Renesas R5F5651CDGBG#20

Overview

R5F5651CDGBG#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 640 KB SRAM (256 KB main + 384 KB expansion), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES encryption. It targets industrial HMI, networked gateway, and secure IoT edge node applications requiring real-time control, connectivity, and cryptographic integrity.

For engineers reviewing the R5F5651CDGBG#20 datasheet, R5F5651CDGBG#20 pinout, R5F5651CDGBG#20 application, or R5F5651CDGBG#20 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C G-grade temperature rating, dual-bank flash for safe firmware updates, integrated GLCDC with DRW2D graphics acceleration, and IEC60730-compliant safety features including CRC, IWDT, and register write protection.

Technical Context

The R5F5651CDGBG#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual clock domains: ICLK up to 120 MHz for CPU and high-speed peripherals (ETHERC, GLCDC, DRW2D), and PCLKB up to 60 MHz for analog and low-speed modules (S12AD, CMT, RTC).

Its memory subsystem includes 1 MB dual-bank code flash (no-wait access ≤50 MHz, 1-wait ≤100 MHz), 32 KB data flash (100,000 erase cycles), 640 KB SRAM (no-wait at 120 MHz), and 8 KB standby RAM backed by VBATT. Peripheral interconnect uses Event Link Controller (ELC) to enable direct hardware-triggered operation between 83 internal event sources-eliminating CPU intervention for timer-triggered ADC sampling, PWM synchronization, or DMA transfers.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5F5651CDGBG#20, the R5F565NEDDFP#30 provides identical functionality in an LQFP package for prototyping flexibility, while the R5F566TEBDFP#30 trades networking and graphics capability for superior motor-control timer resolution-making it unsuitable as a drop-in replacement but viable for dedicated motion applications.

Availability

R5F5651CDGBG#20 is available at Aetrix Electronics and suitable for industrial HMI, smart gateway, and secure IoT edge node applications requiring stable component supply, long-term lifecycle support, and automotive-grade temperature resilience.

Supply support for R5F5651CDGBG#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX65N Group-including R5F5651CDGBG#20-is designed for high-integrity, connected embedded systems demanding real-time performance, rich peripheral integration, and built-in functional safety and security features.

FAQ

What is the maximum operating frequency and core type of the R5F5651CDGBG#20?

The R5F5651CDGBG#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its Harvard architecture with 5-stage pipeline and variable-length instruction set enables high code density and deterministic real-time execution-critical for industrial control and HMI applications where latency predictability matters.

Does the R5F5651CDGBG#20 support dual-bank flash for safe firmware updates?

Yes, the R5F5651CDGBG#20 includes a dual-bank code flash architecture that allows background programming and bank swapping during runtime. This enables zero-downtime firmware updates: one bank executes while the other is being reprogrammed, then the start-up bank is exchanged-ensuring continuous operation and robust recovery in mission-critical systems.

What graphics capabilities does the R5F5651CDGBG#20 provide for HMI applications?

The R5F5651CDGBG#20 integrates a Graphic-LCD Controller (GLCDC) supporting up to three overlay planes and a 2D Drawing Engine (DRW2D) with vector drawing, bit blitting, rotation, and texture mapping. These hardware accelerators eliminate the need for external graphics controllers and reduce SRAM bandwidth pressure-enabling smooth UI rendering directly from its 640 KB on-chip SRAM.

How does the R5F5651CDGBG#20 meet IEC60730 Class B safety requirements?

The R5F5651CDGBG#20 includes multiple IEC60730-compliant features: oscillation-stop detection, hardware CRC calculator (CRCA), independent watchdog timer (IWDT) with windowing, register write protection, and A/D converter self-diagnostic. These are documented in Renesas Application Note R01AN3819EJ0100 and enable certified Class B implementation without external safety monitors.

What is the package type and temperature grade of the R5F5651CDGBG#20?

The R5F5651CDGBG#20 uses a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) and is rated for the G-grade industrial temperature range of –40°C to +105°C. This package supports high-density PCB layouts and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3, requiring bake prior to reflow if exposed beyond floor life.