My Inquiry
My Account
Renesas R5F5651CDGFB#30
- Part No.:
- R5F5651CDGFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F5651CDGFB#30.pdf
- Description:
- IC MCU 32BIT 1.5MB FLSH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:180
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F5651CDGFB#30 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 640 KB SRAM (256 KB main + 384 KB expansion), single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, SD host/slave interfaces, and hardware AES encryption. It targets industrial HMI, networked gateways, and secure IoT edge nodes requiring real-time control with rich connectivity.
For engineers reviewing the R5F5651CDGFB#30 datasheet, R5F5651CDGFB#30 pinout, R5F5651CDGFB#30 application, or R5F5651CDGFB#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz deterministic timing, dual-bank flash for safe firmware updates, integrated GLCDC + DRW2D for embedded graphics, and IEC60730-compliant safety features including MPU, TSIP, and CRC acceleration.
Technical Context
The R5F5651CDGFB#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU and PCLKA-synchronized peripherals (ETHERC, GLCDC, DRW2D), while PCLKB (≤60 MHz) drives ADC, timers, and communication interfaces like SCI and I²C.
Its memory subsystem includes 1 MB dual-bank code flash (enabling background programming and bank swapping), 32 KB data flash (100,000 erase/write cycles), 640 KB SRAM (no wait states at 120 MHz), and 8 KB standby RAM backed by VBATT. Peripheral integration centers on deterministic real-time I/O via ELC event linking, supporting synchronized trigger chains across MTU3, TPU, A/D, and DMA controllers without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC core with 5-stage pipeline, 240 DMIPS @ 120 MHz |
| Max Clock Frequency | 120 MHz system clock (ICLK); PCLKA up to 120 MHz, PCLKB up to 60 MHz |
| Memory | 1 MB dual-bank code flash (background programmable), 32 KB data flash, 640 KB SRAM |
| Analog Peripherals | Two 12-bit A/D units (8 + 21 channels), two 12-bit D/A channels, on-die temperature sensor (±1°C) |
| Connectivity | Ethernet MAC (10/100 Mbps), 2× CAN (ISO 11898-1), 3× RSPI, 1× QSPI, 3× I²C (up to 1 Mbps), 13× SCI |
| Graphics & Media | Graphic-LCD controller (GLCDC), 2D drawing engine (DRW2D), parallel camera interface (PDC), SDHI/SDSI/MMCIF |
| Security | AES-128/192/256, Trusted Secure IP (TSIP), Memory Protection Unit (MPU), CRC calculator (CRCA) |
Pinout & Package
R5F5651CDGFB#30 uses the PLQP0176KB-A package: 176-pin Low-Profile Quad Flat Package (LFBGA), 24 × 24 mm body, 0.5 mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital (VCC) and analog (AVCC0/AVCC1) rails; supports 2.7–3.6 V operation with independent noise filtering |
| RES# | Active-low reset input | Asynchronous hardware reset; initiates full system initialization sequence including POR and register clearing |
| CLKIN / XTAL / EXTAL | External clock inputs | Supports 8–24 MHz crystal resonator or external clock source for main oscillator circuit |
| VBATT | Battery backup supply | Enables RTC operation during main power loss; maintains calendar/time and 8 KB standby RAM contents |
| ETH_MDC / ETH_MDIO / ETH_TXD[3:0] / ETH_RXD[3:0] | Ethernet physical layer interface | MII/RMII-compatible signals for 10/100 Mbps Ethernet; requires external PHY or integrated PHY per design |
| SD0_* / SD1_* | SD host and slave interface pins | Dual SD bus support: SDHI (1-/4-bit) for SD memory/I/O cards; SDSI (1-/4-bit/SPI) for SDIO peripheral attachment |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables seamless firmware updates with zero downtime: execute from Bank A while programming Bank B |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., MTU3 overflow → A/D start → DMACA transfer) eliminates CPU polling overhead |
| Integrated graphics subsystem | GLCDC + DRW2D offloads GUI rendering: supports 3-layer composition, bit-blitting, vector drawing, and texture mapping |
| IEC60730 safety support | On-chip oscillation-stop detection, CRC accelerator (CRCA), self-diagnostic A/D, register write protection, and IWDT windowing |
| Flexible low-power modes | Four modes including deep software standby (RTC + 8 KB RAM active at ~1.2 µA) and software standby (full RAM retention) |
Applications
| Industrial HMI Panel | Secure Network Gateway |
|---|---|
Use Scenario: Touch-enabled factory floor display with real-time PLC data visualization and local alarm logging. IC Role / Device Role / Timing Role: Primary application processor managing GLCDC-driven TFT display, DRW2D-accelerated UI rendering, Ethernet/SD card data logging, and CAN bus field device interfacing. Use Value: Dual-bank flash enables over-the-air firmware updates without interrupting HMI operation; 640 KB SRAM buffers frame buffers and protocol stacks simultaneously. |
Use Scenario: Edge gateway aggregating Modbus RTU, CANopen, and EtherNet/IP traffic into unified MQTT/HTTP cloud upload. IC Role / Device Role / Timing Role: Central protocol translator and security enforcer, running TLS stack with hardware AES, validating field device messages via CRC, and scheduling time-critical CAN/Ethernet packet forwarding. Use Value: TSIP and MPU isolate secure boot and crypto keys from application code; ELC synchronizes CAN mailbox interrupts with Ethernet descriptor DMA for deterministic latency. |
| Medical Device Controller | Smart Energy Meter |
Use Scenario: Portable diagnostic instrument with LCD display, USB host for printer/storage, and isolated serial interfaces to sensors. IC Role / Device Role / Timing Role: Real-time sensor data acquisition hub using dual A/D units (8 + 21 ch), USB 2.0 FS host for peripheral attachment, and hardware CRC for data integrity verification. Use Value: Temperature sensor + A/D unit 1 provides on-chip thermal monitoring; 120 MHz core ensures sub-millisecond response to critical alarms. |
