Renesas R5F5651EDGBP#20

Overview

R5F5651EDGBP#20 from Renesas is a 32-bit RXv2 microcontroller operating at up to 120 MHz, delivering 240 DMIPS with integrated single-precision IEEE-754 FPU, 2 MB on-chip code flash memory, 640 KB SRAM, and hardware AES-128/192/256 encryption. It integrates Ethernet MAC, dual CAN channels (ISO 11898-1), SD host/slave interfaces, QSPI, GLCDC, DRW2D, and 12-bit A/D and D/A converters - targeting industrial HMI, networked gateways, and secure IoT edge nodes.

For engineers reviewing the R5F5651EDGBP#20 datasheet, R5F5651EDGBP#20 pinout, R5F5651EDGBP#20 application, or R5F5651EDGBP#20 equivalent, key selection criteria include its 176-pin LFBGA package (PLQP0176KB-A), 120-MHz real-time performance with MPU and Trusted Secure IP (TSIP), dual-bank flash for safe firmware updates, and integrated peripheral set supporting deterministic Ethernet, CAN FD-capable communication, and graphics acceleration without external controllers.

Technical Context

The R5F5651EDGBP#20 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It supports little-endian or big-endian data arrangement and includes two 72-bit accumulators, a 32×32→64-bit multiplier, and a 32/32→32-bit divider with one- and two-cycle latency respectively.

Its clock system combines external crystal (8–24 MHz) and internal oscillators (LOCO/HOCO/IWDT-dedicated), with independent domain clocks: ICLK up to 120 MHz for CPU, PCLKA up to 120 MHz for ETHERC/DRW2D/GLCDC, PCLKB up to 60 MHz for most peripherals, and dedicated ADCLKs for dual 12-bit A/D units - enabling precise timing isolation across high-speed and low-power subsystems.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5651EDGBP#20, R5F565NEDFP#30 offers reduced integration and lower cost for non-graphical applications, while R7FA6M2AF3CFP#AA0 shifts focus to automotive safety and CAN FD - neither matches the R5F5651EDGBP#20's combination of Ethernet, dual CAN, GLCDC, and TSIP in a single industrial-grade package.

Availability

R5F5651EDGBP#20 is available at Aetrix Electronics and suitable for industrial HMI, secure network gateways, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.

Supply support for R5F5651EDGBP#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX65N Group - including the R5F5651EDGBP#20 - was designed for high-integration industrial edge devices requiring real-time performance, rich connectivity (Ethernet/CAN/SD), graphics capability, and hardware security (TSIP/AES) without external accelerators.

FAQ

What is the maximum operating frequency and core type of the R5F5651EDGBP#20?

The R5F5651EDGBP#20 features a 32-bit RXv2 CPU core with a maximum operating frequency of 120 MHz, achieving 240 DMIPS performance. Its Harvard architecture, 5-stage pipeline, and variable-length instruction set deliver high code density and deterministic real-time execution - critical for industrial control and protocol stack processing in the R5F5651EDGBP#20.

Does the R5F5651EDGBP#20 include hardware encryption capabilities?

Yes, the R5F5651EDGBP#20 integrates AES-128/192/256 encryption engines and the Trusted Secure IP (TSIP) module for secure key management, encrypted boot, and TLS offload. These features are implemented in dedicated hardware within the R5F5651EDGBP#20 die, enabling cryptographic operations without CPU intervention and meeting IEC 62443-3-3 security level requirements.

What package type and pin count does the R5F5651EDGBP#20 use?

The R5F5651EDGBP#20 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. This LFBGA package supports high I/O density (136 general-purpose pins), 5-V tolerant inputs, and thermal performance suited for industrial environments - confirmed in the official R5F5651EDGBP#20 datasheet Rev.2.40.

Can the R5F5651EDGBP#20 support both SD host and SD slave interfaces simultaneously?

Yes, the R5F5651EDGBP#20 integrates independent SD host interface (SDHI) and SD slave interface (SDSI) modules. SDHI supports 1-/4-bit SD/SDIO cards at up to 25 MB/s (high-speed mode), while SDSI complies with SDIO Card Specification Ver. 2.00 - allowing the R5F5651EDGBP#20 to act as both host (e.g., reading SD cards) and peripheral (e.g., functioning as an SDIO WLAN module) in the same design.

What is the role of the Event Link Controller (ELC) in the R5F5651EDGBP#20?

The Event Link Controller (ELC) in the R5F5651EDGBP#20 enables direct hardware-level interconnection of 83 internal peripheral events - such as timer compare matches, A/D conversion completions, or CAN mailbox fills - without CPU involvement. This reduces interrupt latency and frees CPU cycles, making the R5F5651EDGBP#20 ideal for time-critical industrial control tasks like synchronized PWM generation and sensor data acquisition.