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Renesas R5F5651CDGFM#30
- Part No.:
- R5F5651CDGFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F5651CDGFM#30.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:320
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Product details
Overview
R5F5651CDGFM#30 from Renesas is a 32-bit RXv2 microcontroller with 120 MHz CPU, single-precision IEEE-754 FPU, 240 DMIPS performance, 1 MB on-chip code flash memory, 640 KB SRAM (256 KB main + 384 KB expansion), and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI applications.
For engineers reviewing the R5F5651CDGFM#30 datasheet, R5F5651CDGFM#30 pinout, R5F5651CDGFM#30 application, or R5F5651CDGFM#30 equivalent, this MCU delivers deterministic real-time control with IEC60730 safety support, dual-bank flash for safe firmware updates, and hardware-accelerated 2D graphics rendering - critical for industrial HMIs, smart metering gateways, and networked medical devices.
Technical Context
The R5F5651CDGFM#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and MPU-enforced memory protection. It integrates dedicated clocks for subsystems: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for Ethernet/DRW2D/GLCDC, and PCLKB up to 60 MHz for ADC/DAC/timers.
Its peripheral set includes dual-channel CAN (ISO11898-1 compliant, 32 mailboxes/channel), 13 SCI channels supporting UART/SPI/I²C emulation, 3 RSPI interfaces, and a full-featured SDHI/SDSI/MMCIF stack enabling simultaneous SD card and SDIO peripheral operation - all coordinated via ELC event linking without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit, 120 MHz max - enables deterministic real-time task scheduling at sub-µs interrupt latency |
| FPU | Single-precision IEEE-754 - accelerates motor control algorithms and sensor fusion without software emulation overhead |
| Flash Memory | 1 MB dual-bank code flash - supports background programming and seamless bank switching for zero-downtime firmware updates |
| SRAM | 640 KB (256 KB + 384 KB expansion) - accommodates large frame buffers for GLCDC and DRW2D graphics pipelines |
| ADC | Two 12-bit units (8 + 21 channels) - provides high-resolution analog sensing with self-diagnostic and disconnection detection for functional safety |
| Communication | Ethernet MAC (10/100 Mbps), CAN ×2, SDHI/SDSI, QSPI ×1 - enables converged wired connectivity in edge gateway designs |
| Graphics | GLCDC + DRW2D - renders layered UIs with hardware-accelerated bit blitting, rotation, and vector drawing without CPU load |
| Package | LFBGA-176 (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) - supports high I/O count (136 GPIO) with 5-V tolerant pins for industrial interfacing |
Pinout & Package
LFBGA-176 package (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) with 136 general-purpose I/O pins, 19 of which are 5-V tolerant, plus dedicated power, clock, reset, debug (JTAG/FINE), and peripheral function pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Power supply inputs | Separate digital/analog domains enable noise isolation for precision ADC/DAC operation |
| RES# | Active-low reset input | Hardware reset initiation independent of internal voltage monitors or watchdog timeout |
| CLKIN / CLKOUT | External crystal oscillator interface | Supports 8–24 MHz crystal for precise system timing; optional PLL multiplication to 120 MHz |
| MD0 / MD1 | Mode selection pins | Determine boot source (SCI/USB/FINE) and operating mode at power-on reset |
| ETXD0–ETXD3 / ETXCK / ERXD0–ERXD3 / ERXCK | Ethernet PHY interface | MII-compliant 8-bit parallel interface for external 10/100 Mbps PHY connection |
| TXD0 / RXD0 | SCI0 asynchronous serial interface | Primary debug/console port with programmable baud rate generation and FIFO buffering |
| SD0CMD / SD0CLK / SD0D0–SD0D3 | SD host interface signals | 4-bit SD bus supporting high-speed mode (25 MB/s) for local data logging and firmware storage |
| QSPI_IO0–QSPI_IO3 / QSPI_CLK / QSPI_CS | Quad SPI interface | Direct connection to serial NOR flash for XIP execution or fast configuration storage |
Key Features
| Feature | Design Value |
|---|---|
| Trusted Secure IP (TSIP) | Hardware AES-128/192/256 acceleration with key management - enables secure boot and encrypted firmware updates |
| IEC60730 Safety Support | Oscillation-stop detection, CRC calculator (CRCA), IWDT windowing, register write protection - reduces certification effort for Class B appliances |
| Event Link Controller (ELC) | 83 internal event sources linked without CPU - enables timer-triggered ADC sampling or CAN message transmission on GPIO edge |
| Dual-Bank Flash | Independent read/write banks - allows active firmware execution while updating secondary bank, eliminating reboot downtime |
| Standby RAM | 8 KB battery-backed SRAM - retains critical state during deep software standby with RTC wake-up capability |
| Temperature Sensor | ±1°C accuracy digitized by S12AD unit 1 - enables thermal monitoring without external components |
Applications
| Industrial HMI Gateway | Smart Energy Meter Hub |
|---|---|
Use Scenario: A panel-mounted gateway aggregating Modbus RTU data from PLCs and displaying real-time metrics on a 4.3-inch TFT LCD. IC Role / Device Role / Timing Role: R5F5651CDGFM#30 serves as the central controller running FreeRTOS, driving GLCDC for UI rendering, managing CAN/SCI fieldbus communication, and executing AES-encrypted cloud telemetry uploads. Use Value: Integrated DRW2D eliminates external GPU, reducing BOM cost; dual-bank flash enables silent OTA updates without disrupting HMI operation. | Use Scenario: A DIN-rail energy meter collecting voltage/current harmonics via isolated ADCs and transmitting encrypted consumption data over Ethernet to utility SCADA systems. IC Role / Device Role / Timing Role: R5F5651CDGFM#30 executes IEC61850-compliant protocol stacks, performs harmonic analysis using FPU-accelerated FFT, and enforces cryptographic signing via TSIP before Ethernet transmission. Use Value: On-chip 12-bit ADC with self-diagnostic meets IEC62053 accuracy requirements; IEC60730 features streamline Class B certification. |
| Networked Medical Device Controller | Building Automation Edge Node |
