Renesas R5F5651CHGBG#20

Overview

R5F5651CHGBG#20 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and hardware AES-128/192/256 encryption. It integrates Ethernet MAC, CAN 2.0B (2 channels), SD host/slave, QSPI, GLCDC, DRW2D, and dual 12-bit ADCs - deployed in industrial HMIs, networked gateways, and secure IoT edge controllers.

For engineers reviewing the R5F5651CHGBG#20 datasheet, R5F5651CHGBG#20 pinout, R5F5651CHGBG#20 application, or R5F5651CHGBG#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C G-grade operation, 240 DMIPS real-time performance, dual-bank flash for safe firmware updates, and integrated TSIP security IP for certified IEC60730 Class B compliance.

Technical Context

The R5F5651CHGBG#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. Its memory subsystem includes dual-bank 2 MB flash supporting background programming and bank-swapping, plus 640 KB SRAM (256 KB main + 384 KB expansion) with zero-wait access at 120 MHz.

Peripherals are clocked across four domains: ICLK (up to 120 MHz for CPU), PCLKA (120 MHz for ETHERC, AES, GLCDC), PCLKB (60 MHz for most timers and interfaces), and PCLKC/PCLKD (60 MHz for dual 12-bit ADC units). The ELC (Event Link Controller) enables direct hardware interconnection of 83 internal events - eliminating CPU intervention for time-critical signal chaining between MTU3, TPUa, and S12AD modules.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm ball pitch, lead-free, RoHS compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651EHGBG#20, the R5F5651CHGBG#20 provides 512 KB additional flash for bootloader redundancy and feature-rich firmware; versus R5F5660NDDFK#30, it trades raw CPU speed and EtherCAT for on-chip graphics and lower system BOM cost in HMI-centric designs.

Availability

R5F5651CHGBG#20 is available at Aetrix Electronics and suitable for industrial HMIs, secure gateways, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and automotive-grade thermal reliability.

Supply support for R5F5651CHGBG#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RX651 Group - including R5F5651CHGBG#20 - was designed specifically for high-integration, safety-certifiable industrial human-machine interfaces and edge-connected controllers requiring graphics, networking, and cryptographic security in a single chip.

FAQ

What is the maximum operating frequency and real-world performance of the R5F5651CHGBG#20?

The R5F5651CHGBG#20 operates at a maximum system clock frequency of 120 MHz and delivers 240 DMIPS of integer performance. Its RXv2 core achieves this with a 5-stage pipeline and variable-length instruction encoding, enabling efficient execution of real-time control loops and protocol stacks. The R5F5651CHGBG#20 sustains full performance with zero-wait-state access to SRAM and flash (when cache-hit or ≤50 MHz), making it suitable for deterministic industrial applications.

Does the R5F5651CHGBG#20 support secure boot and firmware authentication?

Yes, the R5F5651CHGBG#20 supports secure boot through its Trusted Memory (TM) function, which protects code in designated flash regions from unauthorized read access, and its Trusted Secure IP (TSIP), which provides hardware-accelerated AES encryption/decryption and secure key storage. These features enable cryptographic signature verification of firmware images and runtime integrity checks - essential for IEC60730 Class B and IEC62443-3-3 compliance. The R5F5651CHGBG#20 implements these capabilities without external co-processors.

What display interfaces and graphics capabilities does the R5F5651CHGBG#20 integrate?

The R5F5651CHGBG#20 integrates a full Graphic-LCD Controller (GLCDC) supporting RGB/TFT panels up to 800×480 resolution with triple-plane overlay (background + two graphics layers), and a dedicated 2D Drawing Engine (DRW2D) for hardware-accelerated vector rendering, bit blitting, and texture mapping. These eliminate the need for external display controllers or GPUs in HMI designs. The R5F5651CHGBG#20 drives displays directly via RGB or LVDS interfaces and manages frame buffers autonomously using its 640 KB SRAM.

Can the R5F5651CHGBG#20 operate in extended temperature ranges, and what package does it use?

Yes, the R5F5651CHGBG#20 is rated for industrial operation from –40°C to +105°C (G-version), validated across the full range for sustained reliability in harsh environments. It uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch, featuring an exposed thermal pad for efficient heat dissipation. This package is optimized for high-density PCB layouts in space-constrained industrial enclosures.

How many communication interfaces does the R5F5651CHGBG#20 support, and are they concurrent?

The R5F5651CHGBG#20 supports concurrent operation of Ethernet MAC (10/100 Mbps), dual CAN 2.0B channels (32 mailboxes each), USB 2.0 FS host/function/OTG, SD host/slave, MMCIF, three RSPI, one QSPI, three I²C, and up to 13 SCI channels - all with independent clock domains (ICLK, PCLKA, PCLKB). Its multi-channel DMACA and EXDMAC controllers enable zero-CPU-overhead data movement between peripherals and memory. The R5F5651CHGBG#20 manages these interfaces simultaneously without resource contention due to its crossbar switch architecture.