Renesas R5F5651CDGFC#30

Overview

R5F5651CDGFC#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 512 KB on-chip code flash, 256 KB SRAM, integrated Ethernet MAC, dual CAN 2.0B channels, SD host/slave interfaces, and hardware AES-128/192/256 encryption. It targets industrial HMI, networked gateway controllers, and secure IoT edge nodes requiring real-time deterministic control and connectivity.

For engineers reviewing the R5F5651CDGFC#30 datasheet, R5F5651CDGFC#30 pinout, R5F5651CDGFC#30 application, or R5F5651CDGFC#30 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-A), 120 MHz system clock with PCLKA/PCLKB domain separation, dual-bank flash for safe firmware updates, 12-bit S12AD A/D converter with self-diagnostic capability, and Trusted Secure IP (TSIP) for cryptographic key management.

Technical Context

The R5F5651CDGFC#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU execution, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, GLCDC), and PCLKB up to 60 MHz for timers and analog modules.

Its peripheral subsystem includes a dedicated Ethernet controller (ETHERC) compliant with IEEE 802.3u (MII/RMII), two independent CAN modules each supporting 32 mailboxes and ISO 11898-1, and a full-featured SD host interface supporting 25 MB/s high-speed mode per SD Physical Layer Spec v3.01. The TSIP block provides hardware-accelerated AES and secure key storage independent of main memory.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array, 24 mm × 24 mm body, 0.5 mm ball pitch, lead-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651CDGFC#30, the R5F5651EDGFC#30 offers scalable memory headroom within identical footprint and security features, while the R5F5660NDDFC#30 trades TSIP for AI compute - making the former ideal for secure firmware expansion and the latter for vision-augmented control where cryptographic offload is handled externally.

Availability

R5F5651CDGFC#30 is available at Aetrix Electronics and suitable for industrial HMI, secure gateways, and networked energy meters requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature operation.

Supply support for R5F5651CDGFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for industrial, automotive, and infrastructure markets.

The RX651 Group, including R5F5651CDGFC#30, was designed for cost-optimized industrial connectivity applications requiring integrated Ethernet, CAN, SD, and hardware security - balancing performance, peripheral richness, and functional safety support (IEC 60730).

FAQ

What is the maximum operating frequency and CPU architecture of the R5F5651CDGFC#30?

The R5F5651CDGFC#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instruction set. It delivers 240 DMIPS performance and includes single-precision IEEE-754 floating-point unit, on-chip 32-bit multiplier, and divider. This architecture enables deterministic real-time response critical for industrial control loops executed on the R5F5651CDGFC#30.

Does the R5F5651CDGFC#30 support hardware encryption and secure boot?

Yes, the R5F5651CDGFC#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES-128/192/256 encryption, secure key generation, and tamper-resistant key storage. It also supports Trusted Memory (TM) to protect code flash regions from unauthorized read access, and includes a Memory Protection Unit (MPU) for runtime memory access control - collectively enabling secure boot and firmware integrity verification on the R5F5651CDGFC#30.

What package type and pin count does the R5F5651CDGFC#30 use?

The R5F5651CDGFC#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array with 24 mm × 24 mm body size and 0.5 mm ball pitch. This LFBGA package supports –40°C to +85°C operation and provides 136 general-purpose I/O pins with 5-V tolerance on 19 pins, open-drain capability, and programmable pull-up resistors - matching the mechanical and thermal requirements of the R5F5651CDGFC#30 design.

Which communication interfaces are integrated into the R5F5651CDGFC#30?

The R5F5651CDGFC#30 integrates Ethernet MAC (10/100 Mbps MII/RMII), two CAN 2.0B channels (32 mailboxes each), three RSPI interfaces, one QSPI, three I²C (RIIC) channels, 13 SCI channels (including UART, SPI, I²C emulation), SD host/slave interfaces, and MMCIF. These interfaces enable direct connection to industrial networks, sensors, displays, and storage - eliminating external bridge ICs in designs based on the R5F5651CDGFC#30.

How much on-chip memory does the R5F5651CDGFC#30 include?

The R5F5651CDGFC#30 includes 512 KB of on-chip code flash memory with dual-bank structure, 256 KB of SRAM with no wait states at 120 MHz, 32 KB of reprogrammable data flash rated for 100,000 erase cycles, and 8 KB of battery-backed standby RAM. This memory configuration supports robust firmware partitioning, real-time data buffering, and non-volatile parameter storage - all essential for reliable operation of the R5F5651CDGFC#30 in mission-critical applications.