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Renesas R5F5651CHDFB#10

Part No.:
R5F5651CHDFB#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR5F5651CHDFB#10.pdf
Description:
IC MCU 32BIT 1.5MB FLSH 144LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,483

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Product details

Overview

R5F5651CHDFB#10 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 120 MHz (240 DMIPS), featuring 1 MB on-chip code flash, 256 KB SRAM, single-precision IEEE-754 FPU, Ethernet MAC, dual CAN channels, and hardware AES encryption - deployed in industrial HMIs with integrated graphics and secure connectivity.

For engineers reviewing the R5F5651CHDFB#10 datasheet, R5F5651CHDFB#10 pinout, R5F5651CHDFB#10 application, or R5F5651CHDFB#10 equivalent, key selection criteria include its 176-pin LFBGA package, 120-MHz real-time performance with MPU and TSIP security, dual-bank flash for safe firmware updates, and integrated GLCDC/DRW2D for embedded display subsystems.

Technical Context

The R5F5651CHDFB#10 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) supporting eight configurable regions. It integrates dual-clock domains: ICLK up to 120 MHz for CPU/core logic, and PCLKA/PCLKB up to 120 MHz/60 MHz respectively for peripherals including ETHERC, DRW2D, and S12AD.

Its peripheral set is partitioned across clock domains and power modes: Ethernet MAC and USB 2.0 FS operate under PCLKA; A/D converters (S12AD) use dedicated PCLKC/PCLKD; RTC and IWDT run from independent low-frequency oscillators (LOCO/HOCO). The device supports IEC60730 functional safety via CRC, self-diagnostic A/D, oscillation-stop detection, and register write protection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit CISC with 5-stage pipeline, 240 DMIPS @ 120 MHz
Max Operating Frequency120 MHz system clock (ICLK); enables real-time deterministic execution
Code Flash Memory1 MB dual-bank structure; allows background programming and safe bank-swapping during operation
SRAM256 KB on-chip SRAM with zero-wait-state access at 120 MHz
Analog PeripheralsTwo 12-bit A/D units (8 + 21 channels), 2-channel 12-bit D/A, on-die temperature sensor (±1°C)
ConnectivityEthernet MAC (10/100 Mbps), 2× CAN 2.0B, 3× RSPI, 1× QSPI, 3× I²C, 13× SCI, SDHI/SDSI/MMCIF
Graphics & DisplayGraphic-LCD controller (GLCDC) with 3-plane overlay, 2D drawing engine (DRW2D) with vector/bit-blit acceleration
SecurityAES-128/192/256, Trusted Secure IP (TSIP), MPU, CRC calculator (CRCA), register write protection

Pinout & Package

Package: PLQP0176KB-A, 176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch, –40°C to +85°C (D-version).

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsSeparate analog/digital rails enable noise isolation for ADC/DAC and high-speed logic
XTAL / EXTALMain crystal oscillator interfaceSupports 8–24 MHz external resonator for precise timing and PLL reference
ETH_MDC / ETH_MDIOEthernet management interfaceIEEE 802.3-compliant MDIO/MDC for PHY configuration and status monitoring
TXD0 / RXD0SCI0 asynchronous serial interfaceFull-duplex UART channel for debug console or host communication
USB_VBUS / USB_DP / USB_DMUSB 2.0 Full-Speed transceiverIntegrated PHY supports host/function/OTG without external transceiver
GLCD_D0–D23Parallel LCD data bus24-bit RGB interface supporting up to WXGA resolution with programmable timing
DRW2D_CLK / DRW2D_RST2D drawing engine controlDedicated clock/reset signals ensure deterministic rendering engine initialization and timing

Key Features

FeatureDesign Value
Dual-bank flash memoryEnables seamless firmware updates with zero downtime via bank swap during runtime
Integrated GLCDC + DRW2DEliminates external graphics controller; supports layered UI rendering and hardware-accelerated bit-blit
TSIP + AES crypto engineHardware-accelerated encryption/decryption and secure key storage compliant with IEC60730 Class B
Event Link Controller (ELC)Direct peripheral-to-peripheral triggering without CPU intervention - reduces latency and ISR overhead
IEC60730 safety functionsIncludes CRC calculator, A/D self-test, oscillation-stop detection, and register write protection for certified designs
136 general-purpose I/O pins5-V tolerant, open-drain, pull-up configurable - simplifies level-shifting and interface to legacy industrial sensors

Applications

Industrial HMI PanelSecure Gateway Controller

Use Scenario: Embedded touch-screen interface in factory automation panels with local graphics rendering and remote diagnostics.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving TFT-LCD via GLCDC, handling EtherNet/IP stack, and managing CAN-connected PLCs.

Use Value: On-chip DRW2D accelerates UI redraws; dual-bank flash enables field-upgradable firmware without service interruption.

Use Scenario: Protocol translation node connecting Modbus RTU field devices to cloud via TLS-secured Ethernet.

IC Role / Device Role / Timing Role: Secure edge controller performing encryption (AES/TSIP), protocol conversion, and time-critical CAN/Ethernet bridging.

Use Value: Hardware crypto offloads CPU; MPU isolates communication stacks; ELC synchronizes CAN message transmission with Ethernet packet dispatch.

