My Inquiry
My Account
Renesas R5F56519FGBP#20
- Part No.:
- R5F56519FGBP#20
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-TFBGA
- Datasheet:
-
R5F56519FGBP#20.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:590
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F56519FGBP#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 2 MB on-chip code flash, 640 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, and hardware AES/TSIP encryption. It serves as a high-integration control and connectivity hub in industrial gateways requiring real-time processing, secure communication, and display support.
For engineers reviewing the R5F56519FGBP#20 datasheet, R5F56519FGBP#20 pinout, R5F56519FGBP#20 application, or R5F56519FGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C G-grade temperature rating, dual-bank flash for safe firmware updates, integrated GLCDC+DRW2D for HMI rendering, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.
Technical Context
The R5F56519FGBP#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dedicated clock domains: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for Ethernet/USB/GLCDC, and PCLKB up to 60 MHz for timers and ADCs - enabling concurrent high-speed peripheral operation without CPU contention.
Its memory subsystem includes 2 MB dual-bank code flash (with background programming and bank-swapping), 640 KB SRAM (256 KB main + 384 KB expansion), and 32 KB data flash rated for 100,000 erase/write cycles. Peripheral integration spans Ethernet MAC + RMII/MII PHY, two CAN 2.0B controllers (32 mailboxes each), SDHI/SDSI/MMCIF, QSPI, and parallel camera interface (PDC), all coordinated via ELC event linking to minimize interrupt latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Operating Frequency | 120 MHz system clock (ICLK); enables deterministic real-time response in motion control loops |
| Flash Memory | 2 MB dual-bank code flash; supports background programming and seamless bank swap for OTA updates |
| SRAM | 640 KB total (256 KB main + 384 KB expansion); zero-wait-state access at 120 MHz for real-time buffer handling |
| Peripherals | Ethernet MAC + RMII/MII, 2× CAN 2.0B (32 mailboxes/channel), SDHI/SDSI, QSPI, PDC, GLCDC, DRW2D, AES/TSIP |
| Analog | Two 12-bit A/D converters (8 + 21 channels), 2× 12-bit D/A, on-die temperature sensor (±1°C) |
| Package & Temp | 176-pin LFBGA (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch), G-grade (–40°C to +105°C) |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, 136 general-purpose I/O pins (5-V tolerant on 19 pins), 1 dedicated input pin, pull-up and open-drain configurable per pin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails enable noise isolation for precision ADC/DAC operation |
| VBATT | Battery backup supply | Provides power to RTC during main supply failure; enables timekeeping in deep software standby mode |
| RES# | Active-low reset input | Hardware reset assertion; synchronous release ensures reliable initialization under noisy conditions |
| CLKIN / CLKOUT | External crystal oscillator interface | Supports 8–24 MHz crystal; used with internal PLL for stable 120 MHz system clock generation |
| ETXD0–ETXD3 / ETXEN / ETXER / ERXD0–ERXD3 / ERXDV / ERXER | Ethernet PHY interface (RMII) | Direct RMII connection eliminates external PHY; enables compact, low-latency 10/100 Mbps Ethernet implementation |
| CAN0TX / CAN0RX / CAN1TX / CAN1RX | CAN transceiver I/O | Dedicated differential signal pairs per channel; compliant with ISO 11898-1 for robust automotive/industrial bus communication |
| SD0DAT0–SD0DAT3 / SD0CMD / SD0CLK | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s); enables direct attachment of SD cards or Wi-Fi modules |
Key Features
| Feature | Design Value |
|---|---|
| Trusted Secure IP (TSIP) | Hardware-accelerated AES-128/192/256 and secure key storage; enables certified secure boot and encrypted firmware updates |
| Graphic-LCD Controller (GLCDC) | Supports 3-layer overlay (background + 2 graphics), 32/16 bpp formats, and direct frame buffer access - reduces CPU load in HMI applications |
| 2D Drawing Engine (DRW2D) | Hardware-accelerated vector drawing (lines, circles), bit blitting (copy/rotate/stretch), and CLUT-based color conversion - offloads GUI rendering from CPU |
| Event Link Controller (ELC) | 83 internal event sources linked without CPU intervention; e.g., TPU timer overflow triggers ADC conversion or GPIO toggle - cuts interrupt latency to sub-microsecond |
| IEC60730 Safety Support | Integrated CRC calculator (8/32-bit), oscillation-stop detection, IWDT windowing, A/D self-diagnostic, and register write protection - simplifies Class B certification |
Applications
| Industrial Gateway | Smart Energy Meter |
|---|---|
Use Scenario: Aggregating Modbus RTU, CAN, and Ethernet data from field devices into cloud-connected edge nodes. IC Role / Device Role / Timing Role: Central protocol translator and real-time scheduler; uses ELC-linked MTU3 timers to synchronize CAN message transmission with Ethernet packet framing. Use Value: Dual CAN + Ethernet MAC + SDHI enables simultaneous legacy fieldbus and modern IP connectivity without external bridge ICs. |
Use Scenario: High-accuracy electricity meter with tamper detection, secure firmware updates, and local display. IC Role / Device Role / Timing Role: Metrology controller with TSIP-secured firmware, RTC-backed logging, and GLCDC-driven LCD UI. Use Value: Integrated AES/TSIP and IEC60730 features eliminate need for external security co-processors and simplify functional safety validation. |
| HMI Controller | Motion Control Drive |
Use Scenario: Touch-enabled operator panel with animated graphics, alarm history, and remote diagnostics. IC Role / Device Role / Timing Role: Display engine and UI processor; DRW2D renders vector graphics while CPU handles communication stacks. Use Value: Hardware DRW2D + GLCDC delivers smooth 60 fps UI updates with <5% CPU utilization - extends thermal headroom in sealed enclosures. |
