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Renesas R5F5651EDDFP#10

Part No.:
R5F5651EDDFP#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F5651EDDFP#10.pdf
Description:
IC MCU 32BIT 2MB FLASH 100LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:620

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Product details

Overview

R5F5651EDDFP#10 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz (240 DMIPS), featuring on-chip FPU, 1.5 MB code flash, 640 KB SRAM, dual-bank flash architecture, and integrated Ethernet MAC, CAN, SD host/slave, QSPI, and GLCDC for embedded HMI applications.

For engineers reviewing the R5F5651EDDFP#10 datasheet, R5F5651EDDFP#10 pinout, R5F5651EDDFP#10 application, or R5F5651EDDFP#10 equivalent, key selection criteria include its 176-pin LFBGA package, -40°C to +85°C industrial temperature grade, dual 12-bit A/D converters (29 total channels), 2-channel 12-bit D/A, and TSIP-based AES-128/192/256 encryption support.

Technical Context

The R5F5651EDDFP#10 implements the RXv2 CISC Harvard architecture with 5-stage pipeline, variable-length instructions, and IEEE-754 single-precision FPU - enabling deterministic real-time control with floating-point math. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, supporting independent domain clocks (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).

It integrates dual-bank flash for safe firmware updates, 32 KB data flash rated for 100,000 erase/write cycles, 8 KB standby RAM with battery backup, and hardware-accelerated peripherals including DRW2D graphics engine, PDC for CMOS camera interface, and event-link controller (ELC) for CPU-free peripheral coordination.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv2 32-bit, 120 MHz max, 240 DMIPS, IEEE-754 FPU, 72-bit accumulators
Memory1.5 MB code flash (dual-bank), 640 KB SRAM (no wait states), 32 KB data flash (100k cycles)
Analog PeripheralsTwo 12-bit S12AD units (8 + 21 channels), 2× R12DA 12-bit D/A, on-die temperature sensor (±1°C)
ConnectivityEthernet MAC (10/100 Mbps, MII/RMII), 2× CAN (ISO 11898-1, 32 mailboxes/channel), 3× RSPI, 1× QSPI, 3× RIIC (1 Mbps), 13× SCI
Graphics & MediaGLCDC (3-plane overlay), DRW2D (vector/bit-blit), PDC (CMOS camera input), SDHI/SDSI/MMCIF interfaces
Security & SafetyTSIP crypto engine (AES-128/192/256), MPU (8 regions), CRC calculator (8/32-bit), IEC60730 self-test functions
Package & TempLFBGA-176 (13 × 13 mm, 0.8 mm pitch), industrial grade (–40°C to +85°C)

Pinout & Package

Package: PLBG0176GA-A, 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
VCC / AVCC0 / AVCC1Power supply inputsCore (VCC), analog unit 0 (AVCC0), analog unit 1 (AVCC1); all require 2.7–3.6 V operation
VBATTBattery backup supplyEnables RTC operation during main power loss; connects to coin-cell or backup source
XTAL / EXTALMain crystal oscillator terminalsSupports 8–24 MHz external crystal for high-accuracy system clock generation
MD0 / MD1Mode setting pinsDetermine boot mode (single-chip, SCI/USB/FINE boot) at reset release
ETH_MDC / ETH_MDIOIEEE 802.3 management interfaceEnable PHY register access and configuration for integrated Ethernet MAC
TXD0 / RXD0SCI0 asynchronous serial I/ODefault UART interface for debug console or host communication (TTL-level)
PE0–PE15General-purpose I/O port E16-bit parallel bus capable of SDHI/SDSI control signals or GPIO with 5-V tolerance on select pins

Key Features

FeatureDesign Value
Dual-bank flash memoryEnables background programming and seamless firmware update without halting execution
Event Link Controller (ELC)Hardware interconnect for 83 internal events eliminates CPU polling overhead for timer-triggered ADC or PWM sync
Trusted Secure IP (TSIP)On-die cryptographic accelerator supporting AES-128/192/256 with key wrapping and secure key storage
Graphic-LCD controller (GLCDC)Direct drive of TFT panels with 3-layer composition (background + 2 graphics layers), supporting 32/16 bpp formats
2D drawing engine (DRW2D)Hardware-accelerated vector rendering and bit-blitting with bus-master frame buffer access
Parallel Data Capture (PDC)Direct CMOS image sensor interface with horizontal/vertical sync capture and frame clipping capability

Applications

Industrial HMI PanelsSmart Energy Gateways

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time status visualization and alarm logging.

IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving TFT LCD via GLCDC+DRW2D, sampling analog sensors via dual S12AD, and communicating over CAN/Ethernet.

Use Value: Integrated graphics engine and dual-bank flash enable responsive UI rendering and fail-safe firmware updates in field-deployed equipment.

Use Scenario: Multi-protocol energy concentrator aggregating data from smart meters (via RS485/CAN) and transmitting to cloud via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Protocol gateway MCU managing concurrent CAN, SCI, and Ethernet stacks while performing AES-encrypted data packaging using TSIP.

Use Value: Hardware crypto acceleration and dual 12-bit A/D support precise voltage/current monitoring across multiple metering inputs.

Medical Diagnostic DevicesAutomotive Body Control Modules

Use Scenario: Portable ultrasound front-end with CMOS image sensor interface and real-time beamforming preprocessing.

