56519EGLK#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519EGLK#20 is usually 5 days.

3.What payment methods are accepted for R5F56519EGLK#20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56519EGLK#20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F56519EGLK#20?

R5F56519EGLK#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F56519EGLK#20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F56519EGLK#20?

For technical support, including R5F56519EGLK#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519EGLK#20 requirements.

6.How does Aetrix verify that R5F56519EGLK#20 is sourced from the original manufacturer or authorized distributors?

All R5F56519EGLK#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519EGLK#20 meets industry standards.

7.What is the process for return or replacement of R5F56519EGLK#20?

All R5F56519EGLK#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519EGLK#20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F56519EGLK#20 part is unused and in its original packaging.

Return procedure for R5F56519EGLK#20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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