Use Scenario: Compact servo drive with position feedback, current loop control, and EtherCAT slave interface. IC Role / Device Role / Timing Role: Real-time motion controller; TPUa/MTU3 generate precise PWM waveforms with dead-time compensation and synchronized ADC sampling. Use Value: 120 MHz CPU + ELC-triggered ADC/PWM ensures <1 µs jitter in current-loop timing - meets EN 61800-3 EMC requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5651EDFP#30 | Same RX65N Group, 144-pin LQFP package (PLQP0144KA-B), 1.5 MB flash, 256 KB SRAM, no Ethernet MAC | Lacks integrated Ethernet PHY and GLCDC; suited for cost-sensitive, non-networked control applications | Select when Ethernet and display functions are unnecessary and PCB layout favors LQFP over BGA. |
| R5F566TEBDFP#30 | RX66T Group, 144-pin LQFP, 160 MHz CPU, 2 MB flash, 384 KB SRAM, enhanced PWM (3-phase complementary with dead-time), no Ethernet or TSIP | Optimized for motor control with advanced timer peripherals; lacks security and connectivity features of R5F56519FGBP#20 | Prefer for high-speed servo drives where PWM precision outweighs network/security needs. |
Compared with R5F56519FGBP#20, the R5F5651EDFP#30 sacrifices Ethernet and display capability for lower cost and simpler assembly, while the R5F566TEBDFP#30 trades security and connectivity for superior motor-control timing resolution - making R5F56519FGBP#20 the only choice for secure, connected, display-rich industrial edge nodes.
Availability
R5F56519FGBP#20 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, HMI controllers, and motion control drives requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R5F56519FGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.
The RX65N Group, which includes the R5F56519FGBP#20, was designed for secure, connected industrial edge devices requiring real-time control, rich HMI, and functional safety compliance - targeting gateway, metering, and automation applications.
FAQ
What is the maximum operating frequency and CPU performance of the R5F56519FGBP#20?
The R5F56519FGBP#20 operates at a maximum system clock frequency of 120 MHz using its RXv2 32-bit CPU core, delivering 240 DMIPS of computational throughput. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables efficient code density and deterministic real-time execution - critical for industrial control loops and protocol stack processing in the R5F56519FGBP#20.
Does the R5F56519FGBP#20 support secure firmware updates and cryptographic operations?
Yes, the R5F56519FGBP#20 integrates Trusted Secure IP (TSIP) hardware accelerators supporting AES-128/192/256 encryption and secure key storage, along with a CRC calculator for integrity verification. These features enable certified secure boot, encrypted firmware updates, and runtime data protection - fulfilling IEC60730 Class B requirements without external security ICs in the R5F56519FGBP#20.
What display and graphics capabilities does the R5F56519FGBP#20 provide?
The R5F56519FGBP#20 includes a Graphic-LCD Controller (GLCDC) supporting 3-layer overlay (background + 2 graphics), multiple pixel formats (32/16 bpp), and direct frame buffer access, plus a 2D Drawing Engine (DRW2D) for hardware-accelerated vector drawing, bit blitting, and CLUT-based color conversion. This combination enables responsive, low-CPU-load HMI rendering - a defining capability of the R5F56519FGBP#20.
How many CAN interfaces does the R5F56519FGBP#20 support, and what is their configuration?
The R5F56519FGBP#20 integrates two independent CAN 2.0B controllers, each supporting standard and extended frames with 32 dedicated mailboxes. Both channels comply with ISO 11898-1 and support programmable bit rates, automatic retransmission, and error confinement - enabling robust multi-bus communication in vehicle networks or factory automation systems using the R5F56519FGBP#20.
What is the package type and temperature grade of the R5F56519FGBP#20?
The R5F56519FGBP#20 is housed in a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package designated PLQP0176KB-A (24 mm × 24 mm, 0.5 mm pitch) and is rated for the G-grade industrial temperature range of –40°C to +105°C. This package provides high I/O density and thermal performance essential for compact, fanless industrial designs using the R5F56519FGBP#20.
R5F56519FGBP#20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-TFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 41
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F56519FGBP#20 FAQ
1.How can I place an order for R5F56519FGBP#20 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F56519FGBP#20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F56519FGBP#20 reliable?
The price and inventory of R5F56519FGBP#20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F56519FGBP#20 is usually 5 days.
3.What payment methods are accepted for R5F56519FGBP#20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F56519FGBP#20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F56519FGBP#20?
R5F56519FGBP#20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F56519FGBP#20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F56519FGBP#20?
For technical support, including R5F56519FGBP#20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F56519FGBP#20 requirements.
6.How does Aetrix verify that R5F56519FGBP#20 is sourced from the original manufacturer or authorized distributors?
All R5F56519FGBP#20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F56519FGBP#20 meets industry standards.
7.What is the process for return or replacement of R5F56519FGBP#20?
All R5F56519FGBP#20 units undergo pre-shipment inspection (PSI). If there is an issue with R5F56519FGBP#20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F56519FGBP#20 part is unused and in its original packaging.
Return procedure for R5F56519FGBP#20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F56519FGBP#20 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