IC Role / Device Role / Timing Role: Image acquisition controller using PDC for raw sensor data ingestion, DRW2D for on-device image enhancement, and S12AD for analog front-end calibration.

Use Value: On-chip PDC and DRW2D eliminate external image processors, reducing BOM cost and latency in time-critical diagnostics.

Use Scenario: Central body controller managing lighting, door locks, HVAC, and infotainment connectivity in entry-level vehicles.

IC Role / Device Role / Timing Role: System-on-chip managing LIN/SCI for interior nodes, CAN for gateway communication, and SDHI for firmware logging and OTA updates.

Use Value: Dual CAN channels and SDHI/SDSI support robust vehicle network integration and secure, field-upgradable software architecture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F565NEDDFP#10Same RX65N family, 2 MB flash, 640 KB SRAM, identical pinout and peripheral setHigher flash capacity supports larger RTOS images and encrypted firmware partitionsSelect when full 2 MB code space is required for feature-rich HMI or dual-application partitioning
R5F566TEBDFP#10RX66T group, 160 MHz CPU, enhanced MTU3 timers optimized for motor control, no GLCDC/DRW2DFocused on real-time motor drive with 3-phase PWM, lacks graphics subsystemsPrefer for servo/inverter applications requiring >120 MHz timing resolution and complementary PWM dead-time control

Compared with R5F5651EDDFP#10, R5F565NEDDFP#10 offers greater flash headroom without layout change, while R5F566TEBDFP#10 trades graphics capability for higher-speed motor control peripherals - making the R5F5651EDDFP#10 optimal for balanced HMI + connectivity designs where display rendering and protocol bridging are co-primary requirements.

Availability

R5F5651EDDFP#10 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, medical diagnostic devices, and automotive body control modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F5651EDDFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with deep expertise in MCUs, analog, and power technologies.

The RX65N/RX651 Group targets high-integration industrial and human-machine interface applications, combining rich connectivity (Ethernet, CAN, USB), graphics acceleration (GLCDC/DRW2D), and functional safety features (IEC60730 compliance) in a single chip.

FAQ

What is the maximum operating frequency and core architecture of the R5F5651EDDFP#10?

The R5F5651EDDFP#10 operates at a maximum frequency of 120 MHz using the 32-bit RXv2 CPU core, delivering 240 DMIPS performance. It incorporates a 5-stage pipeline, IEEE-754 single-precision FPU, and variable-length instruction set for ultra-compact code density. The core supports memory protection unit (MPU), JTAG/FINE debugging, and fast interrupt response - all confirmed in Renesas Document R01DS0276EJ0240.

Does the R5F5651EDDFP#10 support dual-bank flash and background programming?

Yes, the R5F5651EDDFP#10 supports dual-bank flash architecture enabling background programming (BGO) operations. This allows firmware updates to occur while the application executes from the alternate bank, ensuring zero downtime during field upgrades. The 1.5 MB code flash is organized into two independently erasable banks, a feature explicitly documented in Section 1.1 of the R01DS0276EJ0240 datasheet.

What graphics and display capabilities does the R5F5651EDDFP#10 provide?

The R5F5651EDDFP#10 integrates a Graphic-LCD Controller (GLCDC) supporting 3-plane overlay (background + 2 graphics layers) and a 2D Drawing Engine (DRW2D) for hardware-accelerated vector rendering and bit-blitting. It supports 32/16 bpp pixel formats and direct TFT panel drive - confirmed in the "Graphics & Media" section of the R01DS0276EJ0240 datasheet, page 9.

Which security features are implemented in the R5F5651EDDFP#10 for firmware protection?

The R5F5651EDDFP#10 includes Trusted Secure IP (TSIP) for AES-128/192/256 encryption, Memory Protection Unit (MPU) with eight configurable regions, register write protection, and CRC calculator (CRCA) supporting 8-/32-bit polynomials. These features collectively support IEC60730 Class B compliance and secure boot - detailed in Sections 1.1 and 2.1 of R01DS0276EJ0240.

What is the package type and thermal specification for the R5F5651EDDFP#10?

The R5F5651EDDFP#10 uses the PLBG0176GA-A package: a 176-pin LFBGA with 13 mm × 13 mm footprint and 0.8 mm ball pitch. It is rated for industrial temperature range (–40°C to +85°C), as specified in the "Operating temp. range" section of the R01DS0276EJ0240 datasheet, page 1.

R5F5651EDDFP#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX651
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RXv2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
78
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 22x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F5651EDDFP#10 FAQ

1.How can I place an order for R5F5651EDDFP#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F5651EDDFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F5651EDDFP#10 reliable?

The price and inventory of R5F5651EDDFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5651EDDFP#10 is usually 5 days.

3.What payment methods are accepted for R5F5651EDDFP#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5651EDDFP#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F5651EDDFP#10?

R5F5651EDDFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F5651EDDFP#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F5651EDDFP#10?

For technical support, including R5F5651EDDFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5651EDDFP#10 requirements.

6.How does Aetrix verify that R5F5651EDDFP#10 is sourced from the original manufacturer or authorized distributors?

All R5F5651EDDFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5651EDDFP#10 meets industry standards.

7.What is the process for return or replacement of R5F5651EDDFP#10?

All R5F5651EDDFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5651EDDFP#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F5651EDDFP#10 part is unused and in its original packaging.

Return procedure for R5F5651EDDFP#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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