Medical Device UISmart Energy Meter

Use Scenario: Patient monitor with color display, touch input, and wireless telemetry using USB and SD card logging.

IC Role / Device Role / Timing Role: Real-time display controller with DRW2D-accelerated waveform overlays, SDHI-based data logging, and USB CDC for PC sync.

Use Value: 256 KB zero-wait SRAM buffers high-resolution waveforms; SDHI supports 25 MB/s high-speed logging to removable media.

Use Scenario: DIN-rail mounted meter with LCD, tamper detection, and secure firmware update over Ethernet.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC interface, RTC-corrected energy accumulation, and encrypted OTA updates.

Use Value: Temperature-compensated RTC ensures billing accuracy; dual-bank flash + TSIP prevents unauthorized firmware modification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F5651EHDFB#10Same RX651 Group, identical pinout and peripheral set, but with 2 MB flash and 640 KB SRAMRequired for larger firmware images or extended buffer needs (e.g., video streaming, complex GUI frameworks)Select when >1 MB code space or >256 KB RAM is needed; otherwise R5F5651CHDFB#10 offers optimal cost/performance balance
R5F5660NDDFB#10RX660 Group part: higher 160 MHz CPU, enhanced TSIP-Lite, no GLCDC/DRW2D, adds CAN FD supportSuitable for next-gen gateways requiring CAN FD and higher compute, but lacks integrated graphics capabilityChoose for future-proof CAN FD networks where display functionality is handled externally or omitted

Compared with R5F5651EHDFB#10, the R5F5651CHDFB#10 trades flash/SRAM capacity for lower BOM cost while retaining identical graphics, security, and connectivity features; versus R5F5660NDDFB#10, it prioritizes integrated display acceleration over raw CPU speed and CAN FD - making it optimal for cost-sensitive, graphics-rich industrial HMIs.

Availability

R5F5651CHDFB#10 is available at Aetrix Electronics and suitable for industrial HMIs, secure gateways, medical UIs, and smart energy meters requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5651CHDFB#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX651 Group - including the R5F5651CHDFB#10 - was designed for resource-constrained industrial and medical applications requiring integrated graphics, real-time connectivity, and functional safety compliance without external co-processors.

FAQ

What is the maximum operating frequency and CPU architecture of the R5F5651CHDFB#10?

The R5F5651CHDFB#10 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, delivering 240 DMIPS performance. Its CISC Harvard architecture includes a 5-stage pipeline, variable-length instructions, and support for IEEE-754 single-precision floating-point operations - all confirmed in the official R01DS0276EJ0240 datasheet Rev.2.40.

Does the R5F5651CHDFB#10 support dual-bank flash and background programming?

Yes, the R5F5651CHDFB#10 includes 1 MB of on-chip code flash organized in a dual-bank structure, enabling background programming and safe bank-swapping during runtime. This allows firmware updates without halting application execution - a key feature verified in Section 1.1 of the R01DS0276EJ0240 datasheet.

What display interfaces and graphics acceleration does the R5F5651CHDFB#10 provide?

The R5F5651CHDFB#10 integrates a Graphic-LCD Controller (GLCDC) supporting up to 24-bit RGB parallel output and a 2D Drawing Engine (DRW2D) with vector drawing and bit-blit acceleration. These enable standalone TFT-LCD driving and hardware-accelerated UI rendering - documented in Sections 1.1 and 1.7 of the R01DS0276EJ0240 datasheet.

Which security features are implemented in hardware on the R5F5651CHDFB#10?

The R5F5651CHDFB#10 includes AES-128/192/256 encryption, Trusted Secure IP (TSIP), Memory Protection Unit (MPU), CRC calculator (CRCA), and register write protection - all implemented in dedicated hardware blocks. These meet IEC60730 Class B requirements and are detailed in Sections 1.1 and 1.10 of the R01DS0276EJ0240 datasheet.

What is the package type and pin count of the R5F5651CHDFB#10?

The R5F5651CHDFB#10 uses a PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), measuring 24 × 24 mm with 0.5-mm pitch, rated for –40°C to +85°C operation. This package mapping is explicitly listed in the "Package Information" section of the R01DS0276EJ0240 datasheet.

R5F5651CHDFB#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5651CHDFB#10 FAQ

1.How can I place an order for R5F5651CHDFB#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5651CHDFB#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5651CHDFB#10 reliable?

The price and inventory of R5F5651CHDFB#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651CHDFB#10 is usually 5 days.

3.What payment methods are accepted for R5F5651CHDFB#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651CHDFB#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F5651CHDFB#10?

R5F5651CHDFB#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5651CHDFB#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5651CHDFB#10?

For technical support, including R5F5651CHDFB#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651CHDFB#10 requirements.

6.How does Aetrix verify that R5F5651CHDFB#10 is sourced from the original manufacturer or authorized distributors?

All R5F5651CHDFB#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651CHDFB#10 meets industry standards.

7.What is the process for return or replacement of R5F5651CHDFB#10?

All R5F5651CHDFB#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651CHDFB#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5651CHDFB#10 part is unused and in its original packaging.

Return procedure for R5F5651CHDFB#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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