Renesas R5F5651CHGFC#30

Overview

R5F5651CHGFC#30 from Renesas is a 120-MHz 32-bit RXv2 core MCU with single-precision IEEE-754 FPU, 240 DMIPS performance, 2 MB on-chip code flash (dual-bank), 640 KB SRAM, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for industrial HMI and connected edge devices.

For engineers reviewing the R5F5651CHGFC#30 datasheet, R5F5651CHGFC#30 pinout, R5F5651CHGFC#30 application, or R5F5651CHGFC#30 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), -40°C to +105°C operating range (G-version), dual-bank flash for safe firmware updates, and hardware-accelerated AES/TSIP for secure boot and data encryption.

Technical Context

The R5F5651CHGFC#30 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and memory protection unit (MPU) supporting eight configurable regions. It integrates dual-clock domain operation: ICLK up to 120 MHz for CPU/core logic, PCLKA up to 120 MHz for high-speed peripherals (ETHERC, EDMAC, GLCDC), and PCLKB up to 60 MHz for timers, ADC, and communication interfaces.

Its peripheral set includes two independent CAN channels (ISO 11898-1 compliant, 32 mailboxes each), Ethernet MAC with RMII/MII support, SDHI/SDSI/MMCIF for removable storage, and dedicated hardware accelerators - DRW2D for 2D graphics rendering and TSIP for AES-128/192/256 encryption - all accessible via event-link controller (ELC) for CPU-offload sequencing.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, 136 general-purpose I/O pins (19 with 5-V tolerance), 1 dedicated input pin, full pull-up/open-drain support.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5651CHGFC#30, the R5F565NEDDFP#30 reduces system BOM cost by eliminating Ethernet PHY and display drivers but sacrifices integrated connectivity; the R7FA6M2AF3CFB#AA0 delivers higher computational throughput for servo algorithms but requires external components to replicate R5F5651CHGFC#30's secure edge gateway functionality.

Availability

R5F5651CHGFC#30 is available at Aetrix Electronics and suitable for industrial HMI panels, secure edge gateways, medical data loggers, and smart energy meters requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R5F5651CHGFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX65N Group - including R5F5651CHGFC#30 - was designed for industrial human-machine interfaces and secure edge connectivity, integrating high-performance CPU, rich peripheral sets, and hardware security to replace multi-chip solutions in space-constrained, safety-critical applications.

FAQ

What is the maximum operating frequency and core architecture of the R5F5651CHGFC#30?

The R5F5651CHGFC#30 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core. This core implements a CISC Harvard architecture with a 5-stage pipeline, variable-length instructions, and supports 240 DMIPS performance. It includes an IEEE-754-compliant single-precision floating-point unit, on-chip 32-bit multiplier, and divider - all confirmed in the R01DS0276EJ0240 Rev.2.40 datasheet. The R5F5651CHGFC#30 achieves deterministic real-time response through fast interrupt handling and MPU-protected memory regions.

Does the R5F5651CHGFC#30 support secure firmware updates and cryptographic operations?

Yes, the R5F5651CHGFC#30 includes Trusted Secure IP (TSIP) hardware acceleration for AES-128/192/256 encryption/decryption and key management, plus a CRC calculator (CRCA) supporting multiple polynomials for integrity verification. Its dual-bank flash architecture enables background programming and atomic bank switching - allowing verified firmware images to be written while the active bank continues execution. These features, combined with MPU-enforced memory isolation, make the R5F5651CHGFC#30 suitable for IEC60730 Class B safety certification and secure OTA updates.

What display and graphics capabilities does the R5F5651CHGFC#30 provide?

The R5F5651CHGFC#30 integrates a Graphic-LCD Controller (GLCDC) supporting three overlay planes (background, graphic 1, graphic 2), multiple pixel formats (32/16 bpp), and CLUT-based color mapping. It also includes a dedicated 2D Drawing Engine (DRW2D) that accelerates vector operations (lines, circles), bit-blit (copy/stretch/rotate), and texture mapping with run-length encoding. These blocks operate independently of the CPU and share access to external SDRAM via the 128-MB external bus interface - enabling smooth animation and low-CPU-footprint UI rendering in the R5F5651CHGFC#30.

Which communication interfaces are integrated into the R5F5651CHGFC#30 for industrial networking?

The R5F5651CHGFC#30 integrates Ethernet MAC (10/100 Mbps, RMII/MII), two ISO 11898-1-compliant CAN channels (32 mailboxes each), SD host/slave interfaces, QSPI for serial flash, three RSPI ports, three I2C buses (up to 1 Mbps), and 13 serial communication interfaces (SCIg/h/i). Its Event Link Controller (ELC) enables direct peripheral-to-peripheral triggering - for example, synchronizing CAN message reception with Ethernet frame transmission or ADC sampling with timer PWM output - reducing latency and CPU overhead in time-critical industrial protocols.

What is the package type, pin count, and temperature grade of the R5F5651CHGFC#30?

The R5F5651CHGFC#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm pitch. It is rated for the G-version industrial temperature range of –40°C to +105°C. This package provides 136 general-purpose I/O pins (19 with 5-V tolerance), dedicated power/ground balls, and optimized thermal dissipation for sustained 120 MHz operation in enclosed enclosures - matching the mechanical and environmental requirements specified for the R5F5651CHGFC#30 in Renesas documentation.