Use Scenario: A portable ultrasound device requiring low-latency image capture from CMOS sensor, real-time beamforming, and DICOM export over wired Ethernet. IC Role / Device Role / Timing Role: R5F5651CDGFM#30 coordinates PDC for raw sensor capture, DRW2D for UI overlay, Ethernet MAC for DICOM transfer, and AES for HIPAA-compliant data encryption. Use Value: Parallel data capture unit synchronizes to external VSYNC/HSYNC, avoiding software-based frame alignment delays; 640 KB SRAM holds multiple uncompressed frames. | Use Scenario: An HVAC controller interfacing with BACnet MS/TP field devices via RS485, managing local PID loops, and reporting status via Ethernet to building management system. IC Role / Device Role / Timing Role: R5F5651CDGFM#30 runs BACnet stack on SCI ports, executes real-time temperature/humidity control using MTU3 PWM outputs, and logs events to SD card via SDHI. Use Value: Hardware CRC calculator validates BACnet frame integrity; SDHI supports hot-pluggable logging cards without filesystem corruption risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F565NEDGFM#30 | 2 MB flash, 640 KB SRAM, identical peripherals and pinout - differs only in flash capacity and part marking | Same use cases but targets larger firmware images requiring >1 MB code space | Select when firmware size exceeds 1 MB or future-proofing for feature expansion is required |
| R5F566TEBGFM#30 | Same RXv2 core, 120 MHz, but adds TrustZone-based security extension and enhanced TSIP; LFBGA-176 package | Better suited for applications requiring PSA Certified Level 2 or Common Criteria EAL4+ compliance | Choose when hardware root-of-trust, secure boot attestation, or confidential computing are mandatory |
Compared with R5F5651CDGFM#30, the R5F565NEDGFM#30 offers double flash capacity without layout change, while the R5F566TEBGFM#30 introduces TrustZone isolation and stronger cryptographic primitives - making it optimal for security-critical deployments where firmware integrity and runtime protection outweigh cost sensitivity.
Availability
R5F5651CDGFM#30 is available at Aetrix Electronics and suitable for industrial HMIs, smart metering gateways, networked medical devices, and building automation edge nodes requiring stable component supply across multi-year production cycles.
Supply support for R5F5651CDGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX651 Group - including R5F5651CDGFM#30 - was designed for high-performance, safety-certifiable industrial human-machine interfaces and networked edge controllers with integrated graphics and connectivity.
FAQ
What is the maximum operating frequency and CPU architecture of the R5F5651CDGFM#30?
The R5F5651CDGFM#30 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its CISC Harvard architecture includes a 5-stage pipeline, variable-length instructions, and support for single-precision IEEE-754 floating-point operations - enabling efficient execution of real-time control and signal processing tasks in the R5F5651CDGFM#30.
Does the R5F5651CDGFM#30 support dual-bank flash for firmware updates?
Yes, the R5F5651CDGFM#30 includes a dual-bank structure in its 1 MB on-chip code flash memory. This allows background programming of one bank while executing code from the other, enabling seamless firmware updates without system interruption - a critical capability for remote industrial devices relying on the R5F5651CDGFM#30.
What graphics capabilities does the R5F5651CDGFM#30 provide for HMI applications?
The R5F5651CDGFM#30 integrates both a Graphic-LCD Controller (GLCDC) and a 2D Drawing Engine (DRW2D). The GLCDC supports layered display output (3 planes) with multiple color depths, while DRW2D accelerates bit blitting, rotation, scaling, and vector drawing - offloading graphics rendering from the CPU and improving UI responsiveness in applications built around the R5F5651CDGFM#30.
Which safety standards does the R5F5651CDGFM#30 support for industrial certification?
The R5F5651CDGFM#30 includes hardware features aligned with IEC60730 Class B requirements: oscillation-stop detection, CRC calculator (CRCA), independent watchdog timer (IWDT) with windowing, register write protection, and self-diagnostic functions for the A/D converter. These capabilities reduce validation effort for safety-critical appliances using the R5F5651CDGFM#30.
What is the package type and pin count of the R5F5651CDGFM#30?
The R5F5651CDGFM#30 is housed in a 176-pin LFBGA package (PLQP0176KB-A, 24 × 24 mm, 0.5 mm pitch) with 136 general-purpose I/O pins - 19 of which are 5-V tolerant. This high-density package supports extensive peripheral routing for complex industrial interfaces while maintaining thermal and mechanical reliability in the R5F5651CDGFM#30 design.
R5F5651CDGFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX651
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv2
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 42
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b; D/A 1x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5651CDGFM#30 FAQ
1.How can I place an order for R5F5651CDGFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5651CDGFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5651CDGFM#30 reliable?
The price and inventory of R5F5651CDGFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651CDGFM#30 is usually 5 days.
3.What payment methods are accepted for R5F5651CDGFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651CDGFM#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5651CDGFM#30?
R5F5651CDGFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5651CDGFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5651CDGFM#30?
For technical support, including R5F5651CDGFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651CDGFM#30 requirements.
6.How does Aetrix verify that R5F5651CDGFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F5651CDGFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651CDGFM#30 meets industry standards.
7.What is the process for return or replacement of R5F5651CDGFM#30?
All R5F5651CDGFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651CDGFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5651CDGFM#30 part is unused and in its original packaging.
Return procedure for R5F5651CDGFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F5651CDGFM#30 Tags
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