Use Scenario: DIN-rail mounted electricity meter with tamper detection, remote firmware update, and multi-protocol communication (M-Bus, DLMS/COSEM over RS485). IC Role / Device Role / Timing Role: Safety-certified metering controller executing IEC60730 Class B diagnostics, managing RTC-based billing intervals, and securing firmware updates via AES-256 decryption. Use Value: Independent watchdog (IWDT) with windowing prevents malicious or runaway code from disabling safety checks; dual CAN channels support redundant communication paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F565NEDGFB#30 | 2 MB code flash, 640 KB SRAM, identical package and peripheral set; adds larger flash capacity | Suitable for applications requiring larger firmware image (e.g., dual-application partitioning or extended bootloader) | Select when >1 MB flash is needed; pinout and software compatibility preserved |
| R5F566TEBGFB#30 | Same RXv2 core, 120 MHz, but belongs to RX66T group: enhanced motor control timers (MTU3 with 3-phase PWM), no Ethernet or GLCDC | Optimized for inverter drives and servo control where high-resolution PWM and encoder capture outweigh graphics/network needs | Choose for motor control focus; lacks Ethernet, SD, and graphics engines present in R5F5651CDGFB#30 |
Compared with R5F5651CDGFB#30, R5F565NEDGFB#30 offers scalable flash headroom without changing layout or drivers, while R5F566TEBGFB#30 trades networking/graphics capability for superior real-time motor control precision-making each alternative optimal only within its distinct functional envelope.
Availability
R5F5651CDGFB#30 is available at Aetrix Electronics and suitable for industrial HMI, secure network gateways, medical instrumentation, smart energy meters, and automotive body electronics requiring stable component supply and long-term lifecycle assurance.
Supply support for R5F5651CDGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.
The R5F5651CDGFB#30 belongs to the RX65N Group, designed specifically for high-performance, safety-aware embedded applications demanding rich connectivity (Ethernet/CAN/SD), deterministic real-time control, and integrated graphics acceleration in resource-constrained environments.
FAQ
What is the maximum operating frequency and performance rating of the R5F5651CDGFB#30?
The R5F5651CDGFB#30 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS (Dhrystone MIPS) performance. Its RXv2 CPU core achieves this through a 5-stage pipeline, variable-length instruction encoding, and hardware multiplier/divider. The R5F5651CDGFB#30 sustains this performance with zero-wait-state access to SRAM and optimized flash cache behavior up to 50 MHz, making it suitable for real-time control and protocol processing tasks.
Does the R5F5651CDGFB#30 support dual-bank flash for safe firmware updates?
Yes, the R5F5651CDGFB#30 includes a dual-bank flash architecture that allows background programming of one bank while executing code from the other. This enables zero-downtime firmware updates and robust fail-safe recovery. The R5F5651CDGFB#30 supports bank swapping at startup, allowing validated firmware images to be activated immediately after programming-critical for industrial and medical devices requiring high availability.
What graphics capabilities does the R5F5651CDGFB#30 provide for embedded displays?
The R5F5651CDGFB#30 integrates both a Graphic-LCD Controller (GLCDC) and a 2D Drawing Engine (DRW2D). The GLCDC supports up to three overlay planes (background, graphic 1, graphic 2) and multiple pixel formats (32/16/8/4/1 bpp). The DRW2D accelerates vector drawing (lines, circles), bit-blitting (copy, stretch, rotate), and texture mapping. Together, they enable responsive GUIs on TFT panels without external graphics ICs-the R5F5651CDGFB#30 handles composition, rendering, and frame buffer management in hardware.
How does the R5F5651CDGFB#30 meet IEC60730 safety requirements for household appliances?
The R5F5651CDGFB#30 includes multiple hardware features certified for IEC60730 Class B compliance: oscillation-stop detection, CRC calculator (CRCA) for memory/data integrity, self-diagnostic A/D converter, register write protection, and a windowed independent watchdog timer (IWDT). These features allow developers to implement required safety tests without significant software overhead-the R5F5651CDGFB#30 provides deterministic, hardware-enforced fault detection essential for certification.
What is the package type and pin count of the R5F5651CDGFB#30?
The R5F5651CDGFB#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Quad Flat Package (LFBGA) with 24 × 24 mm body size and 0.5 mm pitch. It provides 136 general-purpose I/O pins (19 of which are 5-V tolerant), dedicated Ethernet, SD, CAN, and USB signal routing, and an exposed thermal pad for thermal management. This package matches the mechanical and electrical footprint of other RX65N Group MCUs in the same pin-count family.
R5F5651CDGFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5651CDGFB#30 FAQ
1.How can I place an order for R5F5651CDGFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5651CDGFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5651CDGFB#30 reliable?
The price and inventory of R5F5651CDGFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651CDGFB#30 is usually 5 days.
3.What payment methods are accepted for R5F5651CDGFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651CDGFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5651CDGFB#30?
R5F5651CDGFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5651CDGFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5651CDGFB#30?
For technical support, including R5F5651CDGFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651CDGFB#30 requirements.
6.How does Aetrix verify that R5F5651CDGFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F5651CDGFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651CDGFB#30 meets industry standards.
7.What is the process for return or replacement of R5F5651CDGFB#30?
All R5F5651CDGFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651CDGFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5651CDGFB#30 part is unused and in its original packaging.
Return procedure for R5F5651CDGFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F5651CDGFB#30 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
